公开(公告)号：US11049836B2

公开(公告)日：2021-06-29

申请号：US15960093

申请日：2018-04-23

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Matthew David Romig ,  Benjamin Stassen Cook

IPC: H01L23/00 ,  H01L23/495

Abstract: A system includes a substrate; a bond pad; a wire spanning above the substrate, having a first end bonded to the bond pad and a second end extending from the bond pad to terminate in a second end thereof; and a support structure disposed on the substrate, the support structure comprising at least a side wall and extending from the substrate to terminate in an end portion spaced from the substrate to support the wire.

公开(公告)号：US20190139883A1

公开(公告)日：2019-05-09

申请号：US15807114

申请日：2017-11-08

Applicant: Texas Instruments Incorporated

Inventor： Saumya Gandhi ,  Matthew David Romig ,  Abram Castro

IPC: H01L23/50 ,  H01L23/522 ,  H01L25/065 ,  H01L49/02 ,  H01G4/005 ,  H01L23/532 ,  H01L23/31

Abstract: A packaged semiconductor system, including: at least one electronic device on a device mounting surface of a substrate having terminals for attaching bond wires; at least one discrete component adjacent to the at least one electronic device, a second electrode of the at least one discrete component parallel to and spaced from a first electrode by a component body; the first electrode a metal foil having a protrusion extending laterally from the body and having a surface facing towards the second electrode; bonding wires interconnecting respective terminals of the at least one electronic device, the first electrode and the second electrode, and bonded to the surface of the second electrode and to the protrusion that extend away from the respective surfaces in a same direction; and packaging compound covering portions of the at least one electronic device, the at least one discrete component, and the bonding wires.

公开(公告)号：US20170347490A1

公开(公告)日：2017-11-30

申请号：US15162888

申请日：2016-05-24

Applicant: Texas Instruments Incorporated ,  Texas Instruments Deutschland GmbH

Inventor： Matthew David Romig ,  Robert Clair Keller ,  Ming Li ,  Yiqi Tang

IPC: H05K7/20 ,  H05K1/02 ,  H05K13/00

CPC classification number: H05K7/20418 ,  H01Q1/02 ,  H01Q1/2283 ,  H01Q21/061 ,  H05K1/0204 ,  H05K7/20509 ,  H05K13/00 ,  H05K2201/066

Abstract: A heat dissipating antenna comprised of a low-attenuating heat spreader bonded to a high frequency antenna or antenna array.An integrated circuit with a wireless integrated circuit chip, and a heat dissipating antenna coupled to the wireless integrated circuit chip. A method of forming a heat dissipating antenna.

公开(公告)号：US09679864B2

公开(公告)日：2017-06-13

申请号：US15293075

申请日：2016-10-13

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Benjamin Stassen Cook ,  Juan Alejandro Herbsommer ,  Matthew David Romig ,  Steven Alfred Kummerl ,  Wei-Yan Shih

IPC: H01L21/44 ,  H01L23/00 ,  H01L21/768 ,  H01L23/528 ,  H01L21/48 ,  H01L23/552 ,  H01L23/538 ,  H01L23/66

CPC classification number: H01L24/27 ,  H01L21/4867 ,  H01L21/76838 ,  H01L23/528 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L2223/6627 ,  H01L2224/24998 ,  H01L2224/2732 ,  H01L2224/27848 ,  H01L2224/29026 ,  H01L2224/29076 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method forming a packaged semiconductor device includes providing a first semiconductor die (first die) having bond pads thereon mounted face-up on a package substrate or on a die pad of a lead frame (substrate), wherein the substrate includes terminals or contact pads (substrate pads). A first dielectric layer is formed including printing a first dielectric precursor layer including a first ink having a first liquid carrier solvent extending from the substrate pads to the bond pads. A first interconnect precursor layer is printed including a second ink having a second liquid carrier over the first dielectric layer extending from the substrate pads to the bond pads. Sintering or curing the first interconnect precursor layer removes at least the second liquid carrier to form an electrically conductive interconnect including an ink residue which connects respective substrate pads to respective bond pads.

公开(公告)号：US09647329B2

公开(公告)日：2017-05-09

申请号：US14585724

申请日：2014-12-30

Applicant: Texas Instruments Incorporated

Inventor： Juan Alejandro Herbsommer ,  Matthew David Romig

IPC: H01Q1/50 ,  H01Q1/40 ,  H01L23/66 ,  H01L23/00 ,  H01L21/56 ,  H01L21/78 ,  H01Q19/10 ,  H01L23/495 ,  H01L23/31

CPC classification number: H01Q1/40 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/66 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/16265 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30111 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q19/108 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/45099

Abstract: An encapsulated integrated circuit has transceiver circuitry operable to produce and/or receive a radio frequency (RF) signal, wherein bond pads on the IC die are coupled to the transceiver input/output (IO) circuitry. An antenna structure is coupled to the IO circuitry via the bond pads. Mold material encapsulates the IC die and the antenna structure, wherein the antenna structure is positioned so as to be approximately in alignment with a core of a dielectric waveguide positioned adjacent the encapsulated IC.

公开(公告)号：US20170033072A1

公开(公告)日：2017-02-02

申请号：US15293075

申请日：2016-10-13

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Benjamin Stassen Cook ,  Juan Alejandro Herbsommer ,  Matthew David Romig ,  Steven Alfred Kummerl ,  Wei-Yan Shih

IPC: H01L23/00 ,  H01L23/66

CPC classification number: H01L24/27 ,  H01L21/4867 ,  H01L21/76838 ,  H01L23/528 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L2223/6627 ,  H01L2224/24998 ,  H01L2224/2732 ,  H01L2224/27848 ,  H01L2224/29026 ,  H01L2224/29076 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method forming a packaged semiconductor device includes providing a first semiconductor die (first die) having bond pads thereon mounted face-up on a package substrate or on a die pad of a lead frame (substrate), wherein the substrate includes terminals or contact pads (substrate pads). A first dielectric layer is formed including printing a first dielectric precursor layer including a first ink having a first liquid carrier solvent extending from the substrate pads to the bond pads. A first interconnect precursor layer is printed including a second ink having a second liquid carrier over the first dielectric layer extending from the substrate pads to the bond pads. Sintering or curing the first interconnect precursor layer removes at least the second liquid carrier to form an electrically conductive interconnect including an ink residue which connects respective substrate pads to respective bond pads.

Abstract translation: 一种形成封装半导体器件的方法包括提供一种第一半导体管芯（第一管芯），其上具有接合焊盘，其面朝上安装在封装衬底上或引线框架（衬底）的管芯焊盘上，其中衬底包括端子或接触焊盘 （基板焊盘）。 形成第一电介质层，包括印刷第一电介质前体层，该第一电介质前体层包括具有从衬底焊盘延伸到接合焊盘的第一液体载体溶剂的第一油墨。 印刷第一互连前体层，其包括在从衬底焊盘延伸到接合焊盘的第一介电层上方具有第二液体载体的第二油墨。 烧结或固化第一互连前体层至少去除第二液体载体以形成包括将各个衬底焊盘连接到各个焊盘的墨残余物的导电互连。

公开(公告)号：US20160096727A1

公开(公告)日：2016-04-07

申请号：US14967515

申请日：2015-12-14

Applicant: Texas Instruments Incorporated

Inventor： Matthew David Romig ,  Marie-Solange Anne Milleron ,  Benjamin Michael Sutton

IPC: B81C1/00 ,  H03H3/007

Abstract: A method of forming a packaged electronic device includes fabricating a MEMS structure, such as a BAW structure, on a first semiconductor wafer substrate; forming a cavity in a second semiconductor wafer substrate; and mounting the second substrate on the first substrate such that the MEMS structure is positioned inside the cavity in the second substrate using epoxy die attachment film. A wafer level assembly and an integrated circuit package are also described.

Abstract translation: 形成封装的电子器件的方法包括在第一半导体晶片衬底上制造诸如BAW结构的MEMS结构; 在第二半导体晶片衬底中形成空腔; 以及将所述第二基板安装在所述第一基板上，使得所述MEMS结构使用环氧树脂模附着膜定位在所述第二基板的所述腔内。 还描述了晶片级组件和集成电路封装。

公开(公告)号：US09111845B2

公开(公告)日：2015-08-18

申请号：US14468370

申请日：2014-08-26

Applicant: Texas Instruments Incorporated

Inventor： Matthew David Romig ,  Lance Cole Wright ,  Leslie Edward Stark ,  Frank Stepniak ,  Sreenivasan K. Koduri

IPC: H01L29/00 ,  H01L23/00 ,  H01L49/02 ,  H01L23/28 ,  H01L23/522 ,  H05K1/16

CPC classification number: H01L24/17 ,  H01L23/28 ,  H01L23/5226 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L28/00 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/49175 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/16 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An integrated circuit (IC) package including an IC die and a conductive ink printed circuit layer electrically connected to the IC die.

Abstract translation: 一种集成电路（IC）封装，其包括IC芯片和与IC芯片电连接的导电油墨印刷电路层。

公开(公告)号：US08945986B2

公开(公告)日：2015-02-03

申请号：US14154916

申请日：2014-01-14

Applicant: Texas Instruments Incorporated

Inventor： Matthew David Romig ,  Lance Cole Wright ,  Leslie Edward Stark ,  Frank Stepniak ,  Sreenivasan K. Koduri

IPC: H01L21/00 ,  H01L23/00 ,  H05K1/18 ,  H05K3/12 ,  H05K3/32 ,  H05K1/09

CPC classification number: H01L23/00 ,  B41M3/06 ,  H01L23/48 ,  H01L24/24 ,  H01L24/25 ,  H01L24/76 ,  H01L24/80 ,  H01L24/82 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2224/24227 ,  H01L2224/321 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/76155 ,  H01L2224/82102 ,  H05K1/092 ,  H05K1/181 ,  H05K3/125 ,  H05K3/32 ,  H05K2201/09272 ,  H05K2201/10151 ,  H05K2201/10454 ,  Y02P70/611

Abstract: One method of making an electronic assembly includes mounting one electrical substrate on another electrical substrate with a face surface on the one substrate oriented transversely of a face surface of the other substrate. The method also includes inkjet printing on the face surfaces a conductive trace that connects an electrical contact on the one substrate with an electrical connector on the other substrate. An electronic assembly may include a first substrate having a generally flat surface with a first plurality of electrical contacts thereon; a second substrate having a generally flat surface with a second plurality of electrical contacts thereon, the surface of the second substrate extending transversely of the surface of said first substrate; and at least one continuous conductive ink trace electrically connecting at least one of the first plurality of electrical contacts with at least one of the second plurality of electrical contacts.

Abstract translation: 制造电子组件的一种方法包括将一个电气基板安装在另一个电气基板上，其中一个基板上的面表面横向于另一个基板的表面。 该方法还包括在表面上喷墨印刷导电迹线，导电迹线将一个基底上的电接触与另一基底上的电连接器连接。 电子组件可以包括具有大致平坦表面的第一基板，其上具有第一多个电触点; 第二基板，其具有大致平坦的表面，其上具有第二多个电触点，所述第二基板的表面横向于所述第一基板的表面延伸; 以及至少一个连续的导电油墨迹线将所述第一多个电触点中的至少一个与所述第二多个电触点中的至少一个电连接。

公开(公告)号：US20140127856A1

公开(公告)日：2014-05-08

申请号：US14154916

申请日：2014-01-14

Applicant: Texas Instruments Incorporated

Inventor： Matthew David Romig ,  Lance Cole Wright ,  Leslie Edward Stark ,  Frank Stepniak ,  Sreenivasan K. Koduri

IPC: H01L23/00

CPC classification number: H01L23/00 ,  B41M3/06 ,  H01L23/48 ,  H01L24/24 ,  H01L24/25 ,  H01L24/76 ,  H01L24/80 ,  H01L24/82 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2224/24227 ,  H01L2224/321 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/76155 ,  H01L2224/82102 ,  H05K1/092 ,  H05K1/181 ,  H05K3/125 ,  H05K3/32 ,  H05K2201/09272 ,  H05K2201/10151 ,  H05K2201/10454 ,  Y02P70/611

Abstract: One method of making an electronic assembly includes mounting one electrical substrate on another electrical substrate with a face surface on the one substrate oriented transversely of a face surface of the other substrate. The method also includes inkjet printing on the face surfaces a conductive trace that connects an electrical contact on the one substrate with an electrical connector on the other substrate. An electronic assembly may include a first substrate having a generally flat surface with a first plurality of electrical contacts thereon; a second substrate having a generally flat surface with a second plurality of electrical contacts thereon, the surface of the second substrate extending transversely of the surface of said first substrate; and at least one continuous conductive ink trace electrically connecting at least one of the first plurality of electrical contacts with at least one of the second plurality of electrical contacts.

Abstract translation: 制造电子组件的一种方法包括将一个电气基板安装在另一个电气基板上，其中一个基板上的面表面横向于另一个基板的表面。 该方法还包括在表面上喷墨印刷导电迹线，导电迹线将一个基底上的电接触与另一基底上的电连接器连接。 电子组件可以包括具有大致平坦表面的第一基板，其上具有第一多个电触点; 第二基板，其具有大致平坦的表面，其上具有第二多个电触点，所述第二基板的表面横向于所述第一基板的表面延伸; 以及至少一个连续的导电油墨迹线将所述第一多个电触点中的至少一个与所述第二多个电触点中的至少一个电连接。