利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

526 条记录 (耗时 0.035 秒)

    Microelectronic unit forming methods and materials
    4.
    发明授权
    Microelectronic unit forming methods and materials 有权
    微电子单元成型方法和材料

    公开(公告)号：US06361959B1

    公开(公告)日：2002-03-26

    申请号：US09317675

    申请日：1999-05-24

    申请人： Masud Beroz ,  Joseph Fjelstad ,  Belgacem Haba ,  Christopher M. Pickett ,  John Smith

    发明人： Masud Beroz ,  Joseph Fjelstad ,  Belgacem Haba ,  Christopher M. Pickett ,  John Smith

    IPC分类号： C12Q154

    CPC分类号： C12Q1/00 ,  C12Q1/54 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Electrically conductive elements such as terminals and leads are held on a support structure by a degradable connecting layer such as a adhesive degradable by heat or radiant energy. After connecting these elements to a microelectronic element such as a chip or wafer, the conductive elements are released from the support structure by degrading the connecting layer. The support structure desirably has a predictable, isotropic coefficient of thermal expansion and such coefficient of thermal expansion may be close to that of silicon to minimize the effect of the temperature changes. The conductive elements may be mounted on a plurality of individual tiles rather than on an unitary sheet covering an entire wafer to minimize dimensional changes when the dielectric is released from the support structure.

    摘要翻译： 诸如端子和引线的导电元件通过可降解的连接层（例如通过热或辐射能降解的粘合剂）保持在支撑结构上。 在将这些元件连接到诸如芯片或晶片的微电子元件之后，通过降低连接层而将导电元件从支撑结构释放。 支撑结构理想地具有可预测的各向同性热膨胀系数，并且这种热膨胀系数可能接近于硅的热膨胀系数以最小化温度变化的影响。 导电元件可以安装在多个单独的瓦片上，而不是在覆盖整个晶片的整体片材上安装，以便当电介质从支撑结构释放时最小化尺寸变化。

    Microelectronic package comprising offset conductive posts on compliant layer
    9.
    发明授权
    Microelectronic package comprising offset conductive posts on compliant layer 有权
    微电子封装包括柔性层上的偏移导电柱

    公开(公告)号：US08207604B2

    公开(公告)日：2012-06-26

    申请号：US10985126

    申请日：2004-11-10

    申请人： Belgacem Haba ,  Masud Beroz ,  Giles Humpston ,  Jae M. Park

    发明人： Belgacem Haba ,  Masud Beroz ,  Giles Humpston ,  Jae M. Park

    IPC分类号： H01L23/485

    CPC分类号： H01L23/13 ,  H01L21/4846 ,  H01L2924/0002 ,  H01R13/2414 ,  H01R13/2464 ,  H01L2924/00

    摘要： A microelectronic package includes a mounting structure, a microelectronic element associated with the mounting structure, and a plurality of conductive posts physically connected to the mounting structure and electrically connected to the microelectronic element. The conductive posts project from the mounting structure in an upward direction, at least one of the conductive posts being an offset post. Each offset post has a base connected to the mounting structure, the base of each offset post defining a centroid. Each offset post also defines an upper extremity having a centroid, the centroid of the upper extremity being offset from the centroid of the base in a horizontal offset direction transverse to the upward direction. The mounting structure is adapted to permit tilting of each offset post about a horizontal axis so that the upper extremities may wipe across a contact pad of an opposing circuit board.

    摘要翻译： 微电子封装包括安装结构，与安装结构相关联的微电子元件以及物理连接到安装结构并电连接到微电子元件的多个导电柱。 导电柱从安装结构沿向上的方向突出，至少一个导电柱是偏移柱。 每个偏移柱具有连接到安装结构的基座，每个偏置柱的基部限定质心。 每个偏移柱还限定具有质心的上肢，上肢的质心在垂直于向上方向的水平偏移方向上偏离基部的质心。 安装结构适于允许每个偏移柱绕水平轴线倾斜，使得上端部可以擦过相对电路板的接触垫。