公开(公告)号：US20110285002A1

公开(公告)日：2011-11-24

申请号：US13195973

申请日：2011-08-02

申请人： Byung Tai Do ,  Linda Pei Ee Chua ,  Heap Hoe Kuan

发明人： Byung Tai Do ,  Linda Pei Ee Chua ,  Heap Hoe Kuan

IPC分类号： H01L23/495

CPC分类号： H01L23/49548 ,  H01L21/4832 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49582 ,  H01L24/16 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/85411 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A leadless package system includes: an integrated circuit die having contact pads; external contact terminals with a conductive layer and an external coating layer; connections between contact pads in the integrated circuit die and the external contact terminals; and an encapsulant encapsulates the integrated circuit die and the external contact terminals including the external coating layer.

摘要翻译： 无引线封装系统包括：具有接触焊盘的集成电路管芯; 具有导电层和外部涂层的外部接触端子; 集成电路管芯中的接触焊盘和外部接触端子之间的连接; 并且密封剂封装集成电路管芯和包括外部涂层的外部接触端子。

公开(公告)号：US07960841B2

公开(公告)日：2011-06-14

申请号：US12496046

申请日：2009-07-01

申请人： Byung Tai Do ,  Heap Hoe Kuan

发明人： Byung Tai Do ,  Heap Hoe Kuan

IPC分类号： H01L23/48

CPC分类号： H01L23/49805 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/02371 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/45139 ,  H01L2224/48145 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15173 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor device is manufactured by, first, providing a wafer designated with a saw street guide. The wafer is taped with a dicing tape. The wafer is singulated along the saw street guide into a plurality of dies having a plurality of gaps between each of the plurality of dies. The dicing tape is stretched to expand the plurality of gaps to a predetermined distance. An organic material is deposited into each of the plurality of gaps. A top surface of the organic material is substantially coplanar with a top surface of a first die of the plurality of dies. A plurality of via holes is formed in the organic material. Each of the plurality of via holes is patterned to each of a plurality of bond pad locations on the plurality of dies. A conductive material is deposited in each of the plurality of via holes.

摘要翻译： 半导体器件通过首先提供指定有锯条导轨的晶片来制造。 晶片用切割胶带胶带。 将晶片沿着锯条导轨分割为具有在多个模具中的每一个之间具有多个间隙的多个模具。 切割带被拉伸以将多个间隙扩展到预定距离。 有机材料沉积在多个间隙中的每一个中。 有机材料的顶表面与多个管芯的第一管芯的顶表面基本共面。 在有机材料中形成多个通孔。 多个通孔中的每一个被图案化成多个管芯上的多个接合焊盘位置中的每一个。 导电材料沉积在多个通孔中的每一个中。

公开(公告)号：US07948066B2

公开(公告)日：2011-05-24

申请号：US11964501

申请日：2007-12-26

申请人： Byung Tai Do ,  Heap Hoe Kuan ,  Linda Pei Ee Chua

发明人： Byung Tai Do ,  Heap Hoe Kuan ,  Linda Pei Ee Chua

IPC分类号： H01L23/495 ,  H01L21/44

CPC分类号： H01L21/4832 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83001 ,  H01L2224/85001 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A mountable integrated circuit package system includes: providing a base; depositing a photoresist on the base; patterning the photoresist with an opening; filling the opening with a metal; depositing a further metal on the metal to form a lead pad; removing the photoresist; attaching a die over the base; bonding wires between the die and the lead pad; encapsulating the die and the lead pad in an encapsulation formed into a lead pad lock adjacent the lead pad; and removing the base.

摘要翻译： 一种可安装的集成电路封装系统，包括：提供基座; 在基底上沉积光致抗蚀剂; 用开口图案化光致抗蚀剂; 用金属填充开口; 在金属上沉积另外的金属以形成引线板; 去除光致抗蚀剂; 将模具附接在基座上; 在芯片和引线焊盘之间接合线; 将所述管芯和所述引线焊盘封装在与所述引线焊盘相邻的形成为引线焊盘锁的封装中; 并移除基座。

公开(公告)号：US20110111591A1

公开(公告)日：2011-05-12

申请号：US12896430

申请日：2010-10-01

申请人： Byung Tai Do ,  Heap Hoe Kuan ,  Linda Pei Ee Chua

发明人： Byung Tai Do ,  Heap Hoe Kuan ,  Linda Pei Ee Chua

IPC分类号： H01L21/44

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/12 ,  H01L24/19 ,  H01L24/25 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L25/03 ,  H01L25/0657 ,  H01L2221/68336 ,  H01L2221/68345 ,  H01L2221/68372 ,  H01L2224/02371 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05548 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82001 ,  H01L2225/06513 ,  H01L2225/06551 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor wafer contains a plurality of die with contact pads disposed on a first surface of each die. Metal vias are formed in trenches in the saw street guides and are surrounded by organic material. Traces connect the contact pads and metal vias. The metal vias can be half-circle vias or full-circle vias. The metal vias are surrounded by organic material. Redistribution layers (RDL) are formed on a second surface of the die opposite the first surface. The RDL and THV provide expanded interconnect flexibility to adjacent die. Repassivation layers are formed between the RDL on the second surface of the die for electrical isolation. The die are stackable and can be placed in a semiconductor package with other die. The RDL provide electrical interconnect to the adjacent die. Bond wires and solder bumps also provide electrical connection to the semiconductor die.

摘要翻译： 半导体晶片包含多个具有设置在每个管芯的第一表面上的接触焊盘的管芯。 金属通孔形成在锯条导轨中的沟槽中，并被有机材料包围。 痕迹连接接触垫和金属通孔。 金属通孔可以是半圆形通孔或全圆形通孔。 金属通孔被有机材料包围。 再次分布层（RDL）形成在模具的与第一表面相对的第二表面上。 RDL和THV为相邻裸片提供了扩展的互连灵活性。 在模具的第二表面上的RDL之间形成再钝化层以进行电绝缘。 芯片是可堆叠的并且可以放置在具有其它裸片的半导体封装中。 RDL为相邻的管芯提供电互连。 接合线和焊料凸起还提供与半导体管芯的电连接。

公开(公告)号：US07892894B2

公开(公告)日：2011-02-22

申请号：US11858554

申请日：2007-09-20

申请人： Byung Tai Do ,  Il Kwon Shim ,  Antonio B. Dimaano, Jr. ,  Heap Hoe Kuan

发明人： Byung Tai Do ,  Il Kwon Shim ,  Antonio B. Dimaano, Jr. ,  Heap Hoe Kuan

IPC分类号： H01L21/00

CPC分类号： H01L23/4951 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49548 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/078 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: providing an integrated circuit wafer having an active side and a backside; forming a stress-relieving layer on the backside; forming an adhesion layer on the stress-relieving layer; dicing the integrated circuit wafer into a semiconductor chip with the stress-relieving layer and the adhesion layer on the backside of the semiconductor chip; and mounting the semiconductor chip over electrical interconnects.

摘要翻译： 集成电路封装系统包括：提供具有有源侧和背面的集成电路晶片; 在背面形成应力消除层; 在应力消除层上形成粘合层; 将集成电路晶片切割成具有应力消除层和半导体芯片的背面上的粘合层的半导体芯片; 并将半导体芯片安装在电气互连上。

公开(公告)号：US07687318B2

公开(公告)日：2010-03-30

申请号：US11744743

申请日：2007-05-04

申请人： Byung Tai Do ,  Heap Hoe Kuan

发明人： Byung Tai Do ,  Heap Hoe Kuan

IPC分类号： H01L23/485

CPC分类号： H01L24/97 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3114 ,  H01L23/3185 ,  H01L23/498 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/96 ,  H01L2221/68327 ,  H01L2221/68359 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/1134 ,  H01L2224/12105 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13138 ,  H01L2224/13147 ,  H01L2224/14131 ,  H01L2224/20 ,  H01L2224/96 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/00014

摘要： A semiconductor device is manufactured by, first, providing a wafer, designated with a saw street guide, and having a bond pad formed on an active surface of the wafer. The wafer is taped with a dicing tape. The wafer is singulated along the saw street guide into a plurality of dies having a plurality of gaps between each of the plurality of dies. The dicing tape is stretched to expand the plurality of gaps to a predetermined distance. An organic material is deposited into each of the plurality of gaps. A top surface of the organic material is substantially coplanar with a top surface of a first die of the plurality of dies. A redistribution layer is patterned over a portion of the organic material. An under bump metallization (UBM) is deposited over the organic material in electrical communication, through the redistribution layer, with the bond pad.

摘要翻译： 半导体器件首先通过锯切街道引导件提供晶片，并且具有形成在晶片的有效表面上的接合焊盘。 晶片用切割胶带胶带。 将晶片沿着锯条导轨分割为具有在多个模具中的每一个之间具有多个间隙的多个模具。 切割带被拉伸以将多个间隙扩展到预定距离。 有机材料沉积在多个间隙中的每一个中。 有机材料的顶表面与多个管芯的第一管芯的顶表面基本共面。 重分布层在有机材料的一部分上被图案化。 凹凸金属化（UBM）通过再分配层与接合焊盘电连接在有机材料上沉积。

公开(公告)号：US07667308B2

公开(公告)日：2010-02-23

申请号：US11459568

申请日：2006-07-24

申请人： Byung Tai Do ,  Francis Heap Hoe Kuan ,  Seng Guan Chow

发明人： Byung Tai Do ,  Francis Heap Hoe Kuan ,  Seng Guan Chow

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L21/4825 ,  H01L23/3135 ,  H01L23/49503 ,  H01L23/49517 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73207 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a leadframe. An upper lead is disposed above the leadframe. A first die is attached to a lower surface of the upper lead to provide electrical conductivity from the first die to the upper lead. A second die is attached to the first die. A method of manufacturing a semiconductor package includes providing a leadframe having an upper lead, lower lead, and an elevated die paddle. A first die, attached to a plurality of dies in a wafer form, is attached to a second die. The first die is singulated from the plurality of dies. The first and second dies are attached to the elevated die paddle structure. The first die is wire bonded to the lower lead. An encapsulant is formed over the first and second dies. The elevated die paddle is removed to expose a surface of the upper lead and second die.

摘要翻译： 半导体封装包括引线框架。 上引线设置在引线框架上方。 第一裸片附接到上引线的下表面以提供从第一裸片到上引线的导电性。 第二模具附接到第一模具。 制造半导体封装的方法包括提供具有上引线，下引线和升高管芯的引线框架。 以晶片形式附接到多个模具的第一模具附接到第二模具。 从多个模具中分离出第一个模具。 第一和第二模具附接到升高的模板结构。 第一个裸片与下引线接合。 密封剂形成在第一和第二模具上。 去除升高的模板以暴露上引线和第二模的表面。

公开(公告)号：US20100007029A1

公开(公告)日：2010-01-14

申请号：US12172817

申请日：2008-07-14

申请人： Byung Tai Do ,  Heap Hoe Kuan ,  Reza A. Pagaila ,  Linda Pei Ee Chua

发明人： Byung Tai Do ,  Heap Hoe Kuan ,  Reza A. Pagaila ,  Linda Pei Ee Chua

IPC分类号： H01L23/52 ,  H01L21/00

CPC分类号： H01L24/82 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L24/19 ,  H01L24/24 ,  H01L24/48 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/82001 ,  H01L2224/82039 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor die has a peripheral region around the die. An insulating layer is formed over the semiconductor die. A portion of the insulating layer and peripheral is removed to form a recess around the semiconductor die. A conductive layer is deposited over the insulating layer and recess. The conductive layer is electrically connected to contact pads on the semiconductor die and conforms to a step into the recess. A gap is created through the conductive layer and peripheral region around the semiconductor die. An insulating material is deposited in the gap. A portion of the insulating material is removed to form a through hole via (THV). A conductive material is deposited in the THV to form a conductive THV. The conductive THV is recessed with respect to a surface of the semiconductor die. The conductive THV is electrically connected to the conductive layer.

摘要翻译： 半导体管芯具有围绕管芯的周边区域。 在半导体管芯上形成绝缘层。 去除绝缘层和周边的一部分以在半导体管芯周围形成凹陷。 导电层沉积在绝缘层和凹部上。 导电层电连接到半导体管芯上的接触焊盘，并符合入凹槽的步骤。 通过半导体管芯周围的导电层和周边区域产生间隙。 绝缘材料沉积在间隙中。 绝缘材料的一部分被去除以形成通孔（THV）。 导电材料沉积在THV中以形成导电THV。 导电THV相对于半导体管芯的表面凹陷。 导电THV与导电层电连接。

公开(公告)号：US20090291526A1

公开(公告)日：2009-11-26

申请号：US12533160

申请日：2009-07-31

申请人： Byung Tai Do ,  Heap Hoe Kuan ,  Linda Pei Ee Chua

发明人： Byung Tai Do ,  Heap Hoe Kuan ,  Linda Pei Ee Chua

IPC分类号： H01L21/98 ,  H01L21/78

CPC分类号： H01L25/0657 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L25/03 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of forming through-hole vias in a semiconductor wafer involves forming a semiconductor wafer having a plurality of die with contact pads disposed on a surface of each die. The semiconductor wafer has a saw street between each die. A trench is cut in the saw street without using support material to support the wafer. The trench extends only partially through the wafer. The uncut portion of the saw street below the trench along a backside of the wafer providing structural support for the wafer without support material during formation a plurality of conductive vias in the saw streets adjacent to the contact pads, and electrical connection of the conductive vias to the contact pads. The uncut portion of the saw street below the trench along the backside of the wafer portion is removed. The semiconductor wafer is singulated along the saw street to separate the die.

摘要翻译： 在半导体晶片中形成通孔过孔的方法包括形成具有多个管芯的半导体晶片，其具有设置在每个管芯的表面上的接触焊盘。 半导体晶片在每个管芯之间具有锯条。 在锯路中切割沟槽，而不使用支撑材料来支撑晶片。 沟槽仅部分延伸通过晶片。 沿着晶片的背面在沟槽下方的锯切街道的未切割部分在形成期间提供用于晶片的结构支撑，而在支撑材料的形成期间，与接触垫相邻的锯道中的多个导电通孔，以及导电通孔与 接触垫。 除去沿着晶片部分的后侧的沟槽下方的锯切街道的未切割部分。 将半导体晶片沿着锯条切割以分离模具。

公开(公告)号：US07618848B2

公开(公告)日：2009-11-17

申请号：US11463505

申请日：2006-08-09

申请人： Byung Tai Do ,  Heap Hoe Kuan

发明人： Byung Tai Do ,  Heap Hoe Kuan

IPC分类号： H01L21/00

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2225/1029 ,  H01L2225/1082 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An integrated circuit package system provides a leadframe having a short lead finger, a long lead finger, and a support bar. A first die is placed in the leadframe. An adhesive is attached to the first die, the long lead finger, and the support bar. A second die is offset from the first die. The offset second die is attached to the adhesive. The first die is electrically connected to the short lead finger. The second die is electrically connected to at least the long lead finger or the short lead finger. At least portions of the leadframe, the first die, and the second die are encapsulated in an encapsulant.

摘要翻译： 集成电路封装系统提供具有短引线指，长引线指和支撑条的引线框架。 第一个裸片放置在引线框架中。 粘合剂附着到第一模具，长引线指和支撑杆上。 第二模具偏离第一模具。 偏移的第二模具附接到粘合剂。 第一管芯与短引线电连接。 第二裸片电连接至至少长引线指或短引线指。 引线框架，第一管芯和第二管芯的至少一部分被封装在密封剂中。