公开(公告)号：US3963796A

公开(公告)日：1976-06-15

申请号：US104398

申请日：1971-01-06

申请人： Hitoshi Yokono ,  Akio Nishikawa ,  Ritsuro Tada ,  Yasuo Miyadera

发明人： Hitoshi Yokono ,  Akio Nishikawa ,  Ritsuro Tada ,  Yasuo Miyadera

IPC分类号： C08G59/52 ,  C08G45/06

CPC分类号： C08G59/52 ,  Y10S525/934

摘要： An epoxy resin composition having a remarkably improved storage stability and an excellent hardening characteristic when heated, which comprises an epoxy resin and an aromatic amino carboxylic acid or a derivative thereof as a hardener for the epoxy resin. This composition can be molded by injection molding, heretofore being deemed inapplicable to epoxy resin compositions, whereby the molded articled of epoxy resin can be produced with a high molding efficiency.

摘要翻译： 包含环氧树脂和芳香族氨基羧酸或其衍生物作为环氧树脂的硬化剂的具有显着提高的储存稳定性和优异的硬化特性的环氧树脂组合物。 该组合物可以通过注塑成型，迄今为止被认为不适用于环氧树脂组合物，由此可以以高模塑效率制造环氧树脂的模制接头。

公开(公告)号：US5569545A

公开(公告)日：1996-10-29

申请号：US365081

申请日：1994-12-28

申请人： Hitoshi Yokono ,  Haruki Yokono ,  Masahiro Mikamo ,  Ryouichi Narushima ,  Takuya Iida ,  Yasuhiro Endo

发明人： Hitoshi Yokono ,  Haruki Yokono ,  Masahiro Mikamo ,  Ryouichi Narushima ,  Takuya Iida ,  Yasuhiro Endo

IPC分类号： H05K1/09 ,  B32B15/08 ,  H05K3/38 ,  H05K3/46

CPC分类号： H05K3/384 ,  B32B15/08 ,  H05K3/386 ,  H05K2201/0133 ,  H05K2201/0355 ,  H05K2201/2063 ,  H05K2203/0723 ,  Y10T428/12569 ,  Y10T428/31696

摘要： A copper clad laminate having a bonded side ensuring powerful adhesion between the copper foil and insulating layer, without providing protrusions on the copper foil or making roughing treatment or black treatment, by designing such a configuration that the copper foil has a metal layer on the side to be bonded with the insulating layer and the metal layer and insulating layer are cross-linked with each other by chemical bonds through sulfur atoms. Further, there is provided a multilayer printed circuit board which has a bonded side ensuring a powerful adhesion of the circuit copper foil and insulating layer, by designing such a configuration that the alternating metal layers and insulating layers are cross-linked with each other by chemical bonds through sulfur atoms.

摘要翻译： 具有接合面的覆铜层压板通过设计铜箔在侧面具有金属层的结构，确保铜箔和绝缘层之间的强力粘附，而不在铜箔上提供突起或进行粗加工处理或黑色处理 与绝缘层接合，金属层和绝缘层通过硫原子的化学键彼此交联。 此外，提供了一种多层印刷电路板，其具有通过设计使得交替金属层和绝缘层通过化学物质彼此交联的结构，从而确保电路铜箔和绝缘层的强力粘合的接合侧 通过硫原子键合。

公开(公告)号：US5393406A

公开(公告)日：1995-02-28

申请号：US845942

申请日：1992-03-04

申请人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura

发明人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura

IPC分类号： H05K3/10 ,  H01L21/48 ,  H05K3/20 ,  H05K3/42 ,  H05K3/46 ,  C25D5/02

CPC分类号： H01L21/4857 ,  H05K3/423 ,  H05K3/465 ,  H05K3/4682 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/3511 ,  H05K2201/09881 ,  H05K2203/0723 ,  H05K2203/0733 ,  H05K2203/0769 ,  H05K3/107 ,  H05K3/108 ,  H05K3/205

摘要： A thin film multilayer wiring board-producing method of the present invention is intended to decrease thermal stresses developing during the formation of the multilayer construction, and also to greatly reduce the number of the steps of the process, as compared with a conventional method. A film material can be used as an insulating film of the multilayer wiring board, and is adhesively bonded to a predetermined portion. Wiring conductors are formed by electroplating. The wiring layers are repeated laminated to form the multilayer construction. A metallic film serving as an electrode is formed on one of upper and lower surfaces of a substrate, the metallic film being removed after a multilayer wiring is formed. A soluble insulating film is formed on a metallic undercoat film on the substrate, and grooves are formed in the soluble insulating film, and wiring conductors are formed in the grooves, using either electroplating or both electroplating and electroless plating. Thereafter, the soluble insulating film and the metallic undercoat film are removed. Subsequently, an insoluble insulating film is formed at those locations from which the soluble insulating film and the metallic undercoat have been removed.

摘要翻译： 本发明的薄膜多层布线板的制造方法，与以往的方法相比，旨在降低在形成多层结构时的热应力发展，并且大大减少了工艺步骤的数量。 膜材料可以用作多层布线板的绝缘膜，并且粘合到预定部分。 接线导体通过电镀形成。 重复层压布线层以形成多层结构。 用作电极的金属膜形成在基板的上表面和下表面之一上，金属膜在形成多层布线之后被去除。 在基板上的金属底涂层上形成可溶性绝缘膜，并且在可溶性绝缘膜中形成槽，并且使用电镀或电镀或无电镀两者在沟槽中形成布线导体。 然后，除去可溶性绝缘膜和金属底涂膜。 随后，在去除可溶性绝缘膜和金属底涂层的那些位置处形成不溶性绝缘膜。

公开(公告)号：US4880464A

公开(公告)日：1989-11-14

申请号：US143959

申请日：1988-01-14

申请人： Jiro Ushio ,  Osamu Miyazawa ,  Hitoshi Yokono ,  Akira Tomizawa

发明人： Jiro Ushio ,  Osamu Miyazawa ,  Hitoshi Yokono ,  Akira Tomizawa

IPC分类号： C23C18/44

CPC分类号： C23C18/44 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01047 ,  H01L2924/10253 ,  Y10T428/12396 ,  Y10T428/12528 ,  Y10T428/12611 ,  Y10T428/12826 ,  Y10T428/1284 ,  Y10T428/12889

摘要： An electroless gold plating solution comprising a thiosulfato gold(I) complex, a thiosulfate, thiourea, a pH regulator and a stabilizer. The electroless gold plating solution shows a plating rate and a plating solution stability comparable to those of conventional gold plating solutions containing cyanide ions, and requires a smaller amount of reducing agent to be used therein. Further, the electroless gold plating solution is safe because it does not contain cyanide ions.

公开(公告)号：US4544729A

公开(公告)日：1985-10-01

申请号：US623168

申请日：1984-06-22

申请人： Kazuo Nate ,  Takashi Inoue ,  Hitoshi Yokono ,  Mitsuo Ishikawa ,  Makoto Kumada

发明人： Kazuo Nate ,  Takashi Inoue ,  Hitoshi Yokono ,  Mitsuo Ishikawa ,  Makoto Kumada

IPC分类号： C08G77/48 ,  C08G77/60 ,  G03F7/075 ,  C08G77/04

CPC分类号： C08G77/60 ,  C08G77/48 ,  G03F7/0754

摘要： A photo and radiation sensitive-organopolymeric material having at least one Si--Si).sub.n bond, wherein n is an integer of from 1 to 5 has a good resistance to dry etching, a good adhesion and a good heat resistance and is useful for finer patterning with a good resolution.

摘要翻译： 具有至少一个Si-Si）n键的照片和辐射敏感有机聚合物材料，其中n为1至5的整数，具有良好的抗干蚀刻性，良好的粘附性和良好的耐热性，并且对于较细的 图案分辨率好。

公开(公告)号：US4530746A

公开(公告)日：1985-07-23

申请号：US496591

申请日：1983-05-20

申请人： Kazufumi Azuma ,  Kazuo Nate ,  Mitsuo Nakatani ,  Hitoshi Yokono ,  Takeshi Endo

发明人： Kazufumi Azuma ,  Kazuo Nate ,  Mitsuo Nakatani ,  Hitoshi Yokono ,  Takeshi Endo

IPC分类号： C08F24/00 ,  C08F2/50 ,  C08F290/00 ,  C08F299/00 ,  C08F299/02 ,  C08G65/00 ,  C08G67/00 ,  C09D4/00 ,  C09D5/00 ,  G03F7/027

CPC分类号： C08F299/024 ,  G03F7/027

摘要： A photosensitive resin composition comprising (a) 10 to 90 parts by weight of at least one polymerizable monomer of the formula: ##STR1## (R is defined in the specification), (b) 90 to 10 parts by weight of at least one compound selected from the group consisting of epoxy-acrylate resins, 1,2-polybutadiene resins, polyester resins and organopolysiloxanes, all having one or more acryloyloxy or methacryloyloxy groups in their molecular end or ends, and (c) 0.05 to 5 parts by weight of a photosensitizer based on 100 parts by weight of the sum of the components (a) and (b) shows slight shrinkage and the resulting coating film is good in adhesive properties and mechanical strength.

摘要翻译： 一种感光性树脂组合物，其包含（a）10至90重量份的至少一种下式的可聚合单体：（R在说明书中定义），（b）90至10重量份的至少一种化合物 选自在其分子末端或末端具有一个或多个丙烯酰氧基或甲基丙烯酰氧基的环氧丙烯酸酯树脂，1,2-聚丁二烯树脂，聚酯树脂和有机聚硅氧烷，以及（c）0.05至5重量份的 基于100重量份的组分（a）和（b）的总和的光敏剂显示出轻微的收缩，并且所得的涂膜具有良好的粘合性能和机械强度。

公开(公告)号：US4484796A

公开(公告)日：1984-11-27

申请号：US319986

申请日：1981-11-10

申请人： Hidemi Sato ,  Aizo Kaneda ,  Hitoshi Yokono ,  Atsuyoshi Ohashi ,  Kiyohide Miyake ,  Toshiro Kodama ,  Kiichi Suzuki

发明人： Hidemi Sato ,  Aizo Kaneda ,  Hitoshi Yokono ,  Atsuyoshi Ohashi ,  Kiyohide Miyake ,  Toshiro Kodama ,  Kiichi Suzuki

IPC分类号： G02B6/38 ,  G02B7/26

CPC分类号： G02B6/3825 ,  G02B6/3865 ,  G02B6/3863

摘要： An optical fiber connector comprising a pair of plugs, a sleeve and a pair of cap nuts which is assembled at the site where optical fibers are installed, so as to connect the optical fibers with a high degree of positional accuracy. The plugs and the sleeve are molded of a composition including a synthetic resin added with a suitable content of a filler, such as glass beads.

摘要翻译： 一种光纤连接器，其包括一对插头，套筒和一对盖帽螺母，其组装在安装光纤的位置，以便以高度的位置精度连接光纤。 塞子和套筒由包含合成树脂的组合物模制而成，所述合成树脂添加有适当含量的填料，例如玻璃珠。

公开(公告)号：US4478902A

公开(公告)日：1984-10-23

申请号：US298348

申请日：1981-09-01

申请人： Susumu Tsuzuku ,  Yasuo Hira ,  Masao Gotoh ,  Hitoshi Yokono ,  Yoshihisa Hosoe

发明人： Susumu Tsuzuku ,  Yasuo Hira ,  Masao Gotoh ,  Hitoshi Yokono ,  Yoshihisa Hosoe

IPC分类号： G03B21/60 ,  B29C44/14 ,  B32B5/18 ,  B32B5/32 ,  C08G18/48 ,  C08G18/50 ,  C08J9/12 ,  G03B21/56 ,  B32B5/14 ,  B32B5/20 ,  B32B7/12

CPC分类号： C08G18/5033 ,  B29C44/146 ,  B32B5/18 ,  C08G18/4804 ,  C08G18/482 ,  G03B21/56 ,  Y10T428/24628 ,  Y10T428/249982 ,  Y10T428/249989

摘要： A screen for projection television set comprising a foamed support and a reflective film adhered to the concave side of the support, said support having the outer layers with a high density such as 0.7 to 1.2 g/cm.sup.3 and the inner portion with a low density so as to make the density of the foamed support as a whole 0.2 to 0.5 g/cm.sup.3, has good projection properties, surface hardness with sufficiently strong support. When said support is foam molded by using a polyurethane having special polyol components, its heat resistance is remarkably increased and can be foam molded at high temperatures without deformation.

摘要翻译： 一种用于投影电视机的屏幕，包括发泡支撑体和粘附到支撑体的凹侧的反射膜，所述支撑体具有高密度的外层，例如0.7至1.2g / cm 3，密度低的内部部分 为了使发泡载体的密度整体为0.2〜0.5g / cm 3，具有良好的投影性能，表面硬度具有足够坚固的支撑。 当所述载体通过使用具有特殊多元醇组分的聚氨酯进行泡沫模塑时，其耐热性显着增加，并且可在高温下进行泡沫模塑而不变形。

公开(公告)号：US4411609A

公开(公告)日：1983-10-25

申请号：US255102

申请日：1981-04-17

申请人： Masaki Yoshii ,  Hidemi Sato ,  Aizo Kaneda ,  Masayoshi Aoki ,  Hitoshi Yokono ,  Mitsunori Oka

发明人： Masaki Yoshii ,  Hidemi Sato ,  Aizo Kaneda ,  Masayoshi Aoki ,  Hitoshi Yokono ,  Mitsunori Oka

IPC分类号： B29C45/57 ,  B29C37/00 ,  B29C45/00 ,  B29C45/77 ,  B29C1/06

CPC分类号： B29C45/77

摘要： A method of and an apparatus for molding a plastic wherein the injection pressure (transfer pressure) is switched to a holding pressure when the internal pressure of the mold cavity sensed by a pressure sensor reaches a predetermined injection pressure (transfer pressure), to initiate holding of the pressure applied to the cavity. The holding pressure is removed when the internal pressure thereof becomes zero or in accordance with the detection of a predetermined inflection point in the internal pressure which is indicative of a gate sealing point in the mold cavity or is brought to a predetermined value close to zero. The molded articles are of high precision finishes, and conservation of energy and natural resources can be achieved.

摘要翻译： 一种用于模制塑料的方法和装置，其中当由压力传感器感测的模腔的内部压力达到预定的注射压力（转移压力）时，将注射压力（转移压力）切换到保持压力，以启动保持 施加到空腔的压力。 当其内部压力变为零时，或者根据在内部压力中的预定拐点的检测来取消保持压力，该内部压力指示模腔中的浇口密封点或达到接近零的预定值。 模塑制品具有高精度的表面处理，可以实现节约能源和自然资源。

公开(公告)号：US4211686A

公开(公告)日：1980-07-08

申请号：US767322

申请日：1977-02-10

申请人： Akio Nishikawa ,  Junichi Katagiri ,  Noriyuki Kinjo ,  Hitoshi Yokono ,  Tamotsu Ikeda ,  Tsuguo Kobayashi

发明人： Akio Nishikawa ,  Junichi Katagiri ,  Noriyuki Kinjo ,  Hitoshi Yokono ,  Tamotsu Ikeda ,  Tsuguo Kobayashi

IPC分类号： C08L67/00 ,  C08K3/26 ,  C08K3/36 ,  C08K7/02 ,  C08K13/04 ,  C08L33/00 ,  C08L33/02 ,  C08L67/06 ,  C08L77/00 ,  C08K7/14

CPC分类号： C08K13/04 ,  C08K3/0033 ,  C08K3/26 ,  C08K7/14

摘要： An unsaturated polyester resin composition for use in pressure molding, which comprises an unsaturated polyester resin and fillers consisting essentially of (a) calcium carbonate powder which passes a 325 mesh sieve, (b) an inorganic mineral particulate which passes a 12 mesh sieve and is retained on a 200 mesh sieve and (c) glass fibers having a length larger than 0.2 mm, wherein the ratio by weight of (a) to (b) is within a range of from 0.3 to 10, the ratio of (a)+(b) to the unsaturated polyester resin is within a range of from 1.5 to 7, and the ratio of (c) to the total weight of the resin, calcium carbonate, silica sand and glass fiber is within a range of from 0.01 to 0.25.

摘要翻译： 一种用于加压成型的不饱和聚酯树脂组合物，其包含不饱和聚酯树脂和基本上由（a）通过325目筛的碳酸钙粉末组成的填料，（b）通过12目筛的无机矿物颗粒， 保留在200目筛上，（c）长度大于0.2mm的玻璃纤维，其中（a）〜（b）的重量比在0.3〜10的范围内，（a）+ （b）不饱和聚酯树脂在1.5〜7的范围内，（c）与树脂，碳酸钙，硅砂和玻璃纤维的总重量的比例在0.01〜0.25的范围内 。