Integrated fan-out package and manufacturing method thereof

    公开(公告)号:US10283377B1

    公开(公告)日:2019-05-07

    申请号:US15832742

    申请日:2017-12-05

    Abstract: An integrated fan-out (InFO) package includes at least one die, a plurality of conductive structures, an encapsulant, an enhancement layer, and a redistribution structure. The die has an active surface and includes a plurality of conductive posts on the active surface. The conductive structures surround the die. The encapsulant partially encapsulates the die. The enhancement layer is over the encapsulant. A top surface of the enhancement layer is substantially coplanar with top surfaces of the conductive posts and the conductive structures. A material of the enhancement layer is different from a material of the encapsulant. A roughness of an interface between the encapsulant and the enhancement layer is larger than a roughness of the top surface of the enhancement layer. The redistribution structure is over the enhancement layer and is electrically connected to the conductive structures and the die.

    Integrated fan-out package and manufacturing method thereof

    公开(公告)号:US10276537B2

    公开(公告)日:2019-04-30

    申请号:US15715132

    申请日:2017-09-25

    Abstract: An integrated fan-out package includes a first and second dies, an encapsulant, and a redistribution structure. The first and second dies respectively has an active surface, a rear surface opposite to the active surface, and conductive posts on the active surface. The first and second dies are different types of dies. The active and rear surfaces of the first die are respectively leveled with the active and rear surfaces of the second die. Top surfaces of the conductive posts of the first and second dies are leveled. The conductive posts of the first and second dies are wrapped by same material. The encapsulant encapsulates sidewalls of the first and second dies. A first surface of the encapsulant is leveled with the active surfaces. The second surface of the encapsulant is leveled with the rear surfaces. The redistribution structure is disposed over the first die, the second die, and the encapsulant.

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