公开(公告)号：US20170283976A1

公开(公告)日：2017-10-05

申请号：US15630055

申请日：2017-06-22

Applicant: Applied Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson

IPC: C25D17/00

CPC classification number: C25D17/001 ,  C25D7/123 ,  C25D17/005 ,  C25D17/008

Abstract: An electroplating apparatus has a vessel for holding electrolyte. A head has a rotor including a contact ring for holding a wafer having a notch. The contact ring includes a perimeter voltage ring having perimeter contact fingers for contacting the wafer around the perimeter of the wafer, except at the notch. The contact ring also has a notch contact segment having one or more notch contact fingers for contacting the wafer at the notch. The perimeter voltage ring is insulated from the notch contact segment. A negative voltage source is connected to the perimeter voltage ring, and a positive voltage source connected to the notch contact segment. The positive voltage applied at the notch reduces the current crowding effect at the notch. The wafer is plated with a film having more uniform thickness.

公开(公告)号：US20170137959A1

公开(公告)日：2017-05-18

申请号：US14944585

申请日：2015-11-18

Applicant: APPLIED Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson

IPC: C25D21/18 ,  C25D17/10 ,  C25D17/00

CPC classification number: C25D21/18 ,  C25D3/38 ,  C25D17/001 ,  C25D17/002 ,  C25D17/10

Abstract: An electroplating system includes a processor has a vessel having a first or upper compartment and a second or lower compartment containing catholyte and anolyte, respectively, with an processor anionic membrane between them. An inert anode is located in the second compartment. A replenisher is connected to the vessel via catholyte return and supply lines and anolyte return and supply lines, to circulate catholyte and anolyte through compartments in the replenisher separated by a replenisher anionic membrane. The replenisher adds metal ions into the catholyte by moving ions from a bulk metal source, and moves anions from the anolyte through the anionic membrane and into the catholyte. Concentrations or metal ions and anions in the catholyte and the anolyte remain balanced.

公开(公告)号：US20160355941A1

公开(公告)日：2016-12-08

申请号：US15174735

申请日：2016-06-06

Applicant: APPLIED Materials, Inc.

Inventor： Bioh Kim ,  Marvin Bernt ,  Greg Wilson ,  Paul R. McHugh

IPC: C25D5/02 ,  H01L21/288 ,  C25D7/12 ,  C25D21/10 ,  C25D3/56

CPC classification number: C25D5/02 ,  C25D3/56 ,  C25D5/18 ,  C25D7/123 ,  C25D21/10 ,  H01L21/2885 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05111 ,  H01L2224/05116 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05169 ,  H01L2224/05173 ,  H01L2224/05568 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/05673 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/013 ,  H01L2924/0105

Abstract: Electric potential, current density, agitation, and deposition rate are controlled to deposit metal alloys, such as tin based solder alloys or magnetic alloys, with minimal variations in the weight ratios of alloying metals at different locations within the deposited metal alloy feature. Alternative embodiments include processes that form metal alloy features wherein the variation in weight ratio of alloying metals within the feature is not necessarily minimized, but is controlled to provide a desired variation. In addition to metal alloys, alternative embodiments include processes for improving the deposition of single metal features.

Abstract translation: 控制电势，电流密度，搅拌和沉积速率以沉积金属合金，例如锡基焊料合金或磁性合金，在沉积的金属合金特征中的不同位置处的合金金属的重量比的变化最小。 替代实施例包括形成金属合金特征的工艺，其中特征内的合金金属的重量比的变化不一定最小化，而是被控制以提供期望的变化。 除了金属合金之外，替代实施例包括用于改善单个金属特征沉积的方法。

公开(公告)号：US20160215409A1

公开(公告)日：2016-07-28

申请号：US14606775

申请日：2015-01-27

Applicant: APPLIED Materials, Inc.

Inventor： Gregory J. Wilson ,  Paul R. McHugh

IPC: C25D5/16 ,  C25D17/08 ,  C25D17/00 ,  C25D17/10 ,  H01L21/288 ,  C25D7/12

CPC classification number: C25D17/005 ,  C25D7/12 ,  C25D17/001 ,  C25D17/004 ,  C25D17/007 ,  C25D21/12

Abstract: An electro-processing apparatus has a contact ring including a seal which is able to compensate for electric field distortions created by a notch (or other irregularity) on the wafer or work piece. The shape of the contact ring at the notch is changed, to reduce current crowding at the notch. The change in shape changes the resistance of the current path between a thief electrode and the wafer edge to increase thief electrode current drawn from the region of the notch. As a result, the wafer is plated with a film having more uniform thickness.

Abstract translation: 电加工设备具有包括密封件的接触环，该密封件能够补偿由晶片或工件上的凹口（或其他不规则性）产生的电场失真。 切口处的接触环的形状改变，以减少切口处的电流拥挤。 形状的变化改变了窃贼电极和晶片边缘之间的电流路径的电阻，以增加从陷波区域引出的小电极电流。 结果，晶片被镀覆有更均匀厚度的膜。

公开(公告)号：US20250051951A1

公开(公告)日：2025-02-13

申请号：US18929416

申请日：2024-10-28

Applicant: Applied Materials, Inc.

Inventor： Paul R. McHugh ,  Charles Sharbono ,  Jing Xu ,  John L. Klocke ,  Sam K. Lee ,  Keith Edward Ypma

IPC: C25D5/18 ,  C25D5/02 ,  C25D7/12 ,  C25D17/00 ,  C25D21/12 ,  G06F30/20 ,  H01L21/768

Abstract: A method of plating substrates may include placing a substrate in a plating chamber comprising a liquid, and applying a current to the liquid in the plating chamber to deposit a metal on exposed portions of the substrate, where the current may include alternating cycles of a forward plating current and a reverse deplating current. To determine the current characteristics, a model of a substrate may be simulated during the plating process to generate data points that relate characteristics of the plating process and a pattern on the substrate to a range nonuniformity of material formed on the substrate during the plating process. Using information from the data points, values for the forward and reverse currents may be derived and provided to the plating chamber to execute the plating process.

公开(公告)号：US12104269B2

公开(公告)日：2024-10-01

申请号：US18111487

申请日：2023-02-17

Applicant: Applied Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson

IPC: C25D21/10 ,  C25D5/08 ,  C25D7/12 ,  C25D17/00 ,  C25D17/02

CPC classification number: C25D21/10 ,  C25D5/08 ,  C25D7/12 ,  C25D17/001 ,  C25D17/02

Abstract: Systems and methods for electroplating are described. The electroplating system may include a vessel configured to hold a first portion of a liquid electrolyte. The system may also include a substrate holder configured for holding a substrate in the vessel. The system may further include a first reservoir in fluid communication with the vessel. In addition, the system may include a second reservoir in fluid communication with the vessel. Furthermore, the system may include a first mechanism configured to expel a second portion of the liquid electrolyte from the first reservoir into the vessel. The system may also include a second mechanism configured to take in a third potion of the liquid electrolyte from the vessel into the second reservoir when the second portion of the liquid electrolyte is expelled from the first reservoir. Methods may include oscillating flow of the electrolyte within the vessel.

公开(公告)号：US20230313405A1

公开(公告)日：2023-10-05

申请号：US18129999

申请日：2023-04-03

Applicant: Applied Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson ,  Kwan Wook Roh ,  Kyle M. Hanson ,  Forrest G. Reinhart ,  David J. Reis ,  James E. Brown ,  Nolan L. Zimmerman

IPC: C25D17/00 ,  C25D3/38 ,  C25D21/04 ,  C25D21/02

CPC classification number: C25D17/002 ,  C25D3/38 ,  C25D21/04 ,  C25D21/02

Abstract: Embodiments of the present technology include electroplating methods that include providing a first portion of an electrolyte feedstock to a first compartment of an electrochemical cell. The first portion of an electrolyte feedstock may be characterized by an initial metal ion concentration and an initial acid concentration. The methods may include providing a second portion of an electrolyte feedstock to a second compartment of the electrochemical cell. The second compartment and first compartment may be separated by a first membrane. The methods may include providing an acidic solution to a third compartment of the electrochemical cell. The third compartment and second compartment may be separated by a second membrane. The acidic solution may be characterized by an initial acid concentration. The methods may include applying a current to an anode of the electrochemical cell. The anode of the electrochemical cell may be disposed proximate the first compartment and across from the first membrane.

公开(公告)号：US11697887B2

公开(公告)日：2023-07-11

申请号：US17078413

申请日：2020-10-23

Applicant: Applied Materials, Inc.

Inventor： Nolan L. Zimmerman ,  Charles Sharbono ,  Gregory J. Wilson ,  Paul R. McHugh ,  Paul Van Valkenburg ,  Deepak Saagar Kalaikadal ,  Kyle M. Hanson

IPC: C25D17/10 ,  C25D21/12 ,  C25D21/18 ,  C25D7/12 ,  C25D17/00

CPC classification number: C25D17/10 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D21/12 ,  C25D21/18

Abstract: Electroplating systems may include an electroplating chamber. The systems may also include a replenish assembly fluidly coupled with the electroplating chamber. The replenish assembly may include a first compartment housing anode material. The first compartment may include a first compartment section in which the anode material is housed and a second compartment section separated from the first compartment section by a divider. The replenish assembly may include a second compartment fluidly coupled with the electroplating chamber and electrically coupled with the first compartment. The replenish assembly may also include a third compartment electrically coupled with the second compartment, the third compartment including an inert cathode.

公开(公告)号：US20230092346A1

公开(公告)日：2023-03-23

申请号：US17478252

申请日：2021-09-17

Applicant: Applied Materials, Inc.

Inventor： Charles Sharbono ,  Paul R. McHugh ,  Gregory J. Wilson ,  John L. Klocke ,  Nolan L. Zimmerman

IPC: C25D5/02 ,  H01L21/288 ,  C25D7/12

Abstract: Exemplary electroplating systems may include a vessel. The systems may include a paddle disposed within the vessel. The paddle may be characterized by a first surface and a second surface. The first surface of the paddle may be include a plurality of ribs that extend upward from the first surface. The plurality of ribs may be arranged in a generally parallel manner about the first surface. The paddle may define a plurality of apertures through a thickness of the paddle. Each of the plurality of apertures may have a diameter of less than about 5 mm. The paddle may have an open area of less than about 15%.

公开(公告)号：US20210102307A1

公开(公告)日：2021-04-08

申请号：US17064785

申请日：2020-10-07

Applicant: Applied Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson

IPC: C25D21/10 ,  C25D17/02

Abstract: Systems and methods for electroplating are described. The electroplating system may include a vessel configured to hold a first portion of a liquid electrolyte. The system may also include a substrate holder configured for holding a substrate in the vessel. The system may further include a first reservoir in fluid communication with the vessel. In addition, the system may include a second reservoir in fluid communication with the vessel. Furthermore, the system may include a first mechanism configured to expel a second portion of the liquid electrolyte from the first reservoir into the vessel. The system may also include a second mechanism configured to take in a third potion of the liquid electrolyte from the vessel into the second reservoir when the second portion of the liquid electrolyte is expelled from the first reservoir. Methods may include oscillating flow of the electrolyte within the vessel.