公开(公告)号：US20120187581A1

公开(公告)日：2012-07-26

申请号：US13305679

申请日：2011-11-28

申请人： Takafumi Shimada ,  Atsushi Kikuchi

发明人： Takafumi Shimada ,  Atsushi Kikuchi

IPC分类号： H01L23/48 ,  H05K1/18

CPC分类号： H01L24/49 ,  H01L23/50 ,  H01L23/5383 ,  H01L23/642 ,  H01L23/66 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/16 ,  H01L2223/6638 ,  H01L2223/6666 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/0218 ,  H05K1/024 ,  H05K2201/0191 ,  H05K2201/0715 ,  H01L2924/00 ,  H01L2224/45099

摘要： A semiconductor device includes: a board; a power wire formed on the board; a signal wire formed on the board; a ground wire formed on the board; an insulating layer covering the signal wire, the power wire and the ground wire; and a metal film formed on the insulating layer, wherein a thickness of the insulating layer covering the power wire is different from a thickness of the insulating layer covering the signal wire, and the metal film is connected to a ground potential.

摘要翻译： 半导体器件包括：板; 形成在电路板上的电源线; 形成在板上的信号线; 在板上形成的接地线; 覆盖信号线，电源线和接地线的绝缘层; 以及形成在绝缘层上的金属膜，其中覆盖电源线的绝缘层的厚度不同于覆盖信号线的绝缘层的厚度，并且金属膜连接到接地电位。

公开(公告)号：US07885065B2

公开(公告)日：2011-02-08

申请号：US12017675

申请日：2008-01-22

申请人： Sachiko Kaneko ,  Yuji Shishido ,  Takashi Mochida ,  Hideo Niikura ,  Atsushi Kikuchi ,  Makoto Chiyoda

发明人： Sachiko Kaneko ,  Yuji Shishido ,  Takashi Mochida ,  Hideo Niikura ,  Atsushi Kikuchi ,  Makoto Chiyoda

IPC分类号： H05K7/20

CPC分类号： F04D29/646 ,  F04D25/0613 ,  F04D29/668 ,  H02K5/24 ,  H02K7/14 ,  H05K7/20172

摘要： Provided is a fan motor apparatus. The fan motor apparatus includes a rotor and a stator. The rotor includes a blade. The stator includes a rotor supporting mechanism, a supporting member, and a vibration insulation member. The rotor supporting mechanism rotatably supports the rotor. The supporting member supports the rotor supporting mechanism. The vibration insulation member is provided between the rotor supporting mechanism and the supporting member. The stator is capable of regulating relative movement of the rotor supporting mechanism and the supporting member.

摘要翻译： 提供了一种风扇电动机装置。 风扇电动机装置包括转子和定子。 转子包括一个叶片。 定子包括转子支撑机构，支撑构件和隔振构件。 转子支撑机构可旋转地支撑转子。 支撑构件支撑转子支撑机构。 隔振构件设置在转子支撑机构和支撑构件之间。 定子能够调节转子支撑机构和支撑构件的相对运动。

公开(公告)号：US20090317577A1

公开(公告)日：2009-12-24

申请号：US12552227

申请日：2009-09-01

申请人： Atsushi Kikuchi ,  Ikuo Komatsu

发明人： Atsushi Kikuchi ,  Ikuo Komatsu

IPC分类号： B32B1/02 ,  B29C43/32 ,  C08G63/12

CPC分类号： B29C49/0073 ,  B29B11/12 ,  B29B2911/1402 ,  B29B2911/14026 ,  B29B2911/14033 ,  B29B2911/1404 ,  B29B2911/14053 ,  B29B2911/1406 ,  B29B2911/14066 ,  B29B2911/1408 ,  B29B2911/14093 ,  B29B2911/14106 ,  B29B2911/14113 ,  B29B2911/1412 ,  B29B2911/14133 ,  B29B2911/1414 ,  B29B2911/14213 ,  B29B2911/1422 ,  B29B2911/14226 ,  B29B2911/14313 ,  B29B2911/14326 ,  B29B2911/14328 ,  B29B2911/1433 ,  B29B2911/14331 ,  B29B2911/14333 ,  B29B2911/14335 ,  B29B2911/14336 ,  B29B2911/14337 ,  B29B2911/1444 ,  B29B2911/14466 ,  B29B2911/1498 ,  B29C43/08 ,  B29C43/34 ,  B29C43/42 ,  B29C49/02 ,  B29C49/08 ,  B29C49/22 ,  B29C2043/3433 ,  B29C2043/3466 ,  B29C2043/3689 ,  B29K2067/00 ,  B29K2105/258 ,  B29K2995/0041 ,  B29K2995/0067 ,  B29L2001/00 ,  B29L2031/7158 ,  Y10T428/1352 ,  Y10T428/1397

摘要： A preform, a method of producing the preform, and a container obtained by draw-forming the preform. The preform has at least a layer of a polyester resin and is formed by the compression-forming, wherein the time is not shorter than 300 seconds before a calorific value of isothermal crystallization of the layer of the polyester resin at 210° C. reaches a maximum value. The preform is provided suppressing the thermal decomposition of the resin at the time of forming the preform, and effectively suppressing a drop in the inherent viscosity and the formation of the acetaldehyde. Further, a biaxially drawn container is provided having excellent mechanical strength and flavor-retaining property.

摘要翻译： 预制件，制造预成型件的方法以及通过拉伸成形预成型体获得的容器。 预成型体至少具有一层聚酯树脂，并且通过压缩成形形成，其中在210℃下聚酯树脂层的等温结晶的热值达到达到之前，时间不短于300秒 最大值。 提供了预成型体，其抑制了形成预成型体时的树脂的热分解，有效地抑制了特性粘度的降低和乙醛的形成。 此外，提供具有优异的机械强度和香味保持性的双轴拉伸容器。

公开(公告)号：US20080261336A1

公开(公告)日：2008-10-23

申请号：US12081723

申请日：2008-04-21

申请人： Nobukatsu Saito ,  Masaharu Minamizawa ,  Yoshiyuki Yoneda ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Tadahiro Okamoto ,  Eiji Watanabe

发明人： Nobukatsu Saito ,  Masaharu Minamizawa ,  Yoshiyuki Yoneda ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Tadahiro Okamoto ,  Eiji Watanabe

IPC分类号： H01L21/66 ,  H01L21/56

CPC分类号： H01L21/6836 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05571 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/75315 ,  H01L2224/75755 ,  H01L2224/7598 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor device using a wiring substrate is provided which can facilitate the handling of the wiring substrate. The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.

摘要翻译： 提供一种使用布线基板制造半导体器件的方法，其可以有助于布线基板的处理。 该方法包括以下步骤：在硅基板上形成可剥离树脂层，在可剥离树脂层上形成布线基板，在布线基板上安装半导体芯片，通过密封树脂密封多个半导体芯片形成半导体器件， 半导体器件通过从密封树脂侧切割半导体器件但离开硅衬底，从硅衬底和可剥离树脂层之间的硅衬底剥离每个单独的半导体器件，并且通过形成开口 通过可剥离树脂层或通过除去可剥离树脂层。

公开(公告)号：US20080063886A1

公开(公告)日：2008-03-13

申请号：US11659833

申请日：2005-08-08

申请人： Yoshihiro Kitano ,  Atsushi Kikuchi

发明人： Yoshihiro Kitano ,  Atsushi Kikuchi

IPC分类号： C08G63/183 ,  C08J5/00

CPC分类号： B29C49/0005 ,  B29B11/12 ,  B29B2911/1402 ,  B29B2911/14026 ,  B29B2911/14033 ,  B29B2911/1404 ,  B29B2911/14106 ,  B29B2911/14213 ,  B29C31/048 ,  B29C43/003 ,  B29C2043/3466 ,  B29K2067/00 ,  C08G63/183

摘要： A polyester resin for compression molding comprising chiefly ethylene terephthalate units and having an inherent viscosity in a range of 0.6 to 1.3 dL/g, containing a diethylene glycol in an amount of smaller than 2.3 mol %, and containing a monohydroxyethyl terephthalate and a bishydroxyethyl terephthalate in a total amount of not larger than 0.005% by weight. A mass of a molten resin which is the polyester resin can be fed to a compression-molding apparatus maintaining stability for extended periods of time, featuring excellent properties for being conveyed and for enhancing the productivity.

摘要翻译： 一种用于压缩成型的聚酯树脂，其主要包括对苯二甲酸乙二醇酯单元，其特性粘度在0.6至1.3dL / g的范围内，其含有小于2.3mol％的二甘醇，并含有对苯二甲酸一羟乙酯和对苯二甲酸双羟乙酯 总量不大于0.005重量％。 作为聚酯树脂的熔融树脂的质量可以被供给到长时间保持稳定性的压缩成型设备中，具有优异的被输送性能和提高生产率。

公开(公告)号：US06995044B2

公开(公告)日：2006-02-07

申请号：US10650692

申请日：2003-08-29

申请人： Yoshiyuki Yoneda ,  Masaharu Minamizawa ,  Nobutaka Shimizu ,  Atsushi Kikuchi

发明人： Yoshiyuki Yoneda ,  Masaharu Minamizawa ,  Nobutaka Shimizu ,  Atsushi Kikuchi

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H05K1/141 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/36 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L25/0655 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00013 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19041 ,  H05K1/162 ,  H05K2201/049 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00

摘要： A manufacturing method of a semiconductor device incorporating a passive element includes the steps as follows: a redistribution board forming step forms a redistribution board incorporating the passive element on a base board; a semiconductor element mounting step mounts at least one semiconductor element formed on an opposite side surface of the redistribution board with regard to the base board; a base board separating step separates the base board from the redistribution board and exposes the other surface of the redistribution board; a redistribution board mounting step mounts the redistribution board on a package board via electrode pads exposed from the other surface of the redistribution board.

公开(公告)号：US20050108003A1

公开(公告)日：2005-05-19

申请号：US11023333

申请日：2004-12-27

申请人： Atsushi Kikuchi ,  Hiroyuki Honma ,  Kyoya Tsutsui

发明人： Atsushi Kikuchi ,  Hiroyuki Honma ,  Kyoya Tsutsui

IPC分类号： G10L19/02 ,  G06F17/14 ,  G10L19/00 ,  G10L19/032 ,  H03M7/30 ,  H04N19/40 ,  H04N19/426 ,  H04N19/60 ,  H04N19/625 ,  H04N19/80 ,  H04N19/86

CPC分类号： G06F17/147

摘要： A signal processing device and method for performing a code string transform by transforming a time series signal with a frequency band from 0 to 20 kHz from a coding system into another, wherein the arithmetic operations of MDCT and IMDCT with a limited frequency band from 0 to 15 kHz are carried out at high speed by performing computations using an FFT operation with a short tap length in the IMDCT processing operation. This allows a reduced work area and a higher speed for arithmetic operations by reducing the number of multiplications and additions when performing MDCT operations, IMDCT operation and/or transforming code strings between different coding system.

摘要翻译： 一种信号处理装置和方法，用于通过将具有0至20kHz的频带的时间序列信号从编码系统转换为另一个来执行编码串变换，其中，具有从0到...的有限频带的MDCT和IMDCT的算术运算 通过在IMDCT处理操作中使用具有短抽头长度的FFT操作进行计算，高速执行15kHz。 这允许通过在执行MDCT操作，IMDCT操作和/或在不同编码系统之间转换代码串时减少乘法和加法的次数来减少工作区域和更高的算术运算速度。

公开(公告)号：US20050104545A1

公开(公告)日：2005-05-19

申请号：US10972968

申请日：2004-10-25

申请人： Atsushi Kikuchi

发明人： Atsushi Kikuchi

IPC分类号： H02P6/18 ,  H02P6/16 ,  H02P5/06

CPC分类号： H02P6/182

摘要： A sensorless brushless motor controls a rotational speed of a rotor by sequentially energizing a plurality of excitation coils constituting a stator in accordance with a logical product between an energizing timing signal generated on the basis of a back electromotive forces and a pulse width modulation signal to control a pulse width of the pulse width modulation signal, wherein back EMF induced in the plurality of excitation coils are respectively supplied to first and second comparator circuits each having a different reference voltage, respective output signals from the first and the second comparator circuits are sampled simultaneously at a predetermined cycle, and the energizing timing signal is generated at the time of the respective output signals from the first and the second comparator circuits becoming a high-level or a low-level during the sampling. The accuracy of rotor position detection by using a back EMF is improved.

摘要翻译： 无传感器无刷电动机根据基于反电动势产生的通电定时信号与脉冲宽度调制信号之间的逻辑积顺序激励构成定子的多个励磁线圈来控制转子的转速，以控制 脉冲宽度调制信号的脉冲宽度，其中在多个激励线圈中感应的反电动势分别被提供给具有不同参考电压的第一和第二比较器电路，来自第一和第二比较器电路的相应输出信号被同时采样 并且在采样期间在来自第一和第二比较器电路的各个输出信号变为高电平或低电平时产生激励定时信号。 通过使用反电动势进行转子位置检测的精度得到改善。

公开(公告)号：US06875638B2

公开(公告)日：2005-04-05

申请号：US10100011

申请日：2002-03-19

申请人： Yoshiyuki Yoneda ,  Masaharu Minamizawa ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Masaru Nukiwa ,  Osamu Yamaguchi ,  Yasunori Fujimoto ,  Takumi Ihara ,  Muneharu Morioka ,  Yukihiro Kuriki ,  Masaki Uchida

发明人： Yoshiyuki Yoneda ,  Masaharu Minamizawa ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Masaru Nukiwa ,  Osamu Yamaguchi ,  Yasunori Fujimoto ,  Takumi Ihara ,  Muneharu Morioka ,  Yukihiro Kuriki ,  Masaki Uchida

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L21/68 ,  H01L23/36 ,  H01L23/498 ,  H01L25/065 ,  H05K1/14 ,  H05K1/16 ,  H01L21/44

CPC分类号： H05K1/141 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/36 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L25/0655 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00013 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19041 ,  H05K1/162 ,  H05K2201/049 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00

摘要： A manufacturing method of a semiconductor device incorporating a passive element includes the steps as follows: a redistribution board forming step forms a redistribution board incorporating the passive element on a base board; a semiconductor element mounting step mounts at least one semiconductor element formed on an opposite side surface of the redistribution board with regard to the base board; a base board separating step separates the base board from the redistribution board and exposes the other surface of the redistribution board; a redistribution board mounting step mounts the redistribution board on a package board via electrode pads exposed from the other surface of the redistribution board.

摘要翻译： 包含无源元件的半导体器件的制造方法包括以下步骤：再分布板形成步骤在基板上形成包含无源元件的再分布板; 半导体元件安装步骤安装相对于基板在形成在再分布板的相对侧表面上的至少一个半导体元件; 基板分离步骤将基板与再分布板分离并暴露再分布板的另一个表面; 再分布板安装步骤通过从再分布板的另一表面暴露的电极焊盘将再分布板安装在封装板上。

公开(公告)号：US06794273B2

公开(公告)日：2004-09-21

申请号：US10331560

申请日：2002-12-31

申请人： Nobukatsu Saito ,  Masaharu Minamizawa ,  Yoshiyuki Yoneda ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Tadahiro Okamoto ,  Eiji Watanabe

发明人： Nobukatsu Saito ,  Masaharu Minamizawa ,  Yoshiyuki Yoneda ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Tadahiro Okamoto ,  Eiji Watanabe

IPC分类号： H01L2178

CPC分类号： H01L21/6836 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05571 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/75315 ,  H01L2224/75755 ,  H01L2224/7598 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor device using a wiring substrate is provided which can facilitate the handling of the wiring substrate. The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.