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47 条记录 (耗时 0.023 秒)

    Integrated circuit socket
    32.
    发明授权
    Integrated circuit socket 有权
    集成电路插座

    公开(公告)号：US08297986B2

    公开(公告)日：2012-10-30

    申请号：US11687529

    申请日：2007-03-16

    申请人： Seah Sun Too ,  Raj N. Master ,  Jacquana Diep ,  Mohammad Khan

    发明人： Seah Sun Too ,  Raj N. Master ,  Jacquana Diep ,  Mohammad Khan

    IPC分类号： H01R12/00

    CPC分类号： H01L23/433 ,  H01L23/467 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/3511 ,  H01R12/7076 ,  H05K7/1061 ,  H01L2224/0401

    摘要： Various sockets for packaged integrated circuits and methods of making the same are provided. In one aspect, a method of mounting a semiconductor chip is provided that includes providing a package that has a base substrate with a first side and a second side opposite the first side. The second side has a central region. The package includes a semiconductor chip and a lid coupled to the first side. A socket is provided for receiving the base substrate. The socket includes a mound that projects toward the second side of the base substrate when the base substrate is seated in the socket to provide support for the central region of the base substrate. The package is mounted in the socket. The mound provides support for the central region of the base substrate.

    摘要翻译： 提供了用于封装集成电路的各种插座及其制造方法。 一方面，提供了一种安装半导体芯片的方法，其包括提供具有第一侧和与第一侧相对的第二侧的基底的封装。 第二边有一个中部地区。 该封装包括半导体芯片和连接到第一侧的盖子。 提供了用于接收基底的插座。 插座包括当基底座位于插座中时朝向基底基板的第二侧突出的墩，以为基底基板的中心区域提供支撑。 包装安装在插座中。 土丘为基底的中心区域提供支撑。

    Controlled and programmed deposition of flux on a flip-chip die by spraying
    35.
    发明授权
    Controlled and programmed deposition of flux on a flip-chip die by spraying 失效
    通过喷涂控制并编程在倒装芯片上沉积助焊剂

    公开(公告)号：US06722553B2

    公开(公告)日：2004-04-20

    申请号：US09922936

    申请日：2001-08-07

    申请人： Raj N. Master ,  Mohammad Z. Khan ,  Maria G. Guardado ,  Ooi Tong Ong

    发明人： Raj N. Master ,  Mohammad Z. Khan ,  Maria G. Guardado ,  Ooi Tong Ong

    IPC分类号： B23K1308

    CPC分类号： H05K3/3489 ,  B23K1/203 ,  B23K2101/36 ,  H05K3/3436

    摘要： A method and apparatus are provided for controllably dispensing flux on a substrate having a plurality of conductive terminals. Flux having a viscosity range between 10 centipoises and about 150 centipoises is sprayed on the substrate and the conductive terminals at a valve pressure range between about 1.5 psi and about 30 psi via a dispense nozzle of a flux dispenser. Upon a subsequent high temperature solder reflow process, the sprayed flux on the substrate is mostly removed by thermal decomposition to volatile species, thereby significantly reducing flux residue remaining on the surface of the substrate between the conductive terminals.

    摘要翻译： 提供了一种方法和装置，用于在具有多个导电端子的基板上可控地分配通量。 具有10厘泊和约150厘泊之间的粘度范围的助焊剂通过焊剂分配器的分配喷嘴在约1.5psi至约30psi之间的阀压力范围内喷射到衬底和导电端子上。 在随后的高温焊料回流工艺中，基板上的喷涂焊剂主要通过热分解除去到挥发性物质，从而显着减少在导电端子之间残留在基板表面上的焊剂残余物。

    Method of fabricating reliable laminate flip-chip assembly
    36.
    发明授权
    Method of fabricating reliable laminate flip-chip assembly 有权
    制造可靠的层压倒装芯片组装方法

    公开(公告)号：US06632690B2

    公开(公告)日：2003-10-14

    申请号：US10062407

    申请日：2002-02-05

    申请人： Raj N. Master ,  Edward S. Alcid ,  Diong-Hing Ding

    发明人： Raj N. Master ,  Edward S. Alcid ,  Diong-Hing Ding

    IPC分类号： G01R3126

    CPC分类号： H05K3/3478

    摘要： A method of fabricating laminate assemblies determines the ideal weight (W) of underfill to be dispensed, based on the size of the semiconductor die and the gap between the die and the laminate substrate. Underfill is dispensed in a single step in an amount between 1.1W and 1.3W to form fillets that cover at least 15% of the height of the semiconductor die on all four sides of the die. The amount of underfill ensures that the fillet coverage imbalance is 30% or less for each of the pairs of opposing sides of the die, thereby improving solder joint reliability.

    摘要翻译： 基于半导体管芯的尺寸和管芯与层叠基板之间的间隙，制造叠层组件的方法决定了要分配的底部填充物的理想重量（W）。 底部填充剂以1.1W至1.3W之间的一个步骤进行分配，以形成在模具的四面上覆盖半导体管芯高度的至少15％的圆角。 底部填充剂的数量确保了模具的每对相对侧的圆角覆盖不平衡为30％以下，从而提高焊点的可靠性。

    Boat for organic and ceramic flip chip package assembly
    38.
    发明授权
    Boat for organic and ceramic flip chip package assembly 失效
    船用于有机和陶瓷倒装芯片组装

    公开(公告)号：US06488158B1

    公开(公告)日：2002-12-03

    申请号：US09659826

    申请日：2000-09-11

    申请人： Mohammad Khan ,  Raj N. Master ,  Maria G. Guardado ,  Loo L. Teoh ,  Ahmad Juwanda

    发明人： Mohammad Khan ,  Raj N. Master ,  Maria G. Guardado ,  Loo L. Teoh ,  Ahmad Juwanda

    IPC分类号： A47G1908

    CPC分类号： H01L21/67333 ,  H01L21/67336 ,  H01L21/6835 ,  H01L2221/68313

    摘要： A boat is formed with a plurality of through-holes sized to securely maintain ceramic or organic flip chip semiconductor packages in place during assembly. Embodiments comprises a boat having a bottom layer with an array of four-sided through-holes and a top layer with an array of through-holes and tabs extending from the sides of the through-hole. Embodiments further include a boat having a bottom layer with through-holes smaller than substantially aligned overlying through-holes in the top layer, the substantially aligned through-holes forming flip chip package holding pockets. An alignment mechanism ensures that components are accurately positioned on flip chip packages held in the boat during assembly.

    摘要翻译： 船形成有多个通孔，其尺寸设计成在组装期间可靠地将陶瓷或有机倒装芯片半导体封装保持在适当的位置。 实施例包括具有具有四面通孔阵列的底层和具有从通孔侧面延伸的通孔阵列的顶层的船。 实施例还包括具有底层的船，该底层具有通孔小于顶层中的基本上对准的覆盖通孔，基本对准的通孔形成倒装芯片封装保持袋。 对准机构确保组件准确地定位在组装期间保持在船中的倒装芯片封装上。

    Detection of flux residue
    39.
    发明授权
    Detection of flux residue 有权
    助焊剂残留检测

    公开(公告)号：US06367679B1

    公开(公告)日：2002-04-09

    申请号：US09642831

    申请日：2000-08-22

    申请人： Raj N. Master ,  Jonathan D. Halderman

    发明人： Raj N. Master ,  Jonathan D. Halderman

    IPC分类号： B23K3112

    CPC分类号： B23K3/029 ,  H05K3/26

    摘要： Detection of flux residue remaining the formation of a device/substrate assembly is carried out by contacting the assembly with a fixed amount of solvent adapted to remove residual flux from the assembly and measuring the conductivity or resistance of the contacted solvent to determine the presence of flux residue in the solvent obtained from the assembly. Embodiments include contacting the assembly with isopropanol by immersing and withdrawing the assembly in a fixed amount of the solvent and measuring the conductivity of the contacted solvent with a volt meter.

    摘要翻译： 通过使组件与固定量的溶剂接触来检测剩余的器件/衬底组件的形成，该溶剂适于从组件中除去残留的焊剂并测量接触溶剂的导电性或电阻以确定焊剂的存在 残留在从组装得到的溶剂中。 实施方案包括通过将组件浸入和取出固定量的溶剂并用电压表测量接触溶剂的电导率来使组件与异丙醇接触。

    Organic pin grid array flip chip carrier package
    40.
    发明授权
    Organic pin grid array flip chip carrier package 有权
    有机针阵列倒装芯片载体封装

    公开(公告)号：US06229207B1

    公开(公告)日：2001-05-08

    申请号：US09482095

    申请日：2000-01-13

    申请人： Raj N. Master

    发明人： Raj N. Master

    IPC分类号： H01L2348

    CPC分类号： H01L23/49811 ,  H01L2224/16225 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/15312 ,  H05K3/3463

    摘要： An organic carrier member for mounting a semiconductor device is provided that has a plurality of pin leads joined to conductive pads on the carrier member by a solder fillet having a reflow temperature higher than the temperature necessary to attach the semiconductor device. Embodiments include a bismaleimide-triazine epoxy laminate carrier member having an array of pins joined to the carrier member by a solder fillet having a reflow temperature of no greater than 275° C.

    摘要翻译： 提供一种用于安装半导体器件的有机载体构件，其具有多个引脚引线，其通过具有高于附接半导体器件所需的温度的回流温度的焊接圆角而与载体构件上的导电焊盘接合。 实施方案包括双马来酰亚胺 - 三嗪环氧树脂层压载体构件，其具有通过具有不高于275℃的回流温度的焊接圆角连接到载体构件的销的阵列。