公开(公告)号：US6114192A

公开(公告)日：2000-09-05

申请号：US114997

申请日：1998-07-14

申请人： Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

发明人： Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

IPC分类号： H01L21/50 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L23/04 ,  H01L23/31 ,  H01L21/44 ,  H01L21/48

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L23/3128 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181

摘要： A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

摘要翻译： 一种半导体塑料封装，更具体地，优选的封装结构和用于制造BGA封装的方法。 树脂密封BGA封装，其中固定支撑半导体部件的支撑框架; 即IC芯片，电路板或电路膜用树脂密封，使用由上半模和下半模构成的模具，下半模具有多个突起，一个在 对应于每个外部端子的位置。 模具具有在其分割元件之间具有通风口的分隔结构。

公开(公告)号：US5811877A

公开(公告)日：1998-09-22

申请号：US829144

申请日：1997-03-31

申请人： Ichiro Miyano ,  Ikuo Kawaguchi ,  Kunio Matsumoto ,  Junichi Saeki ,  Tooru Yoshida ,  Naoya Kanda ,  Isamu Yoshida ,  Michifumi Kawai ,  Hideo Yamakura ,  Shigeharu Tsunoda ,  Ritsuro Orihashi ,  Masachika Masuda ,  Sueo Kawai

发明人： Ichiro Miyano ,  Ikuo Kawaguchi ,  Kunio Matsumoto ,  Junichi Saeki ,  Tooru Yoshida ,  Naoya Kanda ,  Isamu Yoshida ,  Michifumi Kawai ,  Hideo Yamakura ,  Shigeharu Tsunoda ,  Ritsuro Orihashi ,  Masachika Masuda ,  Sueo Kawai

IPC分类号： H01L21/50 ,  H01L21/56 ,  H01L21/70 ,  H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L25/10 ,  H01L23/48 ,  H01L25/18

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49568 ,  H01L25/105 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4826 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/3025 ,  H01L2924/3511

摘要： An ultra-thin resin molded semiconductor device of high reliability with low cost and with easy repair at time of mounting. A plurality of these semiconductor devices are stacked to provide a semiconductor module which has a higher function than semiconductor devices in the same volume, and a card type module utilizing assembled by the stacked semiconductor module is provided. In manufacturing the semiconductor module, an extremely thin lead frame and an LSI chip are directly connected together, and the mirror surface of the LSI chip is exposed by using a low viscosity epoxy resin to have a thin molding. The mirror surface is grinded to have a further thin thickness of the whole structure of the semiconductor device. A part of the lead frame is formed as a reinforcing member, a heat radiation path, a light shielding part for shielding the LSI from harmful light beams, or a positioning base for mounting a substrate. The above ultra-thin resin molded semiconductor devices are interconnected together in a stacked layout to provide a stacked semiconductor module, and to provide a card type device having a higher function.

摘要翻译： 一种超薄树脂模制半导体器件，可靠性高，成本低，安装时易于维修。 多个这些半导体器件被堆叠以提供具有比相同体积的半导体器件更高功能的半导体模块，并且提供利用由堆叠的半导体模块组装的卡型模块。 在制造半导体模块时，将极薄的引线框架和LSI芯片直接连接在一起，并且通过使用低粘度环氧树脂来暴露LSI芯片的镜面以具有薄的成型。 研磨镜面以使半导体器件的整个结构具有更薄的厚度。 引线框架的一部分形成为加强构件，散热路径，用于屏蔽LSI免受有害光束的遮光部分或用于安装基板的定位基座。 上述超薄树脂模制半导体器件以堆叠的布局互连在一起以提供堆叠的半导体模块，并且提供具有更高功能的卡型设备。

公开(公告)号：US20080061431A1

公开(公告)日：2008-03-13

申请号：US11834724

申请日：2007-08-07

申请人： Shinichi Fujiwara ,  Masahide Harada ,  Hideto Yoshinari ,  Shosaku Ishihara ,  Shiro Yamashita ,  Isamu Yoshida ,  Ukyo Ikeda

发明人： Shinichi Fujiwara ,  Masahide Harada ,  Hideto Yoshinari ,  Shosaku Ishihara ,  Shiro Yamashita ,  Isamu Yoshida ,  Ukyo Ikeda

IPC分类号： H01L23/34

CPC分类号： H01L23/3735 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L2224/26165 ,  H01L2224/26175 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/40499 ,  H01L2224/73263 ,  H01L2224/83136 ,  H01L2224/83139 ,  H01L2224/8314 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/9221 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2224/84

摘要： A semiconductor module of the present invention comprises a first conductive layer (film) and a second conductive layer (film) which are separately formed on the main surface of a packed substrate, a thermal diffusion plate connected by solder to the upper surface of the first conductive layer, a semiconductor element connected by solder to the upper surface of the thermal diffusion plate, and a lead having one end connected by solder to the second conductive layer and the other end connected by solder to the semiconductor element, wherein the outer periphery of the connected region where the semiconductor element is connected by solder to the upper surface of the thermal diffusion plate is formed with protrusion parts protruding up from the connecting region and a turning of the semiconductor element in the upper surface of the thermal diffusion plate in the solder connecting process is suppressed by the protrusion parts.

摘要翻译： 本发明的半导体模块包括在填充基板的主表面上分别形成的第一导电层（膜）和第二导电层（膜），通过焊料与第一导电层（膜）的上表面连接的热扩散板 导电层，通过焊料连接到热扩散板的上表面的半导体元件，以及引线，其一端通过焊料连接到第二导电层，另一端通过焊料连接到半导体元件，其中外周边 半导体元件通过焊料连接到热扩散板的上表面的连接区域形成有从连接区域突出的突出部分和在焊料中的热扩散板的上表面中的半导体元件的转动 连接过程被突出部分抑制。

公开(公告)号：US06662921B2

公开(公告)日：2003-12-16

申请号：US10187366

申请日：2002-07-02

申请人： Isamu Yoshida ,  Keisuke Kazuno ,  Koji Sato

发明人： Isamu Yoshida ,  Keisuke Kazuno ,  Koji Sato

IPC分类号： B62D300

CPC分类号： F16D41/067 ,  F16H25/20 ,  F16H25/2204 ,  Y10T74/18576 ,  Y10T74/18696

摘要： To provide a wheel steering apparatus capable of exhibiting a stabilized vehicle steerability without transmitting an external disturbance torque to a motor rotor even when the wheel receives an axially acting external force, this wheel steering apparatus includes a reciprocatingly movable rod 3 drivingly connected with a support member 2 for steerably supporting a wheel 1, and a ball screw mechanism 5 for reciprocatingly moving the rod 3 in response to rotation of a drive motor 4. In a rotational transmission system for transmitting rotation of the drive motor 4 to a nut member 5b of the ball screw mechanism 5, a clutch assembly 6 defining a reverse input limiting means is provided for preventing a rotar of the drive motor 4 from being rotated by the external force acting on the wheel 1. This clutch assembly 6 used is of a design wherein although rotation can be transmitted from an input shaft to an output shaft, no rotation is transmitted from the output shaft to the input shaft.

摘要翻译： 为了提供即使在车轮受到轴向作用的外力的情况下也能够显示稳定的车辆操纵性而不向外部扰动转矩传递的车轮转向装置，该车轮转向装置包括与支撑部件驱动连接的往复运动杆3 2，用于可转动地支撑车轮1;以及滚珠丝杠机构5，用于响应于驱动马达4的旋转使杆3往复运动。在用于将驱动马达4的旋转传递到螺母构件5b的旋转传动系统中 滚珠丝杠机构5，限定反向输入限制装置的离合器组件6被设置成用于防止驱动马达4的转子由于作用在车轮1上的外力而旋转。所使用的离合器组件6具有如下设计： 旋转可以从输入轴传递到输出轴，不会从输出轴向输入轴转动。

公开(公告)号：US06178839B2

公开(公告)日：2001-01-30

申请号：US09203499

申请日：1998-12-01

申请人： Isamu Yoshida ,  Masahiro Nobutomo ,  Takayuki Owada

发明人： Isamu Yoshida ,  Masahiro Nobutomo ,  Takayuki Owada

IPC分类号： F16H2524

CPC分类号： F16H25/2418 ,  F16H25/2204 ,  F16H57/0497 ,  Y10T74/19772

摘要： A plurality of balls 3 are disposed for rolling and circulation in a spiral calculation passage defined between a spiral screw groove surface 1a formed on the outer periphery of a screw shaft 1 and a spiral screw groove surface 2a formed on the inner periphery of a ball nut 2. The opposite ends of the ball nut are each formed with a seal mounting portion 2b, in which a seal member 4 made of solid lubricating composition is mounted, sealing off the ball nut 2. The ball nut 2 has lubricating grease G sealed therein.

摘要翻译： 多个滚珠3设置成在形成在螺杆轴1的外周上的螺旋形螺旋槽表面1a和形成在滚珠螺母的内周上的螺旋形螺纹槽表面2a之间的螺旋计算通道中滚动和循环 滚珠螺母的两端各自形成有密封安装部分2b，其中安装了由固体润滑剂组合物制成的密封构件4，密封球螺母2.滚珠螺母2上密封有润滑脂G 。

公开(公告)号：US4517290A

公开(公告)日：1985-05-14

申请号：US533619

申请日：1983-09-19

申请人： Susumu Iwasa ,  Isamu Yoshida ,  Koichi Kondo

发明人： Susumu Iwasa ,  Isamu Yoshida ,  Koichi Kondo

IPC分类号： C07K5/103 ,  C07K14/59 ,  C07K16/26 ,  C12N9/96 ,  G01N33/531 ,  G01N33/535 ,  G01N33/76 ,  G01N33/54 ,  A61K39/395 ,  G01N33/56

CPC分类号： C12N9/96 ,  C07K14/59 ,  C07K16/26 ,  C07K5/1008 ,  G01N33/531 ,  G01N33/535 ,  G01N33/76 ,  Y10S435/81 ,  Y10S435/961 ,  Y10S435/963 ,  Y10S435/967 ,  Y10S435/971 ,  Y10S435/975 ,  Y10S436/814 ,  Y10S530/806 ,  Y10S930/11

摘要： In an enzyme immunoassay, when a specific antibody produced by contacting a peptide essential to the formation of a specific antibody to a peptide antigen, a freeze-dried material of .beta.-D-galactosidase-enzyme conjugate or a peptide-enzyme conjugate prepared by coupling a labeling enzyme with a peptide of the general formula:H-R.sub.1 -Pro-Ser-Asp-Thr-Pro-Ile-Leu-Pro-Gln-OHwherein R.sub.1 is a peptide fragment consisting of 1 to 14 amino acid residues including Gly in the 14-position of the peptide Ala.sup.1 -Pro.sup.2 -Pro.sup.3 -Pro.sup.4 -Ser.sup.5 -Leu.sup.6 -Pro.sup.7 -Ser.sup.8 -Pro.sup.9 -Ser.sup.10 -Arg.sup.11 -Leu.sup.12 -Pro.sup.13 -Gly.sup.14 is used, a high reproducibility of the result of the enzyme immunoassay is obtained.

摘要翻译： 在酶免疫测定中，当通过将形成特异性抗体所必需的肽与肽抗原接触而产生的特异性抗体，β-D-半乳糖苷酶 - 酶偶联物的冷冻干燥物质或通过偶联制备的肽 - 酶偶联剂 具有以下通式的肽的标记酶：H-R1-Pro-Ser-Asp-Thr-Pro-Ile-Leu-Pro-Gln-OH，其中R1是由1至14个氨基酸残基组成的肽片段，包括Gly 在肽Ala1-Pro2-Pro3-Pro4-Ser5-Leu6-Pro7-Ser8-Pro9-Ser10-Arg11-Leu12-Pro13-G ly14的14位中，酶免疫测定结果的高再现性为 获得。

公开(公告)号：US08519561B2

公开(公告)日：2013-08-27

申请号：US12826409

申请日：2010-06-29

申请人： Katsunori Azuma ,  Mutsuhiro Mori ,  Michiaki Hiyoshi ,  Seiichi Hayakawa ,  Koji Sasaki ,  Isamu Yoshida

发明人： Katsunori Azuma ,  Mutsuhiro Mori ,  Michiaki Hiyoshi ,  Seiichi Hayakawa ,  Koji Sasaki ,  Isamu Yoshida

IPC分类号： B60R16/03

CPC分类号： B60L11/04 ,  B60L2200/26 ,  H01L24/28 ,  H01L24/29 ,  H01L24/48 ,  H01L25/072 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/4847 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3025 ,  H02M7/003 ,  H03K17/08148 ,  H03K2017/0806 ,  H05K7/1432 ,  Y02T10/70 ,  Y02T10/7077 ,  Y10T307/74 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power module includes an upper arm circuit unit and a lower arm circuit unit each having a power semiconductor element; an insulating substrate with the units mounted on one surface thereof; a metal base bonded onto the other surface of the substrate opposite to the one surface where the units are mounted; a first connection conductor for supplying a high potential to the upper unit from outside; a second connection conductor for supplying a low potential to the lower unit from outside; an insulating sheet interposed between the conductors; and a resin case disposed on the metal base to support the conductors, the conductors are flat conductors and laminated with the sheet sandwiched therebetween; the sheet extends from one end of the laminated structure to secure the creepage distance between the conductors; and the case is furnished with a recess for containing the laminated structure.

摘要翻译： 功率模块包括上臂电路单元和下臂电路单元，每个具有功率半导体元件; 绝缘基板，其单元安装在其一个表面上; 金属底座粘合到与安装单元的一个表面相对的基板的另一个表面上; 用于从外部向上部单元提供高电位的第一连接导体; 用于从外部向下部单元提供低电位的第二连接导体; 插入在导体之间的绝缘片; 以及设置在金属基座上以支撑导体的树脂壳体，导体是扁平导体，并且夹在其间的片材层压; 片材从层压结构的一端延伸，以确保导体之间的爬电距离; 并且壳体设置有用于容纳层压结构的凹部。

公开(公告)号：US07498671B2

公开(公告)日：2009-03-03

申请号：US11834724

申请日：2007-08-07

申请人： Shinichi Fujiwara ,  Masahide Harada ,  Hideto Yoshinari ,  Shosaku Ishihara ,  Shiro Yamashita ,  Isamu Yoshida ,  Ukyo Ikeda

发明人： Shinichi Fujiwara ,  Masahide Harada ,  Hideto Yoshinari ,  Shosaku Ishihara ,  Shiro Yamashita ,  Isamu Yoshida ,  Ukyo Ikeda

IPC分类号： H01L23/10

CPC分类号： H01L23/3735 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L2224/26165 ,  H01L2224/26175 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/40499 ,  H01L2224/73263 ,  H01L2224/83136 ,  H01L2224/83139 ,  H01L2224/8314 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/9221 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2224/84

摘要： A semiconductor module of the present invention comprises a first conductive layer (film) and a second conductive layer (film) which are separately formed on the main surface of a packed substrate, a thermal diffusion plate connected by solder to the upper surface of the first conductive layer, a semiconductor element connected by solder to the upper surface of the thermal diffusion plate, and a lead having one end connected by solder to the second conductive layer and the other end connected by solder to the semiconductor element, wherein the outer periphery of the connected region where the semiconductor element is connected by solder to the upper surface of the thermal diffusion plate is formed with protrusion parts protruding up from the connecting region and a turning of the semiconductor element in the upper surface of the thermal diffusion plate in the solder connecting process is suppressed by the protrusion parts.

摘要翻译： 本发明的半导体模块包括在填充基板的主表面上分别形成的第一导电层（膜）和第二导电层（膜），通过焊料与第一导电层（膜）的上表面连接的热扩散板 导电层，通过焊料连接到热扩散板的上表面的半导体元件，以及引线，其一端通过焊料连接到第二导电层，另一端通过焊料连接到半导体元件，其中外周边 半导体元件通过焊料连接到热扩散板的上表面的连接区域形成有从连接区域突出的突出部分和在焊料中的热扩散板的上表面中的半导体元件的转动 连接过程被突出部分抑制。

公开(公告)号：US07445455B2

公开(公告)日：2008-11-04

申请号：US11183972

申请日：2005-07-19

申请人： Takehide Yokozuka ,  Masahide Harada ,  Shiro Yamashita ,  Isamu Yoshida ,  Masahiko Asano ,  Koji Sato ,  Shuji Eguchi ,  Kaoru Uchiyama

发明人： Takehide Yokozuka ,  Masahide Harada ,  Shiro Yamashita ,  Isamu Yoshida ,  Masahiko Asano ,  Koji Sato ,  Shuji Eguchi ,  Kaoru Uchiyama

IPC分类号： H01R12/00

CPC分类号： H05K5/069 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0313 ,  H05K3/3447 ,  H05K5/0069 ,  H05K2201/0999 ,  H05K2201/10189 ,  H05K2201/10977 ,  H05K2201/2009 ,  Y10S439/935 ,  H01L2924/00

摘要： An electronic device comprises a circuit board which has a through hole and uses a resin with a glass transition temperature exceeding 150° C. as a base member, a metal casing which has an opening, and a connector which is fitted to the opening of the metal casing in which a pin of the connector is inserted into the through hole, the pin and the through hole are connected with a conductive member, and a reinforcement member for securing the connector and the board is further provided on the conductive member, thereby improving the reliability of the electronic device.

摘要翻译： 一种电子设备包括具有通孔并使用玻璃化转变温度超过150℃的树脂作为基底的电路板，具有开口的金属外壳和安装在所述开口的连接器 金属壳体，其中连接器的销插入通孔中，销和通孔与导电构件连接，并且还在导电构件上设置用于固定连接器和板的加强构件，从而改善 电子设备的可靠性。

公开(公告)号：US06991062B2

公开(公告)日：2006-01-31

申请号：US10065076

申请日：2002-09-13

申请人： Isamu Yoshida ,  Keisuke Kazuno ,  Morihisa Yoshioka

发明人： Isamu Yoshida ,  Keisuke Kazuno ,  Morihisa Yoshioka

IPC分类号： B62D5/04

CPC分类号： B62D5/0448 ,  F16H25/24 ,  F16H2025/2445

摘要： A ball screw mechanism comprises a screw shaft, a nut and balls. The nut has a cylindrical portion in the axial middle on the outer peripheral surface thereof that becomes a fitting surface for fitting in a sleeve, and small diameter step portions in the opposite axial sides on the outer peripheral surface thereof that become non-fitting surfaces not fitting in the sleeve. A portion of a wheel steering shaft is provided with the screw shaft, and a plurality of balls are disposed in a rolling way defined between a thread groove formed in the outer periphery of the screw shaft and a thread groove formed in the inner periphery of the nut.

摘要翻译： 滚珠丝杠机构包括螺杆轴，螺母和滚珠。 螺母在其外周面的轴向中央具有圆筒部，成为配合于套筒的嵌合面，在其外周面的与其外周面相反的轴向侧的小直径台阶部不成为不配合的面 装在袖子里。 轮转向轴的一部分设置有螺杆轴，并且多个滚珠以滚动方式设置，该滚珠形成在螺纹轴的外周中形成的螺纹槽和形成在螺纹轴的内周中的螺纹槽之间 坚果。