公开(公告)号：US20230402354A1

公开(公告)日：2023-12-14

申请号：US18249005

申请日：2021-10-01

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA ,  Yoshizo OSUMI ,  Tomohira KIKUCHI ,  Shingo MATSUMARU

IPC: H01L23/495 ,  H01L23/31 ,  H01L25/18 ,  H01L23/00

CPC classification number: H01L23/49575 ,  H01L23/3121 ,  H01L25/18 ,  H01L24/48 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48456 ,  H01L2224/48091 ,  H01L23/49555 ,  H01L2224/4846

Abstract: A semiconductor device includes a conductive support member with first and second die pads, a first semiconductor element on the first die pad, a second semiconductor element on the second die pad for forming a first output-side circuit, and a sealing resin. The first semiconductor element includes a circuit part forming an input-side circuit, and an insulating part that transmits a signal between the input-side and the first output-side circuits, while providing electrical insulation between the input-side and the first output-side circuits. The sealing resin includes first and second side faces spaced apart in an x direction and a third side face perpendicular to a y direction. The conductive support member includes input-side terminals protruding from the first side face and first output-side terminals protruding from the second side face. The conductive support member is not exposed on the third side face.

公开(公告)号：US20220077037A1

公开(公告)日：2022-03-10

申请号：US17465984

申请日：2021-09-03

Applicant: ROHM CO., LTD.

Inventor： Yoshizo OSUMI ,  Hiroaki MATSUBARA ,  Tomohira KIKUCHI

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065

Abstract: A semiconductor device includes a conductive support member, a first semiconductor element, and a second semiconductor element. The conductive support member includes a first die pad and a second die pad separated from each other in a first direction. The first die pad and the second die pad overlap each other when viewed along the first direction. The first die pad has a first main surface mounting the first semiconductor element, and a first back surface opposing the first main surface. The second die pad has a second main surface mounting the second semiconductor element, and a second back surface opposing the second main surface. When viewed along a second direction, a distance in the first direction between the first back surface and the second back surface is larger than a distance in the first direction between the first main surface and the second main surface.

公开(公告)号：US20220077034A1

公开(公告)日：2022-03-10

申请号：US17465936

申请日：2021-09-03

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor device includes a first die pad, a second die pad, a first semiconductor element, a second semiconductor element, an insulating element, first terminals, second terminals, and a sealing resin. The sealing resin has a first side surface located on one side of a first direction, a second side surface located on the other side of the first direction, and third and fourth side surfaces that are separated from each other in a second direction orthogonal to both a thickness direction and the first direction and are connected to the first and second side surfaces. A first gate mark having a surface roughness larger than the other regions of the third side surface is formed on the third side surface. When viewed along the second direction, the first gate mark overlaps a pad gap provided between the first die pad and the second die pad in the first direction.

公开(公告)号：US20180331025A1

公开(公告)日：2018-11-15

申请号：US16045342

申请日：2018-07-25

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA ,  Yasumasa KASUYA

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49575 ,  H01L21/48 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49531 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05014 ,  H01L2224/05554 ,  H01L2224/0612 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49109 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/207 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.

公开(公告)号：US20160007464A1

公开(公告)日：2016-01-07

申请号：US14789233

申请日：2015-07-01

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA ,  Yasumasa KASUYA ,  Taro NISHIOKA

IPC: H05K1/18 ,  H01L23/00 ,  H01L23/544 ,  H01L23/31

CPC classification number: H01L24/32 ,  H01L21/4828 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/544 ,  H01L23/564 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/54486 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05639 ,  H01L2224/06155 ,  H01L2224/29139 ,  H01L2224/29239 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29499 ,  H01L2224/32013 ,  H01L2224/32105 ,  H01L2224/32106 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83439 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/05442 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/207

Abstract: An electronic device includes an electronic element, a plurality of first sub-electrodes arrayed in a first direction, a plurality of second sub-electrodes arrayed in a second direction that is orthogonal to the first direction, a dummy electrode, and a sealing resin. The sealing resin has a resin back surface from which the plurality of first sub-electrodes, the plurality of second sub-electrodes and the dummy electrode are exposed. The plurality of second sub-electrodes are located further in the first direction than any of the plurality of first sub-electrodes. The plurality of first sub-electrodes are located further in the second direction than any of the plurality of second sub-electrodes. The dummy electrode is located further in the first direction than any of the plurality of first sub-electrodes, and is located further in the second direction than any of the plurality of second sub-electrodes.

Abstract translation: 电子设备包括电子元件，沿第一方向排列的多个第一子电极，沿与第一方向正交的第二方向排列的多个第二子电极，虚拟电极和密封树脂。 密封树脂具有多个第一子电极，多个第二子电极和虚拟电极露出的树脂后表面。 多个第二子电极比第一子电极中的任一个进一步位于第一方向。 多个第一子电极比第二子电极中的任一个进一步位于第二方向。 所述虚拟电极比所述多个第一子电极中的任一个进一步位于所述第一方向上，并且比所述多个第二子电极中的任一个进一步位于所述第二方向。

公开(公告)号：US20250006621A1

公开(公告)日：2025-01-02

申请号：US18883587

申请日：2024-09-12

Applicant: Rohm Co., Ltd.

Inventor： Ryohei UMENO ,  Hiroaki MATSUBARA ,  Tomohira KIKUCHI

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31 ,  H01L25/065

Abstract: An electronic device includes: an electronic component; a sealing resin covering the electronic component; a first lead including a first inner portion and a first outer portion; a second lead including a second inner portion and a second outer portion; and a wire including a bonding segment secured to the first inner portion and a bonding segment secured to the second inner portion. The first inner portion is located inside a peripheral edge of the sealing resin as viewed in a thickness direction z, except at a first boundary with the first outer portion. The second inner portion is located inside the peripheral edge of the sealing resin as viewed in the thickness direction z, except at a second boundary with the second outer portion. As viewed in the thickness direction z, the wire has a length that is at least 25% of an average of a distance from the first boundary to the bonding segment secured to the first inner portion and a distance from the second boundary to the bonding segment secured to the second inner portion.

公开(公告)号：US20240332137A1

公开(公告)日：2024-10-03

申请号：US18741266

申请日：2024-06-12

Applicant: ROHM CO., LTD.

Inventor： Ryohei UMENO ,  Hiroaki MATSUBARA

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/49541 ,  H01L25/0655 ,  H01L24/48 ,  H01L2224/48137 ,  H01L2224/48245 ,  H01L2924/1424 ,  H01L2924/182

Abstract: An electronic device includes an electronic component, a sealing resin covering the electronic component, first and second terminals protruding from the sealing resin toward a first side in a first direction, and plural third terminals protruding from the sealing resin toward a second side in the first direction. The first and second terminals are located side by side with a first interval in a second direction. The third terminals are arranged in the second direction with a second interval. The first interval is greater than the second interval. Along the second direction, the first mount portion of the first terminal has a first dimension, the second mount portion of the second terminal has a second dimension, and the third mount portion of each third terminal has a third dimension. The first and second dimensions are greater than the third dimension.

公开(公告)号：US20240304510A1

公开(公告)日：2024-09-12

申请号：US18660967

申请日：2024-05-10

Applicant: Rohm Co., Ltd.

Inventor： Hiroaki MATSUBARA ,  Taro NISHIOKA ,  Yoshizo OSUMI

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/29 ,  H01L23/498 ,  H01L23/522 ,  H01L25/18

CPC classification number: H01L23/3135 ,  H01L23/291 ,  H01L23/49838 ,  H01L23/5223 ,  H01L23/5227 ,  H01L24/48 ,  H01L24/49 ,  H01L25/18 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2924/1815

Abstract: A semiconductor device includes: a first semiconductor element; a second semiconductor element; an insulating element electrically connected to the first semiconductor element and the second semiconductor element, and insulating the first semiconductor element and the second semiconductor element from each other; and a sealing resin covering the first semiconductor element, the second semiconductor element, and the insulating element. The sealing resin includes a first portion covering the first semiconductor element, the second semiconductor element, and the insulating element, and a second portion constituting the outermost surface of the sealing resin. The second portion is less prone to a tracking phenomenon than the first portion.

公开(公告)号：US20240274743A1

公开(公告)日：2024-08-15

申请号：US18630525

申请日：2024-04-09

Applicant: Rohm Co., Ltd.

Inventor： Hiroaki MATSUBARA ,  Yoshizo OSUMI

IPC: H01L31/16 ,  H01L33/56 ,  H01L33/62

CPC classification number: H01L31/162 ,  H01L33/56 ,  H01L33/62

Abstract: A semiconductor device includes a first die pad, a light-receiving element, a light-emitting element, a first sheet, and a resin part. The first die pad has a first obverse surface facing a first side in a thickness direction. The light-receiving element is mounted on the first obverse surface. The light-emitting element is disposed on the first side in the thickness direction with respect to the light-receiving element. The first sheet has light-passing and insulating properties and is interposed between the light-receiving element and the light-emitting element in the thickness direction. The resin part covers the light-receiving element, the light-emitting element and the first sheet. The first sheet includes a first surface facing the first side in the thickness direction and a second surface facing away from the first surface. At least a portion of the first surface and the second surface includes an uneven portion with irregularities.

公开(公告)号：US20240194660A1

公开(公告)日：2024-06-13

申请号：US18587461

申请日：2024-02-26

Applicant: ROHM CO., LTD.

Inventor： Yoshizo OSUMI ,  Taro NISHIOKA ,  Hiroaki MATSUBARA

IPC: H01L25/16 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/56 ,  H01L33/62

CPC classification number: H01L25/167 ,  H01L31/02005 ,  H01L31/0203 ,  H01L33/56 ,  H01L33/62 ,  H01L31/18 ,  H01L2933/005 ,  H01L2933/0066

Abstract: Semiconductor device includes first lead, second lead, light-emitting element, light-receiving element, transparent resin and first resin. First lead includes first die pad having first obverse surface and first reverse surface mutually opposite in thickness direction. Second lead includes second die pad having second obverse surface facing same side as first obverse surface in thickness direction and second reverse surface facing same side as first reverse surface in thickness direction. Light-emitting element is mounted on first obverse surface. Light-receiving element is mounted on second obverse surface. Transparent resin covers portions of light-emitting element and light-receiving element. First resin covers transparent resin. Transparent resin includes transparent-resin obverse surface facing same side as first obverse surface in thickness direction, and transparent-resin reverse surface facing same side as first reverse surface in thickness direction. Transparent-resin reverse surface has surface roughness larger than that of transparent-resin obverse surface.