公开(公告)号：US08679576B2

公开(公告)日：2014-03-25

申请号：US12186919

申请日：2008-08-06

申请人： Toru Nakai ,  Satoru Kawai

发明人： Toru Nakai ,  Satoru Kawai

IPC分类号： B05D1/12

CPC分类号： H05K3/423 ,  C25D5/02 ,  C25D5/16 ,  C25D5/22 ,  C25D7/06 ,  C25D17/005 ,  H05K3/421 ,  H05K3/429 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/0143 ,  H05K2203/0257 ,  H05K2203/1545

摘要： A plating apparatus and method to perform plating in non-through-hole openings or through-hole openings of a printed wiring board having at least either non-through holes or through-holes to form via-hole conductors or through-hole conductors. The plating method contacts a printed wiring board having the non-through holes or through-holes with a plating solution including plating ingredients, and plates metal on a surface of the printed wiring board while making contact with at least a portion of a pliable contact body.

摘要翻译： 一种电镀装置和方法，用于在具有至少一个非通孔或通孔的印刷电路板的非通孔开口或通孔开口中执行电镀以形成通孔导体或通孔导体。 电镀方法在印刷电路板的表面上与具有非通孔或通孔的印刷电路板接触，其中电镀液包括电镀成分和板金属，同时与柔性接触体的至少一部分接触 。

公开(公告)号：US08383956B2

公开(公告)日：2013-02-26

申请号：US12342772

申请日：2008-12-23

申请人： Toru Nakai ,  Satoru Kawai ,  Hiroshi Niwa ,  Yoshiyuki Iwata

发明人： Toru Nakai ,  Satoru Kawai ,  Hiroshi Niwa ,  Yoshiyuki Iwata

IPC分类号： H05K1/11

CPC分类号： C25D5/02 ,  H05K3/108 ,  H05K3/421 ,  H05K3/423 ,  H05K3/429 ,  H05K3/4661 ,  H05K2201/0116 ,  H05K2201/09563 ,  H05K2203/025 ,  H05K2203/0257 ,  Y10T29/49124 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/249955 ,  Y10T428/249958

摘要： A multilayer printed circuit board has an insulation layer, a first conductor layer provided over a first side of the insulation layer, a second conductor layer provided over a second side of the insulation layer opposite to the first side, and multiple filled vias electrically connecting the first conductor layer and the second conductor layer. The filled vias have upper surfaces, respectively, and each of the upper surfaces is made such that a difference between a lowest point and a highest point of each of the upper surfaces is less than or equal to about 7 μm.

摘要翻译： 多层印刷电路板具有绝缘层，设置在绝缘层的第一侧上的第一导体层，设置在与第一侧相反的绝缘层的第二侧上的第二导体层，以及多个填充的通孔， 第一导体层和第二导体层。 填充的通孔分别具有上表面，并且每个上表面被制成使得每个上表面的最低点和最高点之间的差小于或等于约7μm。

公开(公告)号：US20120181076A1

公开(公告)日：2012-07-19

申请号：US13434162

申请日：2012-03-29

申请人： Kota NODA ,  Tsutomu Yamauchi ,  Satoru Kawai

发明人： Kota NODA ,  Tsutomu Yamauchi ,  Satoru Kawai

IPC分类号： H05K1/11

CPC分类号： H05K1/115 ,  H05K1/0269 ,  H05K3/0032 ,  H05K3/0038 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/09254 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09918 ,  H05K2203/0554 ,  H05K2203/1572 ,  H05K2203/166

摘要： A double-sided circuit board including a substrate having a first surface and a second surface on an opposite side of the first surface and having a penetrating hole extending between the first surface and the second surface, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, and a through-hole conductor formed in the penetrating hole of the substrate and electrically connecting the first conductive circuit and the second conductive circuit. The penetrating hole comprises a first hole having a first opening with a diameter R1 on the first surface of the substrate, a second hole having a second opening with a diameter R2 on the second surface of the substrate, and a third hole connecting the first hole and the second hole and having a diameter smaller than at least one of R1 and R2.

摘要翻译： 一种双面电路板，包括具有在所述第一表面的相对侧上的第一表面和第二表面的基底，并且具有在所述第一表面和所述第二表面之间延伸的穿透孔，形成在所述第一表面的第一表面上的第一导电电路 所述基板，形成在所述基板的第二表面上的第二导电电路和形成在所述基板的所述贯通孔中的通孔导体，并且电连接所述第一导电电路和所述第二导电电路。 所述贯通孔包括第一孔，所述第一孔具有在所述基底的第一表面上具有直径R1的第一开口，在所述基底的第二表面上具有直径为R2的第二开口的第二孔，以及连接所述第一孔 和第二孔，其直径小于R1和R2中的至少一个。

公开(公告)号：US20100307807A1

公开(公告)日：2010-12-09

申请号：US12757157

申请日：2010-04-09

申请人： Kota NODA ,  Tsutomu Yamauchi ,  Satoru Kawai

发明人： Kota NODA ,  Tsutomu Yamauchi ,  Satoru Kawai

IPC分类号： H05K1/02 ,  H01R43/16

CPC分类号： H05K1/115 ,  H05K1/0269 ,  H05K3/0032 ,  H05K3/0038 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/09254 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09918 ,  H05K2203/0554 ,  H05K2203/1572 ,  H05K2203/166

摘要： A method for manufacturing a double-sided circuit board includes preparing a substrate having the first and second surfaces, forming a first hole having a first opening with a diameter R1 on the first surface of the substrate, forming a second hole having a second opening with a diameter R2 on the second surface of the substrate, forming a third hole having a diameter smaller than R1 and/or R2 and connecting the first and second holes such that a penetrating hole formed of the first hole, the second hole and the third hole is formed in the substrate, forming a first conductive circuit on the first surface of the substrate, forming a second conductive circuit on the second surface of the substrate, and filling the penetrating hole with conductive material such that a through-hole conductor electrically connecting the first conductive circuit and the second conductive circuit is formed.

摘要翻译： 一种制造双面电路板的方法包括制备具有第一和第二表面的基板，在基板的第一表面上形成具有直径为R1的第一开口的第一孔，形成具有第二开口的第二孔， 在所述基板的第二表面上的直径R2，形成直径小于R1和/或R2的第三孔，并且连接所述第一孔和所述第二孔，使得由所述第一孔，所述第二孔和所述第三孔形成的穿透孔 形成在基板上，在基板的第一表面上形成第一导电电路，在基板的第二表面上形成第二导电电路，并用导电材料填充该贯穿孔，使得通孔导体将 形成第一导电电路和第二导电电路。

公开(公告)号：US06379781B1

公开(公告)日：2002-04-30

申请号：US09446768

申请日：1999-12-23

申请人： Tomio Suzuki ,  Tadashi Otagiri ,  Satoru Kawai ,  Shuhei Ishikawa

发明人： Tomio Suzuki ,  Tadashi Otagiri ,  Satoru Kawai ,  Shuhei Ishikawa

IPC分类号： B32B300

CPC分类号： H05K3/4038 ,  H05K1/0287 ,  H05K1/0298 ,  H05K1/0373 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09609 ,  H05K2201/10287 ,  H05K2203/0235 ,  Y10S428/901 ,  Y10T428/24917

摘要： A substrate material (10) for printed circuit, comprising a sheet-shaped composite material (11) composed of a plastic and a ceramic and conductive metal wires (12) fixed in the composite material (11) at given pitches, wherein the two surfaces of the substrate material (10) have electrical connection to each other via the metal wires (12). A process for producing a substrate material for printed circuit, which comprises stretching, in a mold, conductive metal wires at given pitches, then pouring, into the mold, a composite material composed of a plastic and a ceramic, curing the composite material, thereafter slicing the resulting material in a direction approximately perpendicular to the direction of the metal wires. Good electrical connection can be secured, and it is possible to prevent, during use, peeling between substrate material and conductive layers and between insulating material and metal wires. A printed circuit board of high density and excellent dimensional accuracy can be obtained.

摘要翻译： 一种用于印刷电路的基板材料（10），包括由塑料和陶瓷构成的片状复合材料（11）和以给定的间距固定在复合材料（11）中的导电金属线（12），其中两个表面 的基板材料（10）经由金属线（12）彼此电连接。 一种印刷电路用基板材料的制造方法，其特征在于，在模具中以规定的间距拉伸导电金属丝，然后将由塑料和陶瓷构成的复合材料倒入模具中，然后固化复合材料 将所得材料切割成大致垂直于金属丝方向的方向。 可以确保良好的电连接，并且可以在使用期间防止在基板材料和导电层之间以及绝缘材料和金属线之间的剥离。 可以获得高密度和优异的尺寸精度的印刷电路板。

公开(公告)号：US06373512B1

公开(公告)日：2002-04-16

申请号：US09607924

申请日：2000-06-30

申请人： Satoru Kawai ,  Mitsuhiro Hamashima ,  Tatsuya Kita

发明人： Satoru Kawai ,  Mitsuhiro Hamashima ,  Tatsuya Kita

IPC分类号： B41J1736

CPC分类号： H04N1/00286 ,  B41J2/325 ,  B41J11/68 ,  B41J11/70 ,  G03B17/53 ,  H04N1/00289

摘要： A thermal transfer printer containing a means for feeding a plurality of thermal transfer sheets and a plurality of image receiving sheets, a platen roller placed in the feeding path of the thermal transfer and image receiving sheets, and a recording section with a thermal head with a plurality of heating resistors for selective activation based upon image data to record the image on the image receiving sheets when they and the thermal transfer sheets are forced together by the platen roller so each image receiving sheet is pressed on the thermal head surface by the platen roller. The recording section also has a means to detect when at least one of the thermal transfer and image receiving sheets being recorded are out and a means automatically to exchange the thermal transfer or image receiving sheets with new sheets based upon the detected result.

摘要翻译： 一种热转印打印机，包括用于馈送多个热转印片和多个图像接收片的装置，放置在热转印和图像接收片的馈送路径中的压纸辊，以及具有热敏头的记录部， 多个用于选择性激活的加热电阻器，当它们和热转印片材被压纸辊压在一起时，基于图像数据将图像记录在图像接收片材上，使得每个图像接收片材被压纸辊压在热敏头表面上 。 记录部分还具有检测何时记录的热转印和图像接收片材中的至少一个已经出来的装置，以及根据检测结果自动交换热转印或图像接收片材的装置。

公开(公告)号：US06303868B1

公开(公告)日：2001-10-16

申请号：US09491041

申请日：2000-01-25

申请人： Satoru Kawai

发明人： Satoru Kawai

IPC分类号： H01B510

CPC分类号： H01B7/0009

摘要： A wire conductor for a wiring harness includes a stranded wire obtained by twisting strands around a core wire. The core wire is composed of beryllium copper and the strands twisted around the core wire are composed of annealed copper. Preferably, the wire conductor includes a stranded wire obtained by twisting 6, 12 or 18 strands around the core wire. Half of the strands twisted around the core wire are composed of beryllium copper, the remaining strands and the core wire are composed of annealed copper, and the strands composed of beryllium copper and the strands composed of annealed copper are alternately arranged around the core wire. The wire conductor has sufficient conductivity and strength, causes no disconnection even when produced in a small diameter, and has appropriate flexibility.

摘要翻译： 用于线束的线导体包括通过将绞线缠绕在芯线周围而获得的绞线。 芯线由铍铜组成，绕芯线缠绕的线由退火铜组成。 优选地，线导体包括通过在芯线周围扭转6,12或18股而获得的绞线。 在芯线周围缠绕的线的一半由铍铜构成，剩余的线和芯线由退火的铜组成，由铍铜构成的线和由退火的铜组成的线交替地布置在芯线周围。 线导体具有足够的导电性和强度，即使在小直径制造时也不会断开，并且具有适当的柔性。

公开(公告)号：US5858917A

公开(公告)日：1999-01-12

申请号：US799474

申请日：1997-02-12

申请人： Masayasu Yamazaki ,  Satoru Kawai ,  Kenichiro Suto ,  Hitoshi Saito

发明人： Masayasu Yamazaki ,  Satoru Kawai ,  Kenichiro Suto ,  Hitoshi Saito

IPC分类号： B41M5/382 ,  B05D5/04 ,  B05D7/04 ,  B41M5/50 ,  B41M5/52 ,  B41M5/24

CPC分类号： B41M5/529 ,  B41M2205/32 ,  Y10S428/913 ,  Y10S428/914

摘要： An image-receiving sheet for thermal transfer printing, comprises a substrate and a receptor layer provided on at least one surface of the substrate. The receptor layer is formed by applying a receptor layer forming composition comprising (a) at least one kind of thermoplastic resin and (b) at least one kind of release agent selected from silicone compounds expressed by the following formula (1):R.sub.1 --Si--(NCO).sub.4-1 (1)�in the formula (1), "1" indicates an integer of from 0 to 3, and "R" indicates an alkyl group, an aryl group or a vinyl group!,to the at least one surface of the substrate, and drying the thus applied composition by heat.

摘要翻译： 一种用于热转移印刷的图像接收片，包括设置在基底的至少一个表面上的基底和受体层。 通过施加受体层形成组合物形成受体层，所述组合物包含（a）至少一种热塑性树脂和（b）至少一种选自下式（1）表示的硅氧烷化合物的脱模剂：R1-Si - （NCO）4-1（1）[式（1）中，“1”表示0〜3的整数，“R”表示烷基，芳基或乙烯基] 基材的至少一个表面，并通过加热干燥所施加的组合物。

公开(公告)号：US5045487A

公开(公告)日：1991-09-03

申请号：US408944

申请日：1989-09-18

申请人： Toshirou Kodama ,  Satoru Kawai ,  Yasuhiro Nasu ,  Nobuyoshi Takagi ,  Shintaro Yanagisawa

发明人： Toshirou Kodama ,  Satoru Kawai ,  Yasuhiro Nasu ,  Nobuyoshi Takagi ,  Shintaro Yanagisawa

IPC分类号： H01L21/027 ,  H01L21/336 ,  H01L27/12 ,  H01L29/40 ,  H01L29/78 ,  H01L29/786

CPC分类号： H01L29/66765 ,  H01L21/0274 ,  H01L29/78 ,  H01L29/78669 ,  Y10S438/949

摘要： A thin film transistor including a glass substrate and a gate electrode which is formed on the glass substrate. Source and drain electrodes are also provided. An insulating film covers at least the gate electrode and an amorphous semiconductor layer is formed on the insulating film. The semicondcutor layer includes a first portion having the source electrode formed thereon, a second portion having the drain electrode formed thereon, and a third portion formed between the first and second portions and located above the gate electrode, having a thin thickness which allows photolithographic light to permeate therethrough.

摘要翻译： 一种薄膜晶体管，其包括形成在玻璃基板上的玻璃基板和栅电极。 还提供了源极和漏极。 绝缘膜至少覆盖栅电极，在绝缘膜上形成非晶半导体层。 半切割层包括其上形成有源电极的第一部分，其上形成有漏电极的第二部分和形成在第一部分和第二部分之间并位于栅电极上方的第三部分，其具有薄的厚度，其允许光刻光 渗透通过。

公开(公告)号：US08595927B2

公开(公告)日：2013-12-03

申请号：US13408597

申请日：2012-02-29

申请人： Tsutomu Yamauchi ,  Satoru Kawai

发明人： Tsutomu Yamauchi ,  Satoru Kawai

IPC分类号： H05K3/10

CPC分类号： H05K3/0038 ,  H05K3/427 ,  H05K3/4661 ,  H05K2201/09563 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

摘要： A method for manufacturing a printed wiring board includes preparing a core substrate having first and second surfaces, forming a penetrating hole from the first surface toward the second surface of the substrate, forming first conductor on the first surface of the substrate, forming second conductor on the second surface of the substrate, and filling conductive material in the hole such that through-hole conductor connecting the first and second conductors is formed. The forming of the hole includes forming a first opening portion on the first-surface side of the substrate, a second opening portion from the bottom of the first portion toward the second surface, and a third opening portion from the bottom of the second portion toward the second surface, and the forming of the hole satisfies X2

摘要翻译： 一种制造印刷电路板的方法，包括制备具有第一和第二表面的芯基板，从基板的第一表面朝向第二表面形成贯穿孔，在基板的第一表面上形成第一导体，在基板的第一表面上形成第二导体 衬底的第二表面，并且将导电材料填充到孔中，使得形成连接第一和第二导体的通孔导体。 孔的形成包括在基板的第一表面侧形成第一开口部分，从第一部分的底部朝向第二表面的第二开口部分，以及从第二部分的底部到第二开口部分的第三开口部分 第二表面和孔的形成满足X2