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    WAFER PLATE AND MASK ARRANGEMENT FOR SUBSTRATE FABRICATION
    34.
    发明申请
    WAFER PLATE AND MASK ARRANGEMENT FOR SUBSTRATE FABRICATION 审中-公开
    基板制造的薄板和面板布置

    公开(公告)号：US20170062258A1

    公开(公告)日：2017-03-02

    申请号：US15284241

    申请日：2016-10-03

    Applicant: Intevac, Inc.

    Inventor： Terry Bluck ,  Aaron Zanetto ,  William Eugene Runstadler, JR. ,  Terry Pederson

    IPC: H01L21/68 ,  H01L21/677 ,  H01L21/683

    Abstract: A system for processing wafers in a vacuum processing chamber. Carrier comprising a frame having a plurality of openings, each opening configured to accommodate one wafer. A transport mechanism configured to transport the plurality of carriers throughout the system. A plurality of wafer plates configured for supporting wafers. An attachment mechanism for attaching a plurality of wafer plates to each of the carriers, wherein each of the wafer plates is attached to a corresponding position at an underside of a corresponding carrier, such that each of the wafers positioned on one of the wafer carriers is positioned within one of the plurality of opening in the carrier. Mask attached over front side of one of the plurality of opening in the carrier. Alignment stage supports wafer plate under the opening in the carrier. A camera positioned to simultaneously image the mask and the wafer.

    Abstract translation: 一种用于在真空处理室中处理晶片的系统。 载体包括具有多个开口的框架，每个开口被配置为容纳一个晶片。 一种配置成在整个系统中传送多个载体的传送机构。 配置用于支撑晶片的多个晶片板。 一种用于将多个晶片板附接到每个载体的附接机构，其中每个晶片板附接到相应载体的下侧处的对应位置，使得位于晶片载体之一上的每个晶片是 定位在载体中的多个开口中的一个内。 掩模附着在载体中的多个开口中的一个的前侧上。 对准台在载体的开口下面支撑晶片板。 定位成同时对掩模和晶片进行成像的照相机。

    METHOD FOR SPUTTERING SYSTEM AND USING COUNTERWEIGHT
    35.
    发明申请
    METHOD FOR SPUTTERING SYSTEM AND USING COUNTERWEIGHT 审中-公开
    溅射系统和使用方法

    公开(公告)号：US20160177438A1

    公开(公告)日：2016-06-23

    申请号：US15053997

    申请日：2016-02-25

    Applicant: Intevac, Inc.

    Inventor： Vinay Shah ,  Alexandru Riposan ,  Terry Bluck

    IPC: C23C14/35 ,  H01J37/34 ,  C23C14/56

    CPC classification number: C23C14/351 ,  C23C14/35 ,  C23C14/56 ,  H01J37/32779 ,  H01J37/32899 ,  H01J37/3405 ,  H01J37/3417 ,  H01J37/3452 ,  H01J37/3455 ,  H01J2237/202 ,  H01J2237/3323

    Abstract: A method for depositing material from a target onto substrates, comprising using a processing chamber; a sputtering target having length L and having sputtering material provided on front surface thereof; a magnet operable to reciprocally scan across the length L in close proximity to rear surface of the target; and a counterweight operable to reciprocally scan at same speed but opposite direction of the magnet; and moving the magnets at speeds at least several times faster than the speed of the substrates.

    Abstract translation: 一种用于将材料从靶材沉积到基板上的方法，包括使用处理室; 具有长度L并在其前表面上设置有溅射材料的溅射靶; 一个磁铁可操作以在紧邻目标的后表面的整个长度L上往复扫描; 以及配重可操作以在磁体的相同速度但相反的方向上往复扫描; 并以比基片的速度至少几倍的速度移动磁体。

    DUAL-MASK ARRANGEMENT FOR SOLAR CELL FABRICATION
    36.
    发明申请
    DUAL-MASK ARRANGEMENT FOR SOLAR CELL FABRICATION 有权
    用于太阳能电池制造的双掩模布置

    公开(公告)号：US20130276978A1

    公开(公告)日：2013-10-24

    申请号：US13866856

    申请日：2013-04-19

    Applicant: INTEVAC, INC.

    Inventor： Terry Bluck ,  Ian Latchford ,  Vinay Shah ,  Alex Riposan

    IPC: H01L31/18

    CPC classification number: H01L31/1892 ,  C23C14/042 ,  C23C14/50 ,  C23C16/042 ,  C23C16/4585 ,  H01L21/6734 ,  H01L21/67346 ,  H01L31/18

    Abstract: An arrangement for supporting substrates during processing, having a wafer carrier with a susceptor for supporting the substrate and confining the substrate to predetermined position. An inner mask is configured for placing on top of the substrate, the inner mask having an opening pattern to mask unprocessed parts of the substrate, but expose remaining parts of the substrate for processing. An outer mask is configured for placing on top of the inner mask, the outer mask having an opening that exposes the part of the inner mask having the opening pattern, but cover the periphery of the inner mask.

    Abstract translation: 一种用于在加工过程中支撑基板的装置，具有带有用于支撑基板并将基板限制在预定位置的基座的晶片载体。 内部掩模被配置为放置在基板的顶部上，内部掩模具有开口图案以掩蔽基板的未处理部分，但是暴露基板的剩余部分以进行处理。 外掩模被配置为放置在内掩模的顶部上，外掩模具有露出具有开口图案的内掩模的一部分，但覆盖内掩模的周边的开口。

    HIGH THROUGHPUT LOAD LOCK FOR SOLAR WAFERS
    37.
    发明申请
    HIGH THROUGHPUT LOAD LOCK FOR SOLAR WAFERS 有权
    用于太阳能轮的高阻力负载锁

    公开(公告)号：US20130149075A1

    公开(公告)日：2013-06-13

    申请号：US13708751

    申请日：2012-12-07

    Applicant: INTEVAC, INC.

    Inventor： Vinay Shah ,  William Runstadler, JR. ,  Kevin P. Fairbairn ,  Terry Bluck ,  Richard Henry Cooke

    IPC: H01L21/677

    CPC classification number: H01L21/67736 ,  H01L21/67126 ,  H01L21/67201 ,  H01L21/67271 ,  H01L21/67288

    Abstract: A system for transporting substrates from an atmospheric pressure to high vacuum pressure and comprising: a rough vacuum chamber having an entry valve and an exit opening; a high vacuum chamber having an entry opening, the high vacuum chamber coupled to the rough vacuum chamber such that the exit opening and the entry opening are aligned; a valve situated between the exit opening and the entry opening; a first conveyor belt provided in the rough vacuum chamber; a second conveyor provided in the high vacuum chamber; a sensing element provided in the high vacuum chamber to enable detection of broken substrates on the second conveyor; and, a mechanism provided on the second conveyor belt enabling dumping of broken substrates onto the bottom of the high vacuum chamber.

    Abstract translation: 一种用于将基板从大气压输送到高真空压力的系统，包括：具有入口阀和出口的粗真空室; 具有进入开口的高真空室，所述高真空室联接到所述粗真空室，使得所述出口和入口开口对齐; 位于出口和入口之间的阀; 设置在粗糙真空室中的第一传送带; 设置在高真空室中的第二传送器; 设置在所述高真空室中以便能够检测所述第二输送机上的破裂的基板的感测元件; 以及设置在第二传送带上的机构，其能够将破碎的基板倾倒到高真空室的底部上。

    SUBSTRATE PROCESSING SYSTEM AND METHOD
    38.
    发明申请
    SUBSTRATE PROCESSING SYSTEM AND METHOD 有权
    基板加工系统及方法

    公开(公告)号：US20130115764A1

    公开(公告)日：2013-05-09

    申请号：US13672652

    申请日：2012-11-08

    Applicant: Intevac, Inc.

    Inventor： Terry Pederson ,  Henry Hieslmair ,  Moon Chun ,  Vinay Prabhakar ,  Babak Adibi ,  Terry Bluck

    IPC: H01L21/677 ,  H01L21/265

    CPC classification number: H01L21/6833 ,  H01L21/26506 ,  H01L21/67745 ,  H01L21/6776 ,  H01L21/681 ,  H01L21/6831 ,  H01L31/1876 ,  H02N13/00 ,  Y02E10/50 ,  Y02P70/521

    Abstract: A system for processing substrates has a vacuum enclosure and a processing chamber situated to process wafers in a processing zone inside the vacuum enclosure. Two rail assemblies are provided, one on each side of the processing zone. Two chuck arrays ride, each on one of the rail assemblies, such that each is cantilevered on one rail assemblies and support a plurality of chucks. The rail assemblies are coupled to an elevation mechanism that places the rails in upper position for processing and at lower position for returning the chuck assemblies for loading new wafers. A pickup head assembly loads wafers from a conveyor onto the chuck assemblies. The pickup head has plurality of electrostatic chucks that pick up the wafers from the front side of the wafers. Cooling channels in the processing chucks are used to create air cushion to assist in aligning the wafers when delivered by the pickup head.

    Abstract translation: 用于处理衬底的系统具有真空外壳和位于处理真空外壳内的处理区中的晶片的处理室。 提供两个轨道组件，一个在处理区域的每一侧。 两个卡盘阵列，每个在一个导轨组件上，使得每个卡盘阵列悬挂在一个导轨组件上并支撑多个卡盘。 轨道组件联接到升降机构，其将轨道放置在用于处理的上部位置，并且在较低位置处返回用于装载新晶片的卡盘组件。 拾取头组件将晶片从传送器装载到卡盘组件上。 拾取头具有从晶片的前侧拾取晶片的多个静电卡盘。 处理卡盘中的冷却通道用于产生气垫，以在由拾取头传送时帮助对准晶片。

    CREATION OF DISTRIBUTED VOIDS IN THIN FILMS
    40.
    发明申请
    CREATION OF DISTRIBUTED VOIDS IN THIN FILMS 有权

    公开(公告)号：US20210355579A1

    公开(公告)日：2021-11-18

    申请号：US17306054

    申请日：2021-05-03

    Applicant: INTEVAC, INC.

    Inventor： Terry Bluck ,  Samuel D. Harkness, IV

    IPC: C23C14/58 ,  C23C14/02 ,  C23C14/04

    Abstract: A method for forming thin film layer having micro-voids therein. The method proceeds by dispersing micro-particles over the surface of a substrate. The micro particles are made of sublimable material. Then the thin film layer is formed over the surface, so as to cover the particles. The thin film is then etched back so as to expose the particles at least partially. The material of the particles is then sublimed, e.g., by heating the substrate, thereby leaving micro-voids inside the thin film layer. The micro voids can be filled or remain exposed to generate textured surface.

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