公开(公告)号：US20120286240A1

公开(公告)日：2012-11-15

申请号：US13557272

申请日：2012-07-25

Applicant: Chih-Kuang Yu ,  Chyi Shyuan Chern ,  Hsing-Kuo Hsia ,  Hung-Yi Kuo

Inventor： Chih-Kuang Yu ,  Chyi Shyuan Chern ,  Hsing-Kuo Hsia ,  Hung-Yi Kuo

IPC: H01L33/06

CPC classification number: H01L25/0753 ,  H01L24/24 ,  H01L24/82 ,  H01L33/0079 ,  H01L33/44 ,  H01L33/62 ,  H01L2224/73267 ,  H01L2924/01029 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2933/0033 ,  H01L2924/00

Abstract: An LED array comprises a growth substrate and at least two separated LED dies grown over the growth substrate. Each of LED dies sequentially comprise a first conductive type doped layer, a multiple quantum well layer and a second conductive type doped layer. The LED array is bonded to a carrier substrate. Each of separated LED dies on the LED array is simultaneously bonded to the carrier substrate. The second conductive type doped layer of each of separated LED dies is proximate to the carrier substrate. The first conductive type doped layer of each of LED dies is exposed. A patterned isolation layer is formed over each of LED dies and the carrier substrate. Conductive interconnects are formed over the patterned isolation layer to electrically connect the at least separated LED dies and each of LED dies to the carrier substrate.

Abstract translation: LED阵列包括生长衬底和在生长衬底上生长的至少两个分离的LED管芯。 每个LED管芯依次包括第一导电型掺杂层，多量子阱层和第二导电型掺杂层。 LED阵列结合到载体衬底。 LED阵列上的每个分离的LED管芯同时结合到载体衬底。 每个分离的LED管芯的第二导电型掺杂层靠近载体衬底。 每个LED管芯的第一导电型掺杂层被暴露。 在每个LED管芯和载体衬底上形成图案化隔离层。 导电互连形成在图案化的隔离层上，以将至少分离的LED管芯和每个LED管芯电连接到载体衬底。

公开(公告)号：US08299479B2

公开(公告)日：2012-10-30

申请号：US12720462

申请日：2010-03-09

Applicant: Hsin-Chieh Huang

Inventor： Hsin-Chieh Huang

IPC: H01L33/02 ,  H01L33/20

CPC classification number: H01L33/22 ,  H01L33/04 ,  H01L33/24

Abstract: A device includes a textured substrate having a trench extending from a top surface of the textured substrate into the textured substrate, wherein the trench comprises a sidewall and a bottom. A light-emitting device (LED) includes an active layer over the textured substrate. The active layer has a first portion parallel to the sidewall of the trench and a second portion parallel to the bottom of the trench.

Abstract translation: 一种器件包括纹理化衬底，其具有从纹理化衬底的顶表面延伸到纹理衬底中的沟槽，其中沟槽包括侧壁和底部。 发光器件（LED）包括纹理衬底上的有源层。 有源层具有平行于沟槽侧壁的第一部分和平行于沟槽底部的第二部分。

公开(公告)号：US20120228650A1

公开(公告)日：2012-09-13

申请号：US13476167

申请日：2012-05-21

Applicant: Chyi Shyuan Chern ,  Wen-Chien Fu ,  Hsing-Kuo Hsia ,  Chih-Kuang Yu ,  Ching-Hua Chiu ,  Hung-Yi Kuo

Inventor： Chyi Shyuan Chern ,  Wen-Chien Fu ,  Hsing-Kuo Hsia ,  Chih-Kuang Yu ,  Ching-Hua Chiu ,  Hung-Yi Kuo

IPC: H01L33/60 ,  H01L33/48

CPC classification number: H01L33/647 ,  H01L24/73 ,  H01L24/97 ,  H01L33/005 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2933/0033 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/92247

Abstract: The present disclosure provides one embodiment of a method for fabricating a light emitting diode (LED) package. The method includes forming a plurality of through silicon vias (TSVs) on a silicon substrate; depositing a dielectric layer over a first side and a second side of the silicon substrate and over sidewall surfaces of the TSVs; forming a metal layer patterned over the dielectric layer on the first side and the second side of the silicon substrate and further filling the TSVs; and forming a plurality of highly reflective bonding pads over the metal layer on the second side of the silicon substrate for LED bonding and wire bonding.

Abstract translation: 本公开提供了制造发光二极管（LED）封装的方法的一个实施例。 该方法包括在硅衬底上形成多个通硅通孔（TSV）; 在所述硅衬底的第一侧和第二侧以及所述TSV的侧壁表面上沉积介电层; 在所述硅衬底的所述第一侧和所述第二侧上的所述电介质层上形成图案化的金属层，并进一步填充所述TSV; 以及在所述硅衬底的所述第二侧上的所述金属层上形成多个高反射性接合焊盘，用于LED接合和引线接合。

公开(公告)号：US08241932B1

公开(公告)日：2012-08-14

申请号：US13050549

申请日：2011-03-17

Applicant: Chih-Kuang Yu ,  Chyi Shyuan Chern ,  Hsing-Kuo Hsia ,  Hung-Yi Kuo

Inventor： Chih-Kuang Yu ,  Chyi Shyuan Chern ,  Hsing-Kuo Hsia ,  Hung-Yi Kuo

IPC: H01L21/00

CPC classification number: H01L25/0753 ,  H01L24/24 ,  H01L24/82 ,  H01L33/0079 ,  H01L33/44 ,  H01L33/62 ,  H01L2224/73267 ,  H01L2924/01029 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2933/0033 ,  H01L2924/00

Abstract: An LED array comprises a growth substrate and at least two separated LED dies grown over the growth substrate. Each of LED dies sequentially comprise a first conductive type doped layer, a multiple quantum well layer and a second conductive type doped layer. The LED array is bonded to a carrier substrate. Each of separated LED dies on the LED array is simultaneously bonded to the carrier substrate. The second conductive type doped layer of each of separated LED dies is proximate to the carrier substrate. The first conductive type doped layer of each of LED dies is exposed. A patterned isolation layer is formed over each of LED dies and the carrier substrate. Conductive interconnects are formed over the patterned isolation layer to electrically connect the at least separated LED dies and each of LED dies to the carrier substrate.

Abstract translation: LED阵列包括生长衬底和在生长衬底上生长的至少两个分离的LED管芯。 每个LED管芯依次包括第一导电型掺杂层，多量子阱层和第二导电型掺杂层。 LED阵列结合到载体衬底。 LED阵列上的每个分离的LED管芯同时结合到载体衬底。 每个分离的LED管芯的第二导电型掺杂层靠近载体衬底。 每个LED管芯的第一导电型掺杂层被暴露。 在每个LED管芯和载体衬底上形成图案化隔离层。 导电互连形成在图案化的隔离层上，以将至少分离的LED管芯和每个LED管芯电连接到载体衬底。

公开(公告)号：US09246068B2

公开(公告)日：2016-01-26

申请号：US14305092

申请日：2014-06-16

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Chi-Xiang Tseng ,  Hsiao-Wen Lee ,  Min-Sheng Wu ,  Tien-Min Lin

IPC: H01L33/50 ,  H01L33/46 ,  H01L33/54

CPC classification number: H01L33/504 ,  H01L33/46 ,  H01L33/505 ,  H01L33/508 ,  H01L33/54 ,  H01L2933/0041

Abstract: The present disclosure involves a method. The method includes providing a substrate having a layer disposed thereon. A plurality of light-emitting devices is attached to the layer. A gel is applied over the substrate. The gel covers the plurality of light-emitting devices. The gel is shaped into a plurality of lenses. The lenses each cover a respective one of the light-emitting devices. The light-emitting devices are separated from one another. The substrate and the layer are removed.

Abstract translation: 本公开涉及一种方法。 该方法包括提供其上设置有层的基板。 多个发光装置附着在该层上。 将凝胶施加在基底上。 凝胶覆盖多个发光装置。 凝胶成形为多个透镜。 透镜各自覆盖相应的一个发光器件。 发光装置彼此分离。 去除衬底和层。

公开(公告)号：US09224636B2

公开(公告)日：2015-12-29

申请号：US14267303

申请日：2014-05-01

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Chyi Shyuan Chern ,  Hsin-Hsien Wu ,  Chun-Lin Chang ,  Hsing-Kuo Hsia ,  Hung-Yi Kuo

IPC: H01L21/768 ,  H01L21/02 ,  H01L21/3065

CPC classification number: H01L21/76801 ,  H01L21/02057 ,  H01L21/3065 ,  H01L21/76898

Abstract: A method includes forming an opening in a substrate, and the opening completely extends through the substrate. A recast material is formed on sidewalls of the substrate exposed by the opening. A first chemical is applied in the opening to remove the recast material, wherein a residue of the first chemical remains on portions of the sidewalls after the applying of the first chemical. Moreover, A second chemical is applied in the opening to remove the residue of the first chemical, and the second chemical is different from the first chemical.

Abstract translation: 一种方法包括在基板中形成开口，并且开口完全延伸穿过基板。 在由开口暴露的衬底的侧壁上形成重铸材料。 在开口中施加第一种化学品以去除重铸材料，其中在施加第一种化学品之后，第一种化学物质的残留物残留在侧壁的部分上。 此外，在开口中施加第二种化学物质以除去第一化学品的残余物，而第二种化学品与第一种化学品不同。

公开(公告)号：US09153739B2

公开(公告)日：2015-10-06

申请号：US14210522

申请日：2014-03-14

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Hsin-Chieh Huang

IPC: H01L33/22 ,  H01L33/04 ,  H01L33/24

CPC classification number: H01L33/22 ,  H01L33/04 ,  H01L33/24

Abstract: A device includes a textured substrate having a trench extending from a top surface of the textured substrate into the textured substrate, wherein the trench comprises a sidewall and a bottom. A light-emitting device (LED) includes an active layer over the textured substrate. The active layer has a first portion parallel to the sidewall of the trench and a second portion parallel to the bottom of the trench.

Abstract translation: 一种器件包括纹理化衬底，其具有从纹理化衬底的顶表面延伸到纹理衬底中的沟槽，其中沟槽包括侧壁和底部。 发光器件（LED）包括纹理衬底上的有源层。 有源层具有平行于沟槽侧壁的第一部分和平行于沟槽底部的第二部分。

公开(公告)号：US09076950B2

公开(公告)日：2015-07-07

申请号：US13790092

申请日：2013-03-08

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Kuan-Chun Chen ,  Hao-Chung Kuo ,  You-Da Lin ,  Zhen-Yu Li

IPC: H01L33/64 ,  F21V21/00 ,  H01L25/075 ,  F21S6/00 ,  F21V3/04 ,  F21V7/22 ,  F21Y101/02 ,  F21Y105/00 ,  F21V29/74 ,  F21V29/89

CPC classification number: H01L25/0753 ,  F21S6/00 ,  F21V3/049 ,  F21V7/22 ,  F21V21/00 ,  F21V29/74 ,  F21V29/89 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L27/156 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/20 ,  H01L33/24 ,  H01L33/32 ,  H01L33/36 ,  H01L33/502 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A lighting apparatus includes a polygon die including a plurality of light-emitting diodes (LEDs), and a submount to which each of the LEDs is coupled. Each LED includes a plurality of epi-layers which contains a p-type layer, an n-type layer, and a multiple quantum well (MQW) disposed between the p-type layer and the n-type layer, and a p-type electrode and an n-type electrode which are electrically coupled to the p-type layer and the n-type layer, respectively. The p-type and the n-type electrodes are located between the submount and the epi-layers. The submount contains a plurality of conductive elements configured to electrically couple at least a portion of the plurality of LEDs in series. At least some of the plurality of LEDs have non-rectangular top view shapes.

Abstract translation: 照明装置包括具有多个发光二极管（LED）的多边形管芯，以及与每个LED连接的基座。 每个LED包括多个外延层，其包含设置在p型层和n型层之间的p型层，n型层和多量子阱（MQW），以及p型 电极和n型电极，其分别电耦合到p型层和n型层。 p型和n型电极位于底座和外延层之间。 底座包含多个导电元件，其被配置为将多个LED的至少一部分串联耦合。 多个LED中的至少一些LED具有非矩形顶视图形状。

公开(公告)号：US09060396B2

公开(公告)日：2015-06-16

申请号：US12894829

申请日：2010-09-30

Applicant: Ming-Hsin Huang

Inventor： Ming-Hsin Huang

IPC: H05B37/02 ,  H05B33/08

CPC classification number: H05B33/0815 ,  Y02B20/346

Abstract: A circuit comprises a first switch, a second switch, a third switch, and a fourth switch. Each has a first end and a second end. The circuit also comprises a capacitive device having a first capacitive end and a second capacitive end, and a voltage source. A first node having a first voltage is coupled to the first fourth-switch end, to the first second-switch end, and to the first capacitive end. A second node having a second voltage is coupled to the voltage source, to the second fourth-switch end, and to the second third-switch end. A third node is coupled to the second second-switch end, and to the first first-switch end. The first switch and the second switch are controlled such that the first node and the voltage source selectively provide the second voltage.

Abstract translation: 电路包括第一开关，第二开关，第三开关和第四开关。 每个都有第一端和第二端。 电路还包括具有第一电容端和第二电容端的电容器件，以及电压源。 具有第一电压的第一节点耦合到第一第四开关端，耦合到第一第二开关端和第一电容端。 具有第二电压的第二节点耦合到电压源，耦合到第二第四开关端和第二第三开关端。 第三节点耦合到第二第二开关端和第一第一开关端。 第一开关和第二开关被控制成使得第一节点和电压源选择性地提供第二电压。

公开(公告)号：US08999770B2

公开(公告)日：2015-04-07

申请号：US13949556

申请日：2013-07-24

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Tien-Ming Lin ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

IPC: H01L21/20 ,  H01L33/58 ,  H01L33/50

CPC classification number: H01L33/58 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.

Abstract translation: 半导体结构包括具有多个管芯区域的模块，设置在衬底上的多个发光器件，使得每个管芯区域包括一个发光器件，以及在该模块上的透镜板，并且粘附到 基材用胶。 透镜板包括多个微透镜，每个微透镜各自对应于一个裸片区域，并且在每个裸片区域中，胶水通过相应的一个微透镜提供一个发光器件的气密封装。 此外，作为透镜板的一部分包括磷光体。