Abstract:
A method can be used for reducing a memory operation time in a non-volatile memory device having a memory array with a number of memory cells. The method includes performing a first execution of the memory operation on a set of memory cells by applying a first biasing configuration, storing information associated to the first biasing configuration, and performing a second execution, subsequent to the first execution, of the memory operation on the same set of memory cells by applying a second biasing configuration that is determined according to the stored information associated to the first biasing configuration.
Abstract:
The present disclosure relates to a memory cell comprising a vertical selection gate extending in a trench made in a substrate, a floating gate extending above the substrate, and a horizontal control gate extending above the floating gate, wherein the floating gate also extends above a portion of the vertical selection gate over a non-zero overlap distance. Application mainly to the production of a split gate memory cell programmable by hot-electron injection.
Abstract:
A method can be used to make a semiconductor device. A number of projecting regions are formed over a first semiconductor layer that has a first conductivity type. The first semiconductor layer is located on an insulating layer that overlies a semiconductor substrate. The projecting regions are spaced apart from each other. Using the projecting regions as an implantation mask, dopants having a second conductivity type are implanted into the first semiconductor layer, so as to form a sequence of PN junctions forming diodes in the first semiconductor layer. The diodes vertically extend from an upper surface of the first semiconductor layer to the insulating layer.
Abstract:
A read-amplifier circuit includes a core with a first input and a second input that are intended to receive in a measurement phase a differential signal arising from a first bit line and from a second bit line of the memory device. The circuit also includes a memory element with two inverters coupled in a crossed manner. The first and second inputs are respectively connected to two of the power supply nodes of the inverters via two transfer capacitors. A first controllable circuit is configured to temporarily render the memory element floating during an initial phase preceding the measurement phase and during the measurement phase.
Abstract:
A read-amplifier circuit includes a core with a first input and a second input that are intended to receive in a measurement phase a differential signal arising from a first bit line and from a second bit line of the memory device. The circuit also includes a memory element with two inverters coupled in a crossed manner. The first and second inputs are respectively connected to two of the power supply nodes of the inverters via two transfer capacitors. A first controllable circuit is configured to temporarily render the memory element floating during an initial phase preceding the measurement phase and during the measurement phase.
Abstract:
The non-volatile memory device comprises memory cells each comprising a selectable state transistor having a floating gate and a control gate. The state transistor is of the depletion-mode type and is advantageously configured so as to have a threshold voltage that is preferably negative when the memory cell is in a virgin state. When the memory cell is read, a read voltage of zero may then be applied to the control gate and also to the control gates of the state transistors of all the memory cells of the memory device.
Abstract:
A method can be used for managing the operation of a non-volatile memory equipped with a system for correction of a single error and for detection of a double error. In the case of the detection of a defective bit line of the memory plane, a redundant bit line is assigned and the values of the bits of the memory cells of the defective line are copied into the memory cells of the redundant line and are inverted in the case of the detection of double errors by the system, or corrected by the system in the presence of single errors.
Abstract:
The present disclosure relates to a non-volatile memory cell on a semiconductor substrate, comprising a first transistor comprising a control gate, a floating gate and a drain region, a second transistor comprising a control gate, a floating gate and a drain region, in which the floating gates of the first and second transistors are electrically coupled, and the second transistor comprises a conducting region electrically coupled to its drain region and extending opposite its floating gate through a tunnel dielectric layer.
Abstract:
The present disclosure relates to a memory including a memory array with at least two rows of memory cells, a first driver coupled to a control line of the first row of memory cells, and a second driver coupled to a control line of the second row of memory cells. The first driver is made in a first well, the second driver is made in a second well electrically insulated from the first well, and the two rows of memory cells are produced in a memory array well electrically insulated from the first and second wells.
Abstract:
The disclosure comprises: linking a first terminal of the capacitance to the mid-point of a first voltage divider bridge, applying a first voltage to a second terminal of the capacitance, maintaining a voltage of a mid-point of the first divider bridge near a reference voltage, and discharging a mid-point of a second divider bridge with a constant current. When a voltage of the mid-point of the second bridge reaches a first voltage threshold, applying a second voltage to the second terminal of the capacitance, and measuring the time for the voltage to reach a second threshold.