公开(公告)号：US20090320270A1

公开(公告)日：2009-12-31

申请号：US12525019

申请日：2007-03-15

申请人： Naoki Ishikawa ,  Hidehiko Kira ,  Kimio Nakamura ,  Takayoshi Matsumura

发明人： Naoki Ishikawa ,  Hidehiko Kira ,  Kimio Nakamura ,  Takayoshi Matsumura

IPC分类号： B23P11/00 ,  B25B27/00

CPC分类号： G11B5/4833 ,  Y10T29/49908 ,  Y10T29/53961

摘要： There are provided a method of assembling a carriage assembly that can uniformly crimp edge portions of spacer holes of spacer portions and keep the spacer portions flat, thereby maintaining the angles of suspensions with high accuracy, and an assembling apparatus that uses such method.The method includes an attaching step of positioning spacer holes 12b of suspensions 12 on through-holes 10a formed in front end portions of a plurality of carriage arms 10 that have been disposed in parallel and attaching the suspensions to the respective carriage arms; and a crimping step of pressing a ball 20 with a diameter that is equal to or larger than an inner diameter of the spacer holes 12b using a pressing member 40 so as to pass the ball successively through the spacer holes 12b and thereby crimp spacer hole 12b edge portions of the spacer portions 12a and attach the suspensions 12 to the carriage arms 10, wherein during the crimping step, the ball 20 is placed in a vicinity of the center axis a at least when the ball 20 is located between the carriage arms 10.

摘要翻译： 提供了一种组装支架组件的方法，其可以均匀地压接间隔件部分的间隔孔的边缘部分并且使间隔部分保持平坦，从而以高精度保持悬架的角度，以及使用这种方法的组装装置。 该方法包括将悬架12的间隔孔12b定位在形成在已经平行布置的多个托架臂10的前端部的通孔10a上并将悬架附接到相应的托架臂上的安装步骤; 以及使用按压部件40按压直径等于或大于间隔孔12b的内径的球20的压接步骤，以使球连续通过间隔孔12b，从而压接间隔孔12b 间隔部分12a的边缘部分并将悬架12附接到托架臂10，其中在压接步骤期间，至少当球20位于托架臂10之间时，将球20放置在中心轴线a附近 。

公开(公告)号：US07486191B2

公开(公告)日：2009-02-03

申请号：US11378623

申请日：2006-03-20

申请人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Takayoshi Matumura

发明人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Takayoshi Matumura

IPC分类号： G08B13/14

CPC分类号： G06K19/07749 ,  G06K19/077 ,  G06K19/07728 ,  H01Q1/2208 ,  H01Q9/16 ,  Y10T156/10 ,  Y10T156/1754

摘要： The present invention relates to an RFID tag performing exchange of information with an external device without contact, and is to improve the resistance to bending while avoiding an increase in the thickness of the RFID tag. A circuit chip is bonded to a base portion of a base with a thermosetting adhesive. The base is folded, and an ultraviolet curing adhesive is applied on the circuit chip. The fold-back portions of the base are folded back onto the circuit chip, to which portions ultraviolet light is irradiated, as a result, both of the surfaces of the circuit chip are bonded to the base with the adhesives.

摘要翻译： RFID标签技术领域本发明涉及RFID标签，其与外部设备进行信息交换而不接触，并且提高耐弯曲性，同时避免RFID标签的厚度增加。 电路芯片用热固性粘合剂粘合到基底的基部。 折叠底座，并在电路芯片上施加紫外线固化粘合剂。 将基座的折回部分折回到电路芯片上，照射部分紫外线，结果，电路芯片的两个表面都用粘合剂粘合到基底上。

公开(公告)号：US07317395B2

公开(公告)日：2008-01-08

申请号：US11091935

申请日：2005-03-29

申请人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi

发明人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi

IPC分类号： G08B13/14

CPC分类号： H01L23/13 ,  G06K19/07749 ,  G06K19/0775 ,  H01L23/49855 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/10165 ,  H01L2224/1134 ,  H01L2224/13016 ,  H01L2224/13019 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01Q1/2208 ,  H01Q1/36 ,  H01Q7/00 ,  Y10T29/49018 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention provides a radio frequency identification (RFID) tag which exchanges information with an external device in a noncontact manner, in which a paste is used as a material for an antenna, and which is designed to avoid the problem due to swelling of the paste caused by a pressing force from bumps of an IC chip. A paste escape recess is provided in which part of the paste provided to form the antenna is caused to flow therein by the pressure received from the bumps when the IC chip with the bumps is connected to the antenna.

摘要翻译： 本发明提供了一种射频识别（RFID）标签，其以非接触方式与外部设备交换信息，其中使用糊料作为天线的材料，并且被设计为避免由于 由IC芯片的凸块的压力引起的糊状物。 提供了一种糊状逃逸凹部，其中当具有凸起的IC芯片连接到天线时，通过从凸起接收的压力使得设置成形成天线的浆料的一部分流入其中。

公开(公告)号：US20070281395A1

公开(公告)日：2007-12-06

申请号：US11822978

申请日：2007-07-11

申请人： Hidehiko Kira ,  Masanao Fujii ,  Naoki Ishikawa

发明人： Hidehiko Kira ,  Masanao Fujii ,  Naoki Ishikawa

IPC分类号： H01L21/58

CPC分类号： H01L21/6835 ,  H01L24/11 ,  H01L24/29 ,  H01L24/83 ,  H01L24/90 ,  H01L24/95 ,  H01L25/50 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/78302 ,  H01L2224/81907 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/0781 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48

摘要： A fabrication method of a semiconductor device is disclosed. The method includes the following steps. First, a given number of projection electrodes are formed on each of a given number of semiconductor chips, and a thermosetting insulating adhesive is applied to areas of mounting parts where the semiconductor chips are to be mounted on a substrate. Second, the thermosetting insulating adhesive on the substrate is heated with a half-thermosetting temperature. Third, the semiconductor chips are aligned to the mounting parts of the substrate and a first fixing of the semiconductor chips is performed with a first pressure. Fourth, the substrate, on which the semiconductor chips are fixed, is heated with a thermosetting temperature of the thermosetting insulating adhesive, and a second fixing of the semiconductor chips is performed with a second pressure.

摘要翻译： 公开了一种半导体器件的制造方法。 该方法包括以下步骤。 首先，在给定数量的半导体芯片的每一个上形成给定数量的投影电极，并且将热固性绝缘粘合剂施加到将要安装半导体芯片的安装部分的区域上。 其次，将半固化温度加热基板上的热固性绝缘粘合剂。 第三，将半导体芯片与衬底的安装部分对准，并且以第一压力进行半导体芯片的第一固定。 第四，将半导体芯片固定在其上的基板用热固性绝缘粘合剂的热固化温度加热，并且用第二压力进行半导体芯片的第二固定。

公开(公告)号：US20070180673A1

公开(公告)日：2007-08-09

申请号：US11444292

申请日：2006-05-31

申请人： Hiroshi Kobayashi ,  Hidehiko Kira ,  Naoki Ishikawa ,  Takayoshi Matsumura

发明人： Hiroshi Kobayashi ,  Hidehiko Kira ,  Naoki Ishikawa ,  Takayoshi Matsumura

IPC分类号： B23P11/00 ,  B21D39/00

CPC分类号： B23P11/005 ,  B21D39/032 ,  B21J5/006 ,  B21K25/00 ,  Y10T29/49764 ,  Y10T29/49771 ,  Y10T29/49774 ,  Y10T29/49908

摘要： There is provided a method of assembling a carriage assembly that can crimp suspensions to carriage arms by applying ultrasonic vibration to a crimping tool without causing deformation of the suspensions and the like. The method of assembling a carriage assembly aligns attachment holes provided in front ends of carriage arms and crimping portions provided on suspensions to set the suspensions on the carriage arms and then presses a metal ball through crimping holes provided in the crimping portions while applying ultrasonic vibration to a crimping tool to crimp the suspensions to the carriage arms. The suspensions are crimped to the carriage arms by detecting stress that acts on the crimping tool when the metal ball is pressed in by the crimping tool and controlling the amplitude of the ultrasonic vibration applied to the crimping tool so as to increase and decrease in accordance with the magnitude of the stress.

摘要翻译： 提供了一种组装滑架组件的方法，其可以通过对压接工具施加超声振动而不会引起悬架等的变形而将悬架压紧到滑架臂。 组装滑架组件的方法将设置在滑架臂的前端的设置孔和设置在悬架上的压接部对准，以将悬架设置在滑架臂上，然后通过设置在压接部中的压接孔将金属球压入同时施加超声波振动 压接工具，以将悬架压紧到托架臂上。 通过检测当金属球被压接工具压入时作用在压接工具上的应力，并且控制施加到压接工具的超声波振动的振幅以按照 压力的大小。

公开(公告)号：US06787925B2

公开(公告)日：2004-09-07

申请号：US09805559

申请日：2001-03-14

申请人： Kazuhisa Tsunoi ,  Hidehiko Kira ,  Shunji Baba ,  Akira Fujii ,  Toshihiro Kusagaya ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

发明人： Kazuhisa Tsunoi ,  Hidehiko Kira ,  Shunji Baba ,  Akira Fujii ,  Toshihiro Kusagaya ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

IPC分类号： H01L2348

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L24/11 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81001 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/00

摘要： A method of mounting a semiconductor device having bumps on a board having pads so that each of the bumps is joined to a corresponding one of the pads is provided. Adhesive to be hardened by heat is provided between the semiconductor device and the board. The method includes the steps of pressing the bumps of the semiconductor device on the pads of the board, and heating a portion in which each of the bumps and a corresponding one of the pads are in contact with each other. A pressure of the bumps to the pads reaches a predetermined value before a temperature of the adhesive to which heat is supplied in the above step reaches a temperature at which the adhesive is hardened.

摘要翻译： 提供了一种将具有凸块的半导体器件安装在具有焊盘的板上，使得每个凸起接合到相应的一个焊盘的方法。 在半导体器件和电路板之间提供通过加热硬化的粘合剂。 该方法包括以下步骤：将半导体器件的凸起按压在板的焊盘上，并且加热其中每个凸块和相应的一个焊盘彼此接触的部分。 在上述步骤中供应热量的粘合剂的温度达到粘合剂硬化的温度之前，焊盘的凸块的压力达到预定值。

公开(公告)号：US09224888B2

公开(公告)日：2015-12-29

申请号：US13992015

申请日：2011-12-01

申请人： Hiroshi Hashigami ,  Naoki Ishikawa ,  Takenori Watabe ,  Hiroyuki Otsuka

发明人： Hiroshi Hashigami ,  Naoki Ishikawa ,  Takenori Watabe ,  Hiroyuki Otsuka

IPC分类号： H01L31/0224 ,  H01L31/068

CPC分类号： H01L31/022433 ,  H01L31/02167 ,  H01L31/022425 ,  H01L31/068 ,  Y02E10/547

摘要： A solar cell has a passivation film formed on a crystalline silicon substrate that has at least a p-n junction, and an electrode formed by printing and heat-treating a conductive paste. The solar cell has a first electrode comprising an extraction electrode, which extracts photogenerated carriers from the silicon substrate, formed so as to contact the silicon substrate and a second collector electrode, which collects the carriers collected at the extraction electrode, formed so as to contact the first electrode. Other than the point of contact between the first electrode and the second electrode, at least, the second electrode contacts the silicon substrate only partially or not at all. By leaving the passivation film between the collector electrode and the silicon, either completely or partially, the solar cell reduces charge losses at electrode/silicon interfaces, improves the short-circuit current and open voltage, and yields improved characteristics.

摘要翻译： 太阳能电池具有形成在至少具有p-n结的晶体硅衬底上的钝化膜，以及通过印刷和热处理导电膏形成的电极。 所述太阳能电池具有包括提取电极的第一电极，所述第一电极从所述硅衬底提取形成为接触所述硅衬底的光生载流子和收集在所述引出电极处收集的载流子的第二集电极，所述第二集电极形成为接触 第一个电极。 除了第一电极和第二电极之间的接触点之外，至少第二电极仅部分地或者根本不接触硅衬底。 通过将钝化膜完全或部分地放置在集电极和硅之间，太阳能电池降低电极/硅界面处的电荷损失，改善短路电流和开路电压，并产生改善的特性。

公开(公告)号：US08770073B2

公开(公告)日：2014-07-08

申请号：US12907911

申请日：2010-10-19

申请人： Yasuo Fukatsu ,  Hitoshi Kato ,  Naoki Ishikawa

发明人： Yasuo Fukatsu ,  Hitoshi Kato ,  Naoki Ishikawa

IPC分类号： B26D1/00 ,  B26F1/14

CPC分类号： B26D5/28 ,  B26D5/16 ,  B26F1/0092 ,  B26F1/12 ,  G03G15/6582 ,  G03G2215/00818 ,  Y10T83/04 ,  Y10T83/148 ,  Y10T83/8831 ,  Y10T83/8843 ,  Y10T83/9423 ,  Y10T83/944 ,  Y10T83/9447

摘要： A sheet punching apparatus capable of improving the accuracy of movement distance of a movable member and maintaining the durability of a drive unit of the apparatus. A sheet post-processing apparatus controller computes a time period corresponding to an amount of overrun of a slider at the time of stopping the slider in an initial operation. In a punching operation, the sheet post-processing apparatus controller starts a punch motor at a timing earlier by the computed time period corresponding to the amount of overrun than a stop timing of a conveyance motor.

摘要翻译： 一种能够提高可动构件的移动距离的精度并保持装置的驱动单元的耐久性的片材冲孔装置。 片材后处理装置控制器计算在初始操作中停止滑块时与滑块的超限量相对应的时间段。 在冲压操作中，片材后处理装置控制器在与输送电动机的停止时刻相比超过计算的时间段更早的时间开始打孔电动机。

公开(公告)号：US08766089B2

公开(公告)日：2014-07-01

申请号：US13559813

申请日：2012-07-27

申请人： Naoki Ishikawa ,  Satoyuki Ojima ,  Hiroyuki Ohtsuka ,  Takenori Watabe ,  Shigenori Saisu ,  Toyohiro Ueguri

发明人： Naoki Ishikawa ,  Satoyuki Ojima ,  Hiroyuki Ohtsuka ,  Takenori Watabe ,  Shigenori Saisu ,  Toyohiro Ueguri

IPC分类号： H01L31/00 ,  H05K3/24 ,  H01L31/0224

CPC分类号： H05K3/248 ,  H01L31/022425 ,  H05K1/092 ,  H05K2201/0338 ,  H05K2203/1476 ,  Y02E10/50

摘要： A semiconductor substrate having an electrode formed thereon, the electrode including at least silver and glass frit, the electrode including: a multi-layered structure with a first electrode layer joined directly to the semiconductor substrate, and an upper electrode layer formed of at least one layer and disposed on the first electrode layer. The upper electrode layer is formed by firing a conductive paste having a total silver content of 75 wt % or more and 95 wt % or less, the content of silver particles having an average particle diameter of 4 μm or greater and 8 μm or smaller with respect to the total silver content in the upper electrode layer being higher than that in the first electrode layer.

摘要翻译： 一种其上形成有电极的半导体衬底，所述电极至少包括银和玻璃料，所述电极包括：具有直接连接到所述半导体衬底的第一电极层的多层结构，以及由至少一个 并设置在第一电极层上。 上电极层通过烧结总银含量为75重量％以上且95重量％以下的导电性糊料形成，平均粒径为4μm以上且8μm以下的银粒子的含量与 相对于上电极层中的总银含量高于第一电极层中的总银含量。

公开(公告)号：US08613435B2

公开(公告)日：2013-12-24

申请号：US13417584

申请日：2012-03-12

申请人： Hitoshi Kato ,  Naoki Ishikawa ,  Yasuo Fukatsu ,  Tomoharu Sato

发明人： Hitoshi Kato ,  Naoki Ishikawa ,  Yasuo Fukatsu ,  Tomoharu Sato

IPC分类号： B31F1/10

CPC分类号： B65H45/18 ,  B65H2701/13212 ,  B65H2801/27

摘要： A folding line is pressed using both a first and second pressing members of press roller pairs. Further, positions of the first and second pressing members are shifted from each other. When the number of the sheets included in a booklet is a predetermined number or less, the folding line is pressed by only the first pressing member. When the number of the sheets is more than the predetermined number, the folding line is pressed by both the first and second pressing members.

摘要翻译： 使用压辊对的第一和第二按压构件压制折叠线。 此外，第一和第二按压构件的位置彼此偏移。 当包含在小册子中的片材的数量是预定数量或更小时，折叠线仅由第一按压部件按压。 当纸张的数量大于预定数量时，折叠线被第一和第二按压部件都按压。