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公开(公告)号:US12133256B2
公开(公告)日:2024-10-29
申请号:US17132417
申请日:2020-12-23
Applicant: Intel Corporation
Inventor: Daniel Cohn , Nir Balaban , Dor Chay , Mordechay Goodstein
IPC: H04W74/0816 , H04L1/18 , H04W16/14 , H04W28/20
CPC classification number: H04W74/0816 , H04L1/18 , H04W16/14 , H04W28/20
Abstract: A component of a wireless communication device configured for any of a plurality of transmission bandwidths. The component includes at least one processor; and a non-transitory processor-readable storage medium including instructions that, when executed by the at least one processor, cause the at least one processor to: monitor a Clear Channel Assessment (CCA) factor or a Request-to-Send (RTS) factor for each of the transmission bandwidths, wherein the CCA factor is a throughput impact estimate based on any CCA transmission deferrals, and the RTS factor is a throughput impact estimate based on any transmission deferrals due to unanswered RTS messages; and dynamically select, based on the CCA factor or the RTS factor, one of the transmission bandwidths that increases a throughput of the wireless communication device.
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公开(公告)号:US12132805B2
公开(公告)日:2024-10-29
申请号:US17542175
申请日:2021-12-03
Applicant: Intel Corporation
Inventor: Francesc Guim Bernat , Karthik Kumar , Thomas Willhalm , Petar Torre , Ned Smith , Brinda Ganesh , Evan Custodio , Suraj Prabhakaran
IPC: H04L67/60 , H04L12/66 , H04L47/70 , H04L67/2885 , H04L67/5681 , H04L67/62
CPC classification number: H04L67/60 , H04L12/66 , H04L47/70 , H04L67/2885 , H04L67/5681 , H04L67/62
Abstract: Technologies for fulfilling service requests in an edge architecture include an edge gateway device to receive a request from an edge device or an intermediate tier device of an edge network to perform a function of a service by an entity hosting the service. The edge gateway device is to identify one or more input data to fulfill the request by the service and request the one or more input data from an edge resource identified to provide the input data. The edge gateway device is to provide the input data to the entity associated with the request.
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公开(公告)号:US12131507B2
公开(公告)日:2024-10-29
申请号:US18191565
申请日:2023-03-28
Applicant: Intel Corporation
Inventor: Tomer Bar-On , Jacob Subag , Yaniv Fais , Jeremie Dreyfuss , Gal Novik , Gal Leibovich , Tomer Schwartz , Ehud Cohen , Lev Faivishevsky , Uzi Sarel , Amitai Armon , Yahav Shadmiy
IPC: G06T9/00 , G06N3/044 , G06N3/045 , G06N3/047 , G06N3/048 , G06N3/084 , G06N3/088 , H04N19/42 , H04N19/436
CPC classification number: G06T9/002 , G06N3/044 , G06N3/045 , G06N3/047 , G06N3/048 , G06N3/084 , G06N3/088 , H04N19/42 , H04N19/436
Abstract: In an example, an apparatus comprises logic, at least partially including hardware logic, to implement a lossy compression algorithm which utilizes a data transform and quantization process to compress data in a convolutional neural network (CNN) layer. Other embodiments are also disclosed and claimed.
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公开(公告)号:US12130724B2
公开(公告)日:2024-10-29
申请号:US16912545
申请日:2020-06-25
Applicant: Intel Corporation
Inventor: Gilad Shayevitz , Tsvika Kurts , Vladislav Kopzon , Reuven Rozic , Yaniv Hayat
CPC classification number: G06F11/3636 , G06F11/3476 , G06F11/3688 , G06F11/3692 , G06F13/385 , G06F13/4282
Abstract: A system can include a host machine connected to a device under test (DUT) by a serial link. The host machine can include a serial interface, such as a Thunderbolt interface, and a memory. The DUT can include a trace data source, a high-speed trace interface (HTI) to receive trace data from the trace data source, a serial interface (such as a Thunderbolt interface), and a PIPE interface connecting the HTI with the serial interface. The HTI is to send the trace data to the serial interface through the PIPE interface. The serial interface is to packetize the trace data into a conforming packet format, and send the trace data as a packet across the serial link to the host machine. The host machine can receive the trace data at the host-side serial interface, store the trace data in memory, and process the trace data for debugging the DUT.
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公开(公告)号:US12130665B2
公开(公告)日:2024-10-29
申请号:US17230724
申请日:2021-04-14
Applicant: Intel Corporation
Inventor: Jeff Ku , Gavin Sung , Ivan Wang , Tim Liu , Jason Y. Jiang
CPC classification number: G06F1/1632 , G06F1/1616 , G06F1/1681 , G06F1/266 , H02J7/0042 , H02J7/0044 , H02J50/10 , H02J50/80
Abstract: An example portable computer disclosed herein includes a first housing, a keyboard carried by the first housing, a second housing pivotally coupled to the first housing, a display carried by the second housing, a wireless charger, and a pad to carry the wireless charger. The pad is pivotally coupled to the first housing. The pad is moveable relative to the first housing between a first orientation to position the wireless charger above the first housing and a second orientation to position the wireless charger adjacent the first housing. The pad to support a body part of a user adjacent the keyboard when the pad is in the first orientation. The pad is to support an external electronic device proximate the wireless charger when the pad is in the second orientation.
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公开(公告)号:US20240357285A1
公开(公告)日:2024-10-24
申请号:US18757676
申请日:2024-06-28
Applicant: Intel Corporation
Inventor: Adam Kupryjanow , Jan Banas , Pawel Trella
CPC classification number: H04R3/005 , H04R29/005 , H04M3/568
Abstract: Techniques are provided herein for auto-muting procedures that result in efficient high-quality audio capture in a multi-device environment. In particular, when there are multiple computing devices in a shared meeting room, the microphone with the highest rated audio input is selected for the teleconference audio input from the shared environment. Each computing device connected to the teleconference from the meeting room determines a score for its microphone signal. The score is shared with the other devices in the room, and the microphone signal with the highest score is transmitted to the conference. Host-based systems include a host device receiving and reviewing the scores and determining which microphones to auto-mute. Other distributed systems include each computing device transmitting its score to the other devices and receiving the scores from the other devices, and each device determining whether to auto-mute.
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公开(公告)号:US20240356799A1
公开(公告)日:2024-10-24
申请号:US18757138
申请日:2024-06-27
Applicant: Intel Corporation
Inventor: Patrick L. Connor , Marcos Emanuel Carranza , Cesar Ignacio Martinez-Spessot , Mateo Guzman , Mariano Ortega de Mues
IPC: H04L41/0803 , H04L41/085
CPC classification number: H04L41/0803 , H04L41/085
Abstract: Methods, apparatus, systems, and articles of manufacture to manage configuration assets for network devices are disclosed. Example instructions cause at least one programmable circuit to generate network infrastructure instructions using a model, the network infrastructure instructions based on a configuration request and on a network infrastructure; and deploy a program corresponding to the network infrastructure instructions to at least one device in the network infrastructure.
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公开(公告)号:US20240356739A1
公开(公告)日:2024-10-24
申请号:US18759366
申请日:2024-06-28
Applicant: Intel Corporation
Inventor: Mats Agerstam , Venkata R. Vallabhu
IPC: H04L9/08 , H04L9/40 , H04L41/0803 , H04L41/28 , H04L67/00 , H04L67/12 , H04L67/141 , H04L67/51 , H04L69/14 , H04W4/70 , H04W4/80 , H04W8/00 , H04W12/02 , H04W12/037 , H04W12/04 , H04W12/0471 , H04W52/38 , H04W76/11 , H04W76/14 , H04W88/06 , H04W88/12
CPC classification number: H04L9/0841 , H04L41/0803 , H04L41/28 , H04L63/061 , H04L63/18 , H04L63/20 , H04L67/141 , H04L67/34 , H04L67/51 , H04L69/14 , H04W8/005 , H04W12/02 , H04W12/037 , H04W12/04 , H04W12/0471 , H04W52/38 , H04W76/11 , H04W76/14 , H04L67/12 , H04W4/70 , H04W4/80 , H04W88/06 , H04W88/12
Abstract: Disclosed in some examples are methods, systems, and machine readable mediums for secure, low end-user effort computing device configuration. In some examples the IoT device is configured via a user's computing device over a short range wireless link of a first type. This short range wireless communication may use a connection establishment that does not require end-user input. For example, the end user will not have to enter, or confirm a PIN number or other authentication information such as usernames and/or passwords. This allows configuration to involve less user input. In some examples, to prevent man-in-the-middle attacks, the power of a transmitter in the IoT device that transmits the short range wireless link is reduced during a configuration procedure so that the range of the transmissions to and from the user's computing device are reduced to a short distance.
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公开(公告)号:US20240356198A1
公开(公告)日:2024-10-24
申请号:US18761473
申请日:2024-07-02
Applicant: Intel Corporation
Inventor: Sidharth Dalmia , Trang Thai
CPC classification number: H01Q1/2283 , H01L23/66 , H01Q9/0407 , H01Q21/065 , H01L2223/6677 , H01L2924/1421 , H01L2924/15153 , H01L2924/15311
Abstract: Disclosed herein are antenna boards, integrated circuit (IC) packages, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an IC package having a die and a package substrate, and the package substrate has a recess therein; and an antenna patch, coupled to the package substrate, such that the antenna patch is over or at least partially in the recess.
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公开(公告)号:US20240355768A1
公开(公告)日:2024-10-24
申请号:US18761443
申请日:2024-07-02
Applicant: Intel Corporation
Inventor: Adel A. Elsherbini , Krishna Bharath , Kevin P. O'Brien , Kimin Jun , Han Wui Then , Mohammad Enamul Kabir , Gerald S. Pasdast , Feras Eid , Aleksandar Aleksov , Johanna M. Swan , Shawna M. Liff
IPC: H01L23/00 , H01L25/065
CPC classification number: H01L24/08 , H01L24/05 , H01L24/29 , H01L24/32 , H01L25/0657 , H01L28/10 , H01L2224/05147 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/0801 , H01L2224/08145 , H01L2224/0903 , H01L2224/09055 , H01L2224/09505 , H01L2224/29186 , H01L2224/32145
Abstract: Disclosed herein are microelectronic assemblies including microelectronic components that are coupled together by direct bonding, as well as related structures and techniques. For example, in some embodiments, a microelectronic assembly may include a first microelectronic component and a second microelectronic component coupled to the first microelectronic component by a direct bonding region, wherein the direct bonding region includes at least part of an inductor.
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