公开(公告)号：US06307260B1

公开(公告)日：2001-10-23

申请号：US09395105

申请日：1999-09-14

申请人： John W. Smith ,  Joseph Fjelstad

发明人： John W. Smith ,  Joseph Fjelstad

IPC分类号： H01L2348

CPC分类号： H01L23/22 ,  H01L21/4839 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/642 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15174 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2203/063 ,  H01L2924/00

摘要： A structure including a conductive, preferably metallic conductive layer is provided with leads on a bottom surface. The leads have fixed ends permanently attached to the structure and free ends detachable from the structure. The structure is engaged with a microelectronic element such as a semiconductor chip or wafer, the free ends of the leads are bonded to the microelectronic element, and the leads are bent by moving the structure relative to the microelectronic element. Portions of the conductive layer are removed, leaving residual portions of the conductive layer as separate electrical terminals connected to at least some of the leads. The conductive layer mechanically stabilizes the structure before bonding, and facilitates precise registration of the leads with the microelectronic element. After the conductive layer is converted to separate terminals, it does not impair free movement of the terminals relative to the microelectronic element.

摘要翻译： 包括导电优选金属导电层的结构在底表面上设置有引线。 引线具有永久地附接到结构的固定端部和从结构可拆卸的自由端。 该结构与诸如半导体芯片或晶片的微电子元件接合，引线的自由端接合到微电子元件，并且通过相对于微电子元件移动结构而使引线弯曲。 导电层的一部分被去除，导致导电层的剩余部分作为分开的电端子连接到至少一些引线。 导电层在结合之前机械稳定结构，并且有助于引线与微电子元件的精确对准。 在将导电层转换成单独的端子之后，它不会损害端子相对于微电子元件的自由移动。

公开(公告)号：US5807453A

公开(公告)日：1998-09-15

申请号：US634784

申请日：1996-04-19

申请人： John W. Smith ,  Joseph Fjelstad

发明人： John W. Smith ,  Joseph Fjelstad

IPC分类号： H01L23/12 ,  H01L21/60 ,  H01L23/498 ,  H05K3/40 ,  H05K3/32

CPC分类号： H05K3/4092 ,  H01L23/4985 ,  H01L24/80 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T156/1052 ,  Y10T29/49121 ,  Y10T29/49222

摘要： A substantially continuous layer of a first metal such as copper is provided with strips of a second metal such as gold by selective electroplating of the second metal, or by applying separately formed strips such as lengths of wire. A dielectric support layer is provided in contact with the first metal layer, and the first metal layer is etched to leave strips of the first metal contiguous with the strips of the second metal, thereby providing composite leads with the first and second metal strips connected in series. The process provides simple and economical methods of making microelectronic connection components with leads having a flexible, fatigue resistant lead portion formed from a precious metal. The leads may incorporate sections of round cross-sectional shape to facilitate engagement by a bonding tool during use of the component.

摘要翻译： 第一金属（例如铜）的基本上连续的层通过第二金属的选择性电镀或通过施加单独形成的条（例如电线长度）来设置有诸如金的第二金属条。 提供与第一金属层接触的电介质支撑层，并且蚀刻第一金属层以留下与第二金属的条带相邻的第一金属的条带，由此提供复合引线，其中第一和第二金属条连接在 系列。 该方法提供了简单和经济的制造微电子连接部件的方法，该引线具有由贵金属形成的柔性耐疲劳引线部分。 引线可以包括圆形横截面形状的部分，以便于在部件使用期间通过焊接工具的接合。

公开(公告)号：US06586955B2

公开(公告)日：2003-07-01

申请号：US09793791

申请日：2001-02-27

申请人： Joseph Fjelstad ,  John W. Smith

发明人： Joseph Fjelstad ,  John W. Smith

IPC分类号： G01R3102

CPC分类号： G01R1/07314 ,  G01R1/06744 ,  G01R3/00

摘要： A probe card for testing electronic elements includes a layer of dielectric material provided with a plurality of cavities supported on a substrate. A mass of fusible conductive material having a melting temperature below about 150° C. is disposed in each of said cavities, the dielectric material electrically insulating the masses of fusible conductive material from one another. A probe tip of conductive material having a melting temperature greater than about 150° C. is provided at one common end of each of the masses of fusible conductive material. The probe contacts are separated from an adjacent probe contact by at least one channel formed with the layer of dielectric material.

公开(公告)号：US06204091B1

公开(公告)日：2001-03-20

申请号：US09505609

申请日：2000-02-17

申请人： John W. Smith ,  Joseph Fjelstad

发明人： John W. Smith ,  Joseph Fjelstad

IPC分类号： H01L2334

CPC分类号： H01L23/3107 ,  H01L21/56 ,  H01L24/37 ,  H01L24/40 ,  H01L24/73 ,  H01L24/81 ,  H01L24/84 ,  H01L24/92 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/4024 ,  H01L2224/92122 ,  H01L2224/84 ,  H01L2924/00014

摘要： A method of encapsulating a microelectronic assembly includes providing one or more microelectronic assemblies having one or more elements defining exterior surfaces and an array of terminals exposed at the exterior surfaces, the one or more elements defining one or more apertures through the exterior surfaces. A layer of a curable barrier material is then provided on a supporting element. The barrier layer has openings therein in a pattern corresponding to the array of terminals on the one or more microelectronic assemblies. The supporting element and the one or more microelectronic elements are then assembled together so that the layer of barrier material contacts the exterior surfaces and covers the apertures and so that the openings in the layer of barrier material are aligned with the terminals. The barrier material is then cured while in contact with the exterior surfaces to thereby form a barrier layer covering the apertures. Next, a curable liquid encapsulant is applied to the microelectronic assemblies, whereby the barrier layer prevents the curable liquid encapsulant from flowing through the apertures, and the encapsulant is cured. The barrier layer and the supporting element cooperatively surround the terminals exposed at the exterior surfaces to protect the terminals from contaminants.

摘要翻译： 封装微电子组件的方法包括提供一个或多个微电子组件，其具有限定外表面的一个或多个元件和暴露在外表面处的端子阵列，所述一个或多个元件限定通过外表面的一个或多个孔。 然后在支撑元件上设置一层可固化阻挡材料。 阻挡层在其中具有对应于一个或多个微电子组件上的端子阵列的图案中的开口。 然后将支撑元件和一个或多个微电子元件组装在一起，使得阻挡层的层与外表面接触并覆盖孔，使得阻挡材料层中的开口与端子对准。 然后在与外表面接触的同时固化阻挡材料，从而形成覆盖孔的阻挡层。 接下来，将可固化液体密封剂施加到微电子组件，由此阻挡层防止可固化液体密封剂流过孔，并且密封剂固化。 阻挡层和支撑元件协同地围绕暴露在外表面处的端子以保护端子免受污染物的影响。

公开(公告)号：US6130116A

公开(公告)日：2000-10-10

申请号：US984933

申请日：1997-12-04

申请人： John W. Smith ,  Joseph Fjelstad

发明人： John W. Smith ,  Joseph Fjelstad

IPC分类号： H01L21/56 ,  H01L23/31

CPC分类号： H01L23/3107 ,  H01L21/56 ,  H01L24/40 ,  H01L24/73 ,  H01L24/81 ,  H01L24/84 ,  H01L24/92 ,  H01L2224/4024 ,  H01L2224/92122

摘要： A method of encapsulating a microelectronic assembly includes providing one or more microelectronic assemblies having one or more elements defining exterior surfaces and an array of terminals exposed at the exterior surfaces, the one or more elements defining one or more apertures through the exterior surfaces. A layer of a curable barrier material is then provided on a supporting element. The barrier layer has openings therein in a pattern corresponding to the array of terminals on the one or more microelectronic assemblies. The supporting element and the one or more microelectronic elements are then assembled together so that the layer of barrier material contacts the exterior surfaces and covers the apertures and so that the openings in the layer of barrier material are aligned with the terminals. The barrier material is then cured while in contact with the exterior surfaces to thereby form a barrier layer covering the apertures. Next, a curable liquid encapsulant is applied to the microelectronic assemblies, whereby the barrier layer prevents the curable liquid encapsulant from flowing through the apertures, and the encapsulant is cured. The barrier layer and the supporting element cooperatively surround the terminals exposed at the exterior surfaces to protect the terminals from contaminants.

摘要翻译： 封装微电子组件的方法包括提供一个或多个微电子组件，其具有限定外表面的一个或多个元件和暴露在外表面处的端子阵列，所述一个或多个元件限定通过外表面的一个或多个孔。 然后在支撑元件上设置一层可固化阻挡材料。 阻挡层在其中具有对应于一个或多个微电子组件上的端子阵列的图案中的开口。 然后将支撑元件和一个或多个微电子元件组装在一起，使得阻挡层的层与外表面接触并覆盖孔，使得阻挡材料层中的开口与端子对准。 然后在与外表面接触的同时固化阻挡材料，从而形成覆盖孔的阻挡层。 接下来，将可固化液体密封剂施加到微电子组件，由此阻挡层防止可固化液体密封剂流过孔，并且密封剂固化。 阻挡层和支撑元件协同地围绕暴露在外表面处的端子以保护端子免受污染物的影响。

公开(公告)号：US06821815B2

公开(公告)日：2004-11-23

申请号：US10353737

申请日：2003-01-29

申请人： John W. Smith ,  Joseph Fjelstad

发明人： John W. Smith ,  Joseph Fjelstad

IPC分类号： H01L2144

CPC分类号： H01L23/3107 ,  H01L21/56 ,  H01L24/37 ,  H01L24/40 ,  H01L24/73 ,  H01L24/81 ,  H01L24/84 ,  H01L24/92 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/4024 ,  H01L2224/92122 ,  H01L2224/84 ,  H01L2924/00014

摘要： A method of encapsulating a microelectronic assembly comprises providing a microelectronic assembly having an element defining exterior surfaces and an array of terminals exposed at the exterior surfaces. The element defines an aperture through the exterior surfaces. A layer of a curable barrier material is screen printed onto a supporting element. The supporting element is assembled with the microelectronic assembly so that the layer of curable barrier material contacts the exterior surfaces and covers said one or more apertures. An encapsulant is applied to the microelectronic assembly.

摘要翻译： 封装微电子组件的方法包括提供具有限定外表面的元件和暴露在外表面处的端子阵列的微电子组件。 该元件通过外表面限定孔。 将一层可固化的阻挡材料丝网印刷到支撑元件上。 支撑元件与微电子组件组装，使得可固化阻挡材料层与外表面接触并覆盖所述一个或多个孔。 将密封剂施加到微电子组件。

公开(公告)号：US06518662B1

公开(公告)日：2003-02-11

申请号：US09713527

申请日：2000-11-15

申请人： John W. Smith ,  Joseph Fjelstad

发明人： John W. Smith ,  Joseph Fjelstad

IPC分类号： H01L2334

CPC分类号： H01L23/3107 ,  H01L21/56 ,  H01L24/37 ,  H01L24/40 ,  H01L24/73 ,  H01L24/81 ,  H01L24/84 ,  H01L24/92 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/4024 ,  H01L2224/92122 ,  H01L2224/84 ,  H01L2924/00014

摘要： A method of encapsulating a microelectronic assembly comprises providing a microelectronic assembly having an element defining exterior surfaces and an array of terminals exposed at the exterior surfaces. The element defines an aperture through the exterior surfaces. A layer of a curable barrier material is screen printed onto a supporting element. The supporting element is assembled with the microelectronic assembly so that the layer of curable barrier material contacts the exterior surfaces and covers said one or more apertures. An encapsulant is applied to the microelectronic assembly.

摘要翻译： 封装微电子组件的方法包括提供具有限定外表面的元件和暴露在外表面处的端子阵列的微电子组件。 该元件通过外表面限定孔。 将一层可固化的阻挡材料丝网印刷到支撑元件上。 支撑元件与微电子组件组装，使得可固化阻挡材料层与外表面接触并覆盖所述一个或多个孔。 将密封剂施加到微电子组件。

公开(公告)号：US06228686B1

公开(公告)日：2001-05-08

申请号：US09140589

申请日：1998-08-26

申请人： John W. Smith ,  Joseph Fjelstad

发明人： John W. Smith ,  Joseph Fjelstad

IPC分类号： H01L2144

CPC分类号： H01L23/3107 ,  H01L23/49572 ,  H01L24/01 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/3011 ,  H01L2924/00

摘要： A sheet such as a polymeric dielectric has elongated lead regions partially separated from the main region of the sheet by gaps in the sheet, and has conductors extending along the lead regions. The lead regions are connected to contacts on a microelectronic element, and the microelectronic element is moved away from the main region of the sheet, thereby bending the lead regions downwardly to form leads projecting from the main region of the sheet.

摘要翻译： 诸如聚合物电介质的片材具有通过片材中的间隙与片材的主要区域部分地分离的细长引线区域，并且具有沿引线区域延伸的导体。 引线区域连接到微电子元件上的触点，并且微电子元件移动离开片材的主要区域，从而将引线区域向下弯曲以形成从片材的主要区域突出的引线。

公开(公告)号：US06848173B2

公开(公告)日：2005-02-01

申请号：US09766814

申请日：2001-01-22

申请人： Joseph Fjelstad ,  Masud Beroz ,  John W. Smith ,  Belgacem Haba

发明人： Joseph Fjelstad ,  Masud Beroz ,  John W. Smith ,  Belgacem Haba

IPC分类号： H01L21/44 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01R43/02 ,  H05K3/34

CPC分类号： H01L24/29 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L24/86 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49431 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/78 ,  H01L2224/83138 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/8393 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2224/8593 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06558 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49179 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A method of making a microelectronic assembly includes juxtaposing a first element, such as a dielectric sheet having conductive leads thereon with a second element, such as a semiconductor chip, having contact thereon, and wire bonding the conductive leads on the first element to the contacts on the second element so that elongated bonding wires extend between the conductive leads and the contacts. After the wire bonding step, the first and second elements are moved through a pre-selected displacement relative to one another so as to deform the bonding wires. A flowable dielectric material may be introduced between the first and second elements and around the bonding wires during or after the moving step. The flowable material may be cured to form an encapsulant around at least a portion of the bonding wires.

摘要翻译： 一种制造微电子组件的方法包括将第一元件（例如具有导电引线的电介质片）与其上接触的第二元件（例如半导体芯片）并置，将第一元件上的导电引线接合到触点上 在第二元件上，使得细长的接合线在导电引线和触点之间延伸。 在引线接合步骤之后，第一和第二元件相对于彼此移动通过预先选择的位移，以使接合线变形。 可移动介电材料可以在移动步骤期间或之后在第一和第二元件之间以及接合线周围引入。 可流动材料可以固化以形成围绕至少一部分接合线的密封剂。

公开(公告)号：US06486547B2

公开(公告)日：2002-11-26

申请号：US09798809

申请日：2001-03-02

申请人： John W. Smith ,  Joseph Fjelstad

发明人： John W. Smith ,  Joseph Fjelstad

IPC分类号： H01L2348

CPC分类号： H01L23/3107 ,  H01L23/49572 ,  H01L24/01 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/3011 ,  H01L2924/00

摘要： A sheet such as a polymeric dielectric has elongated lead regions partially separated from the main region of the sheet by gaps in the sheet, and has conductors extending along the lead regions. The lead regions are connected to contacts on a microelectronic element, and the microelectronic element is moved away from the main region of the sheet, thereby bending the lead regions downwardly to form leads projecting from the main region of the sheet.

摘要翻译： 诸如聚合物电介质的片材具有通过片材中的间隙与片材的主要区域部分地分离的细长引线区域，并且具有沿引线区域延伸的导体。 引线区域连接到微电子元件上的触点，并且微电子元件移动离开片材的主要区域，从而将引线区域向下弯曲以形成从片材的主要区域突出的引线。