公开(公告)号：US20140167688A1

公开(公告)日：2014-06-19

申请号：US13716376

申请日：2012-12-17

Applicant: Brian S. Doyle ,  Aleksandar Aleksov ,  Ravindranath V. Mahajan

Inventor： Brian S. Doyle ,  Aleksandar Aleksov ,  Ravindranath V. Mahajan

IPC: H02J7/00

CPC classification number: H02J7/0004 ,  H02J7/0013 ,  H02J7/0042 ,  H02J7/0044 ,  H02J7/025 ,  H02J50/00 ,  H02J50/10 ,  H02J50/12 ,  H02J50/40 ,  H02J50/70 ,  H02J50/80 ,  Y02B40/90 ,  Y02E60/12

Abstract: A wireless charging system includes a microelectronic package (110) containing a system on chip (120) (an SoC), an energy transfer unit (140), and a software protocol (127). The SoC includes a processing device (121), a memory device (122) coupled to the processing device, and a communications device (123) coupled to the processing device and the memory device. The communications device is capable of communicating wirelessly with an external electronic device (130). The energy transfer unit is capable of transferring energy to the external electronic device. The software protocol is implemented in the memory device and is capable of detecting a charging profile of the external electronic device and capable of adjusting a parameter of the energy transfer unit according to a requirement of the charging profile.

Abstract translation: 一种无线充电系统包括一个包含片上系统（SoC），能量传输单元（140）和软件协议（127）的微电子封装（110）。 SoC包括处理设备（121），耦合到处理设备的存储设备（122）以及耦合到处理设备和存储设备的通信设备（123）。 通信设备能够与外部电子设备（130）进行无线通信。 能量传递单元能够将能量传递到外部电子设备。 软件协议在存储装置中实现，能够检测外部电子装置的充电曲线，并且能够根据充电曲线的要求调整能量转移单元的参数。

公开(公告)号：US20140120696A1

公开(公告)日：2014-05-01

申请号：US14146877

申请日：2014-01-03

Applicant: Aleksandar Aleksov ,  Arnab Sarkar ,  Henning Braunisch ,  Jerry R. Bautista

Inventor： Aleksandar Aleksov ,  Arnab Sarkar ,  Henning Braunisch ,  Jerry R. Bautista

IPC: H01L21/78

CPC classification number: H01L21/78 ,  H01L22/32 ,  H01L23/52 ,  H01L23/585 ,  H01L24/05 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/16145 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/14 ,  H01L2224/05552 ,  H01L2924/00

Abstract: The present disclosure relates to the field of microelectronic die packaging, particularly multi-chip packaging, wherein on-substrate modularity is enabled by using in-street die-to-die interconnects to facilitate signal routing between microelectronic dice. These in-street die-to-die interconnects may allow for manufacturing of several products on a single microelectronic substrate, which may lead to improved microelectronic die and/or microelectronic module harvesting and increased product yields.

Abstract translation: 本公开内容涉及微电子管芯封装领域，特别是多芯片封装，其中通过使用街道芯片间管芯互连以实现微电子管芯之间的信号路由，能够实现基板上的模块化。 这些在街头的模 - 芯互连可以允许在单个微电子衬底上制造几个产品，这可以导致改进的微电子管芯和/或微电子模块收获和增加的产品产量。

公开(公告)号：US20130224444A1

公开(公告)日：2013-08-29

申请号：US13855100

申请日：2013-04-02

Applicant: ALEKSANDAR ALEKSOV ,  RAJASEKARAN SWAMINATHAN ,  TING ZHONG

Inventor： ALEKSANDAR ALEKSOV ,  RAJASEKARAN SWAMINATHAN ,  TING ZHONG

IPC: H01F1/01

CPC classification number: H01F1/01 ,  B23K1/0016 ,  B23K1/20 ,  H01L24/05 ,  H01L24/13 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05547 ,  H01L2224/0556 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13584 ,  H01L2224/16225 ,  H01L2224/75264 ,  H01L2224/81192 ,  H01L2224/81222 ,  H01L2224/81234 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T428/24612 ,  H01L2924/00 ,  H01L2224/05552

Abstract: The present disclosure relates to the field of fabricating microelectronic packages, wherein components of the microelectronic packages may have magnetic attachment structures comprising a magnetic component and a metal component. The magnetic attachment structure may be exposed to a magnetic field, which, through the vibration of the magnetic component, can heat the magnetic attachment structure, and which when placed in contact with a solder material can reflow the solder material and attach microelectronic components of the microelectronic package.

Abstract translation: 本公开涉及制造微电子封装的领域，其中微电子封装的部件可具有包括磁性部件和金属部件的磁性附接结构。 磁性附着结构可能暴露于磁场，通过磁性部件的振动可以加热磁性附着结构，并且当与焊料材料接触时，磁性附着结构可以回流焊料材料并附着微电子部件 微电子封装。

公开(公告)号：US20120152601A1

公开(公告)日：2012-06-21

申请号：US13374858

申请日：2012-01-19

Applicant: Aleksandar Aleksov ,  Vladimir Noveski ,  Sujit Sharan ,  Shankar Ganapathysubramanian

Inventor： Aleksandar Aleksov ,  Vladimir Noveski ,  Sujit Sharan ,  Shankar Ganapathysubramanian

IPC: H05K1/03 ,  B23K1/20 ,  B23K31/02 ,  B05D5/12 ,  B05D3/00

CPC classification number: H05K1/0201 ,  H01L21/4807 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/107 ,  H05K3/205 ,  H05K3/388 ,  H05K3/4617 ,  H05K3/4629 ,  H05K3/4647 ,  H05K2201/0175 ,  H05K2201/0187 ,  H05K2201/0376 ,  H05K2201/096 ,  H05K2201/09881 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A layer or layers for use in package substrates and die spacers are described. The layer or layers include a plurality of ceramic wells lying within a plane and separated by metallic vias. Recesses within the ceramic wells are occupied by a dielectric filler material.

Abstract translation: 描述了用于封装衬底和管芯间隔件的层或层。 层或层包括位于平面内并由金属通孔分开的多个陶瓷阱。 陶瓷井内的凹陷由介电填料材料占据。

公开(公告)号：US20110278044A1

公开(公告)日：2011-11-17

申请号：US12778313

申请日：2010-05-12

Applicant: Aleksandar Aleksov ,  Rajasekaran Swaminathan ,  Ting Zhong

Inventor： Aleksandar Aleksov ,  Rajasekaran Swaminathan ,  Ting Zhong

IPC: H01B5/00 ,  B23K31/02

CPC classification number: H01F1/01 ,  B23K1/0016 ,  B23K1/20 ,  H01L24/05 ,  H01L24/13 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05547 ,  H01L2224/0556 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13584 ,  H01L2224/16225 ,  H01L2224/75264 ,  H01L2224/81192 ,  H01L2224/81222 ,  H01L2224/81234 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T428/24612 ,  H01L2924/00 ,  H01L2224/05552

Abstract: The present disclosure relates to the field of fabricating microelectronic packages, wherein components of the microelectronic packages may have magnetic attachment structures comprising a magnetic component and a metal component. The magnetic attachment structure may be exposed to a magnetic field, which, through the vibration of the magnetic component, can heat the magnetic attachment structure, and which when placed in contact with a solder material can reflow the solder material and attach microelectronic components of the microelectronic package.

Abstract translation: 本公开涉及制造微电子封装的领域，其中微电子封装的部件可具有包括磁性部件和金属部件的磁性附接结构。 磁性附着结构可能暴露于磁场，通过磁性部件的振动可以加热磁性附着结构，并且当与焊料材料接触时，磁性附着结构可以回流焊料材料并附着微电子部件 微电子封装。

公开(公告)号：US20200105731A1

公开(公告)日：2020-04-02

申请号：US16145620

申请日：2018-09-28

Applicant: Aleksandar Aleksov ,  Sri Ranga Sai Boyapati ,  Kristof Darmawikarta ,  Rahul N. Manepalli ,  Robert Alan May ,  Srinivas V. Pietambaram

Inventor： Aleksandar Aleksov ,  Sri Ranga Sai Boyapati ,  Kristof Darmawikarta ,  Rahul N. Manepalli ,  Robert Alan May ,  Srinivas V. Pietambaram

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/538 ,  H01L23/373

Abstract: The present description addresses example methods for forming multi-chip microelectronic devices and the resulting devices. The multiple semiconductor die of the multichip package will be attached to a solid plate with a bonding system selected to withstand stresses applied when a mold material is applied to encapsulate the die of the multichip device. The solid plate will remain as a portion of the finished multi-chip device. The solid plate can be a metal plate to function as a heat spreader for the completed multi-chip device.

公开(公告)号：US20190200451A1

公开(公告)日：2019-06-27

申请号：US16328532

申请日：2016-09-29

Applicant: SASHA OSTER ,  Georgios Dogiamis ,  TELESPHOR KAMGAING ,  Adel Elsherbini ,  Shawna Liff ,  Aleksandar Aleksov ,  JOHANNA SWAN

Inventor： SASHA OSTER ,  Georgios Dogiamis ,  TELESPHOR KAMGAING ,  Adel Elsherbini ,  Shawna Liff ,  Aleksandar Aleksov ,  JOHANNA SWAN

IPC: H05K1/02 ,  H01L23/66 ,  H01L25/065 ,  H01L25/11 ,  H05K3/36 ,  H01L25/16 ,  H05K1/14

CPC classification number: H05K1/0243 ,  H01L23/66 ,  H01L25/0655 ,  H01L25/117 ,  H01L25/16 ,  H01L25/165 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/10545

Abstract: A millimeter wave (mm-wave) communication interface includes a first semiconductor package coupled to a first substrate and a second semiconductor package coupled to a second substrate. The second substrate may be coupled at approximately a 90° angle to the first substrate. The second semiconductor package may include a mm-wave die that modulates digital data on a high frequency microwave signal and a mm-wave launcher that launches the modulated high-frequency microwave signal into a waveguide member operably coupled to the second substrate. In such an implementation, the waveguide member may beneficially exit the second substrate along a longitudinal axis parallel to the principal plane of the first substrate. Advantageously, all high-frequency components are close coupled to the second substrate without the use of an intervening interface.

公开(公告)号：US20190003882A1

公开(公告)日：2019-01-03

申请号：US15635881

申请日：2017-06-28

Applicant: Aleksandar Aleksov ,  Michael C. Rifani ,  Sasha N. Oster ,  Adel A. Elsherbini

Inventor： Aleksandar Aleksov ,  Michael C. Rifani ,  Sasha N. Oster ,  Adel A. Elsherbini

IPC: G01J1/44 ,  G02B6/42 ,  G01J1/42 ,  G01J1/08 ,  G01J1/04

CPC classification number: G02B6/1221 ,  G02B6/4253 ,  H04B10/801 ,  H04B10/807 ,  H05K1/0274

Abstract: Various embodiments disclosed relate to a stretchable packaging system. The system includes a first electronic component. The first electronic component includes a first optical emitter. The system further includes a second electronic component. The second electronic component includes a first receiver. An optical interconnect including a first elastomer having a first refractive index connects the first optical emitter to the first receiver. An encapsulate layer including a second elastomer having a second refractive index at least partially encapsulates the first electronic component, the second electronic component, and the optical interconnect.

公开(公告)号：US20180090803A1

公开(公告)日：2018-03-29

申请号：US15280823

申请日：2016-09-29

Applicant: ADEL A. ELSHERBINI ,  SASHA N. OSTER ,  JOHANNA M. SWAN ,  GEORGIOS C. DOGIAMIS ,  SHAWNA M. LIFF ,  ALEKSANDAR ALEKSOV ,  TELESPHOR KAMGAING

Inventor： ADEL A. ELSHERBINI ,  SASHA N. OSTER ,  JOHANNA M. SWAN ,  GEORGIOS C. DOGIAMIS ,  SHAWNA M. LIFF ,  ALEKSANDAR ALEKSOV ,  TELESPHOR KAMGAING

IPC: H01P5/08 ,  H01P11/00

CPC classification number: H01P5/1007 ,  H01P5/10 ,  H01P5/107 ,  H01Q13/02

Abstract: The systems and methods described herein provide a traveling wave launcher system physically and communicably coupled to a semiconductor package and to a waveguide. The traveling wave launcher system includes a slot-line signal converter and a tapered slot launcher. The slot-line signal converter may be formed integral with the semiconductor package and includes a balun structure that converts the microstrip signal to a slot-line signal. The tapered slot launcher is communicably coupled to the slot-line signal converter and includes a first plate and a second plate that form a slot. The tapered slot launcher converts the slot-line signal to a traveling wave signal that is propagated to the waveguide.

公开(公告)号：US20180026393A1

公开(公告)日：2018-01-25

申请号：US15215531

申请日：2016-07-20

Applicant: Feras Eid ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Aleksandar Aleksov ,  Johanna M. Swan ,  Amit Sudhir Baxi ,  Vincent S. Mageshkumar

Inventor： Feras Eid ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Aleksandar Aleksov ,  Johanna M. Swan ,  Amit Sudhir Baxi ,  Vincent S. Mageshkumar

IPC: H01R13/62 ,  H01R13/631 ,  H01R13/627

CPC classification number: H01R13/6205 ,  H01R11/30 ,  H01R13/627 ,  H01R13/631

Abstract: Discussed generally herein are methods and devices including or providing a magnetic, detachable, conductive connector to provide an electrical and mechanical connection between parts. A device can include a first substrate, at least one electric component on or at least partially in a first surface of the first substrate, an adhesive on the first surface of the first substrate to temporarily attached the device to skin of a user, a contact pad electrically coupled to an electric component of the at least one electric component, the contact pad on or at least partially in a second surface of the substrate, the first surface opposite the second surface, and a conductive magnetic connector electrically and mechanically connected to the contact pad through a first conductive adhesive.