Abstract:
A radio frequency (RF) module includes a multilayer substrate having dielectric layers and metallization layers that include one or more circuit elements. The metallization layers are located between the dielectric layers. The RF module also includes a symmetric transmission input associated with the multilayer substrate, an RF element on the multilayer substrate to provide RF functionality, and a balun integrated in the substrate behind the symmetric transmission input.
Abstract:
A duplexer/diplexer comprising at least a transmission branch and a reception branch. The transmission branch and the reception branch are modularly connected by shielding, and are arranged such that the two branches are matched to an identical value of resistance (50 Ohms) in their passband, and offer broadband high-impedance in the stopband of the band neighboring the passband. As a result, all three ports of the duplexer/diplexer are matched to the same value of resistance given parallel connection of the two branches.
Abstract:
A substantially non-aqueous, free-flowing, storable liquid washing or cleaning formulation comprising:A) from more than 20 to less than 78% by weight of at least one nonionic surfactant;B) from 0.1 to 25% by weight of at least one anionic surfactant;C) from 1 to less than 20% by weight of at least one water-soluble builder; andD) from more than 20 to 35% by weight of at least one bleaching agent.
Abstract:
A ceramic resonator for microwave ceramic filters includes a ceramic body having a predetermined form with surfaces and edges. The ceramic body has an internal conductor bore formed therein and is metallized on all of the surfaces except for at least one at least partially unmetallized surface. One of the surfaces has an aperture window formed therein for coupling to other ceramic resonators to form a microwave ceramic filter. At least one of the edges has a chamfer formed thereon.
Abstract:
A method for soldering a ceramic body of an electric component, such as a microwave resonator, into a metal housing, includes applying a tin layer over the ceramic body provided with an electrically conductive layer. A high-melting-point lead-tin passivation layer is applied to a surface of the housing to be soldered to the ceramic body.
Abstract:
A film stack made from compacted green films and capable of being sintered to form a ceramic component with monolithic multi-layer structure is disclosed. The film stack includes a functional layer comprising a green film comprising a functional ceramic and a tension layer comprising a green film comprising a dielectric material. The tension layer is directly adjacent to the functional layer in the multi-layer structure. The multilayer structure also includes a first metallization plane and a second metallization plane. The functional layer is between the first metallization plane and the second metallization plane.
Abstract:
A front end module has two signal paths for operation in two different frequency ranges which can be operated both with one antenna in the multiplex operating mode and with two antennas in a second operating mode. The respective operating mode is actuated via corresponding contact being made with the module substrate, and therefore by the user.
Abstract:
An electrical component with a filter circuit is specified that includes a first bandstop filter and a second bandstop filter. The first bandstop filter includes at least one resonator operating with acoustic waves and has a first stop band. The second bandstop filter includes LC elements and has a second stop band that lies at least one octave higher than the first stop band.
Abstract:
An electrical component includes ceramic layers that are stacked to form a base body, electrode layers among the ceramic layers to form at least one capacitor, at least one phase gate on a ceramic layer that corresponds to a surface of the base body, contact surfaces on a top surface of the base body, and through contacts that electrically connect the electrode layers to the contact surfaces. The through contacts are inside the base body at least in part. Side surfaces of the base body are substantially free of surface metallic contacts and of metal plating.
Abstract:
An electrical component includes an amplifier that includes an output stage, and a power-supply path for powering the output stage. The power supply path includes a line that includes conductor track sections in parallel. The electrical component also includes a carrier substrate containing the amplifier and the line with the conductor tracks.