公开(公告)号：US5920052A

公开(公告)日：1999-07-06

申请号：US998659

申请日：1997-12-29

Applicant: Seok Won Lee

Inventor： Seok Won Lee

IPC: H02B13/035 ,  H01H33/66

CPC classification number: H02B13/0352

Abstract: A multi-circuit switch gear includes a main body filled with an insulation gas, main bushings mounted on a front portion of the main body, a plurality of three-phase input/output units connected to the main bushings, multi-position switching devices disposed inside the main body for switching between a turn-on state, a turn-off state, and an earthed stated, automatic contact devices disposed at a front surface portion of the main body, earth bushings mounted on the respective side portions of the input/output units, moldcone connection members coupled to the earth bushings, and earth terminals connected to the moldcone connection members. The multi-circuit switch gear allows a current discharge operation to occur in the insulation gas provided in the main body during the earthing operation, thereby increasing workers' safety and facilitating an insulation test via the connection members with regard to the underground insulation cable.

Abstract translation: 多回路开关装置包括填充有绝缘气体的主体，安装在主体前部的主衬套，与主衬套连接的多个三相输入/输出单元，多位置切换装置 在主体内部，用于在导通状态，关断状态和设置在主体的前表面部分处的接地的自动接触装置之间切换，安装在输入/输出端的各个侧部的接地套管， 输出单元，耦合到接地套管的模具连接构件，以及连接到模具连接构件的接地端子。 多路开关装置允许在接地操作期间在设置在主体中的绝缘气体中发生电流放电操作，从而增加工人的安全性并且通过连接构件对地下绝缘电缆进行绝缘测试。

公开(公告)号：US5815227A

公开(公告)日：1998-09-29

申请号：US699513

申请日：1996-08-16

Applicant: Seok-won Lee

Inventor： Seok-won Lee

IPC: G02B6/00 ,  F21V8/00 ,  F21V19/00 ,  G02F1/1335 ,  G02F1/13357 ,  F21V7/04

CPC classification number: G02F1/133615 ,  F21V19/008

Abstract: There is provided a backlight for an LCD, comprising a light-inducing plate installed on the bottom surface of the LCD, a lamp installed on one side portion of the light-inducing plate, to irradiate light to the LCD, and a lamp cover enclosing a part of the outer circumferential surface of the lamp, for reflecting the light from the LCD to the light-inducing plate, wherein the light-inducing plate and lamp cover are directly coupled with each other by a locking structure. Therefore, the simplification of the structure facilitates the backlight assembly, and the restriction on securing a space for receiving a conductive wire can be overcome.

Abstract translation: 提供了一种用于LCD的背光源，包括安装在LCD的底面上的导光板，安装在导光板的一个侧面上的灯，以将光照射到LCD，以及将灯罩封闭 灯的外周面的一部分，用于将来自LCD的光反射到导光板，其中，所述导光板和灯罩通过锁定结构彼此直接耦合。 因此，简化结构有助于背光组件，并且可以克服固定用于接收导线的空间的限制。

公开(公告)号：US5726746A

公开(公告)日：1998-03-10

申请号：US749973

申请日：1996-11-15

Applicant: Heui-Jae Park ,  Seok-Won Lee ,  Geon-Mo Kang ,  Ho-Gyun Moon

Inventor： Heui-Jae Park ,  Seok-Won Lee ,  Geon-Mo Kang ,  Ho-Gyun Moon

IPC: G01M11/02 ,  G01M11/00

CPC classification number: G01M11/0221 ,  G01M11/0292

Abstract: An automatic inspection system for camera lenses and method thereof using a line charge coupled device (CCD) which can process a signal easily and perceive a focal distance of lenses exactly by focusing automatically using a modulation transfer function (MTF) method when designing lenses. The automatic inspection system for camera lenses using a line CCD comprises a light source, a chart, a collimator, camera lenses, a mirror, an image pickup part, a signal converter, and a control part.

Abstract translation: 一种用于摄像机镜头的自动检查系统及其使用线电荷耦合器件（CCD）的方法，其可以容易地处理信号并且在设计透镜时通过使用调制传递函数（MTF）方法自动聚焦来感知透镜的焦距。 使用线CCD的相机镜头的自动检查系统包括光源，图表，准直器，照相机镜头，镜子，图像拾取部分，信号转换器和控制部分。

公开(公告)号：US20170200736A1

公开(公告)日：2017-07-13

申请号：US15349084

申请日：2016-11-11

Applicant: Jinwoo PARK ,  Jaeshin PARK ,  Joyoung PARK ,  Jiwoong SUE ,  Seok-Won LEE

Inventor： Jinwoo PARK ,  Jaeshin PARK ,  Joyoung PARK ,  Jiwoong SUE ,  Seok-Won LEE

IPC: H01L27/115 ,  H01L21/768 ,  H01L23/528 ,  H01L27/02 ,  H01L29/06

CPC classification number: H01L27/11582 ,  H01L21/76879 ,  H01L23/5283 ,  H01L27/0207 ,  H01L27/11565 ,  H01L27/1157 ,  H01L27/11575 ,  H01L29/0649

Abstract: A semiconductor memory device includes a substrate that includes a first cell array region and a peripheral region, a plurality of stack structures that extend in the first direction on the first cell array region and are spaced apart from each other in a second direction crossing the first direction, an insulation layer that covers the stack structures, and at least one separation structure that extends in the second direction on the peripheral region and penetrates the insulation layer in a direction normal to a top surface of the substrate.

公开(公告)号：US08354735B2

公开(公告)日：2013-01-15

申请号：US12875382

申请日：2010-09-03

Applicant: Jung-Do Lee ,  Jongkook Kim ,  Seok Won Lee ,  Jaesik Lee ,  Hohyeuk Im ,  Su-min Park

Inventor： Jung-Do Lee ,  Jongkook Kim ,  Seok Won Lee ,  Jaesik Lee ,  Hohyeuk Im ,  Su-min Park

IPC: H01L23/544

CPC classification number: H01L21/78 ,  H01L23/562 ,  H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided is a semiconductor chip. The semiconductor chip includes a semiconductor substrate including a main chip region and a scribe lane region surrounding the main chip region. An insulating layer is disposed over the semiconductor substrate. A guard ring is disposed in the insulating layer in the scribe lane region. The guard ring surrounds at least a portion of the main chip region. The guard ring has a brittleness greater than a brittleness of the insulating layer.

Abstract translation: 提供了一种半导体芯片。 半导体芯片包括包括主芯片区域和围绕主芯片区域的划线通道区域的半导体衬底。 绝缘层设置在半导体衬底上。 保护环设置在划线区域的绝缘层中。 防护环围绕主芯片区域的至少一部分。 保护环的脆性大于绝缘层的脆性。

公开(公告)号：US08221995B2

公开(公告)日：2012-07-17

申请号：US12663841

申请日：2008-06-27

Applicant: Seok-Won Lee ,  Kelline M. Rodems ,  David W. Oelschlager ,  Uday Kumar Veeramallu ,  Joseph A. Buechler ,  Paul H. McPherson

Inventor： Seok-Won Lee ,  Kelline M. Rodems ,  David W. Oelschlager ,  Uday Kumar Veeramallu ,  Joseph A. Buechler ,  Paul H. McPherson

IPC: G01N33/00

CPC classification number: G01N33/6893 ,  G01N2333/521 ,  G01N2800/26 ,  G01N2800/50 ,  G01N2800/56

Abstract: The present invention relates to methods and compositions for diagnosing SIRS, sepsis, severe sepsis, septic shock, or MODS in a subject, or assigning a prognostic risk for one or more clinical outcomes for a subject suffering from SIRS, sepsis, severe sepsis, septic shock, or MODS, the method comprising performing an immunoassay for CCL23 splice variant.

Abstract translation: 本发明涉及用于诊断受试者的SIRS，败血症，严重败血症，败血性休克或MODS的方法和组合物，或为患有SIRS，败血症，严重败血症，败血症的受试者分配一种或多种临床结果的预后风险 休克或MODS，所述方法包括对CCL23剪接变体进行免疫测定。

公开(公告)号：US20110233771A1

公开(公告)日：2011-09-29

申请号：US13073250

申请日：2011-03-28

Applicant: Heung-kyu Kwon ,  Seok-won Lee ,  Hyon-chol Kim ,  Su-chang Lee ,  Chi-young Lee

Inventor： Heung-kyu Kwon ,  Seok-won Lee ,  Hyon-chol Kim ,  Su-chang Lee ,  Chi-young Lee

IPC: H01L23/488

CPC classification number: H01L24/17 ,  H01L22/12 ,  H01L22/20 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/00 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package can include a substrate body having a first surface and a second surface. A semiconductor chip can be mounted on the first surface and a plurality of electrode pads can be on the second surface and selectively formed to have progressively smaller or larger sizes extending from a central region of the substrate body toward an outer edge of the substrate body based on a reflow soldering process warpage profile for the semiconductor package.

Abstract translation: 半导体封装可以包括具有第一表面和第二表面的衬底本体。 半导体芯片可以安装在第一表面上，并且多个电极焊盘可以在第二表面上并且选择性地形成为具有从基板主体的中心区域朝向基板主体的外边缘延伸的逐渐变小或更大的尺寸 在半导体封装的回流焊工艺翘曲曲线上。

公开(公告)号：US07315086B2

公开(公告)日：2008-01-01

申请号：US11181145

申请日：2005-07-13

Applicant: Dong-Han Kim ,  Sa-Yoon Kang ,  Seok-Won Lee

Inventor： Dong-Han Kim ,  Sa-Yoon Kang ,  Seok-Won Lee

IPC: H01L23/42 ,  H01L23/58 ,  H01L23/14

CPC classification number: H01L23/49816 ,  H01L23/13 ,  H01L23/5384 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/90 ,  H01L2224/11334 ,  H01L2224/13144 ,  H01L2224/16237 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/81201 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/90 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/112 ,  H05K1/189 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/0401 ,  H01L2924/00012

Abstract: A chip-on-board (COB) package has a flip chip assembly structure and is used for an integrated circuit (IC) card. The COB package has conductive patterns as contact terminals on an outer surface of a non-conductive film, and an IC chip on an inner surface of the film. The film has a number of holes through which the conductive patterns are partly exposed. A number of conductive bumps on an active surface of the IC chip face the inner surface of the film and enter corresponding holes in the non-conductive film to mechanically join and electrically couple to the conductive patterns. The disclosed COB package and a related manufacturing method allow a reduction in production cost, simplified process, better electrical connections, and improved reliability.

Abstract translation: 片上芯片（COB）封装具有倒装芯片组装结构，用于集成电路（IC）卡。 COB封装具有作为非导电膜的外表面上的接触端子的导电图案和膜的内表面上的IC芯片。 该膜具有多个孔，导电图案通过该孔部分露出。 IC芯片的有源表面上的多个导电凸块面向薄膜的内表面，并且在非导电薄膜中进入相应的孔以机械地连接并电耦合到导电图案。 所公开的COB封装和相关制造方法允许降低生产成本，简化工艺，更好的电连接和改进的可靠性。

公开(公告)号：US07224416B2

公开(公告)日：2007-05-29

申请号：US10522481

申请日：2003-02-20

Applicant: Guy-Ho Cha ,  Jong-Dae Park ,  Se-In Chang ,  Seok-Won Lee

Inventor： Guy-Ho Cha ,  Jong-Dae Park ,  Se-In Chang ,  Seok-Won Lee

IPC: G02F1/1333

CPC classification number: G02B6/0088 ,  G02F1/133606 ,  G02F1/133615 ,  G02F2201/503 ,  G02F2201/54

Abstract: There are provided a backlight assembly (700) and an LCD device (1000) using the same. The backlight assembly (700) has an optical sheet (100) for improving light efficiency and optical properties thereof and an elastic adhesive member (130) disposed on the optical sheet (100). When the optical sheet (100) deforms with heat, the elastic adhesive member (130) may be expanded or contracted corresponding to deformation of the optical sheet (100) and absorb impact applied to LCD device. Accordingly, the backlight assembly (700) may prevent the optical sheet (100) from being wrinkled or scratched, thereby preventing display quality of the LCD device from being deteriorated.

Abstract translation: 提供了使用其的背光组件（700）和LCD装置（1000）。 背光组件（700）具有用于提高光效和光学特性的光学片（100）和设置在光学片（100）上的弹性粘合构件（130）。 当光学片（100）热变形时，弹性粘合构件（130）可以相应于光学片（100）的变形而膨胀或收缩，并吸收施加到LCD装置的冲击力。 因此，背光组件（700）可以防止光学片（100）起皱或划伤，从而防止LCD装置的显示质量恶化。

公开(公告)号：US20060239035A1

公开(公告)日：2006-10-26

申请号：US11472863

申请日：2006-06-22

Applicant: Yong-Gwang Won ,  Jong-Dae Park ,  Seok-Won Lee

Inventor： Yong-Gwang Won ,  Jong-Dae Park ,  Seok-Won Lee

IPC: F21V7/04

CPC classification number: G02B6/0031 ,  F21V7/22 ,  F21V29/89 ,  G02B6/0068 ,  G02B6/0071 ,  G02B6/0085 ,  G02B6/009 ,  G02F1/133385 ,  G02F1/133615

Abstract: There are provided a backlight assembly (200) and an LCD apparatus (110) having the same. A lamp unit (210, 220) is received in a first receiving container (300) having a first bottom surface (350) and a first sidewall (310) so that the lamp unit (210) faces the first sidewall. The lamp unit (210, 220) and the first receiving container (300) are received in a second receiving container (500) having a second bottom surface (550) and a second sidewall (510). A heat transfer member (261, 263) comprised of metal material having superior heat conductivity makes contact with the second receiving container (500) through the lamp unit (210, 220). The heat emitted from the lamp unit (210, 263) and discharged to exterior. Accordingly, the backlight assembly and the LCD apparatus may improve display characteristics thereof.