公开(公告)号：US07247940B2

公开(公告)日：2007-07-24

申请号：US10792538

申请日：2004-03-01

申请人： Thomas Höfer ,  Herbert Brunner ,  Frank Möllmer ,  Günter Waitl ,  Rainer Sewald ,  Markus Zeiler

发明人： Thomas Höfer ,  Herbert Brunner ,  Frank Möllmer ,  Günter Waitl ,  Rainer Sewald ,  Markus Zeiler

IPC分类号： H01L23/03

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optoelectronic device, comprising a package body (57) and at least one semiconductor chip (50) arranged on the package body (57). The surface of the package body (57) has a metallized subregion (15) and a non-metallized subregion (20). The package body (57) includes at least two different plastics (53, 54), one of the plastics being non-metallizable (54) and this plastic determining the non-metallized subregion (20). A method for producing such components and a method for the patterned metallization of a plastic-containing body are also provided.

摘要翻译： 一种光电子器件，包括封装主体（57）和布置在封装主体（57）上的至少一个半导体芯片（50）。 封装主体（57）的表面具有金属化子区域（15）和非金属化子区域（20）。 包装体（57）包括至少两种不同的塑料（53,54），塑料中的一种是不可金属化的（54），该塑料确定非金属化子区域（20）。 还提供了用于制造这种组分的方法和用于含塑料体的图案化金属化的方法。

公开(公告)号：US20050014302A1

公开(公告)日：2005-01-20

申请号：US10918100

申请日：2004-08-13

申请人： Herbert Brunner ,  Alexandra Debray ,  Harald Jager ,  Gunther Waitl

发明人： Herbert Brunner ,  Alexandra Debray ,  Harald Jager ,  Gunther Waitl

IPC分类号： H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L21/00

CPC分类号： H01L33/486 ,  H01L33/505 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012 ,  H01L2224/4554

摘要： The invention describes a radiation-emitting semiconductor component with a luminescent conversion element, at which the semiconductor body is placed in a recess of the base body. A cup-like area is molded inside of the recess around the semiconductor body, which contains the luminescent conversion element and coats the semiconductor body. The cup-like portion is formed as indentation inside of the recess or as annular border on the base of the recess.

摘要翻译： 本发明描述了具有发光转换元件的辐射发射半导体部件，半导体本体被放置在基体的凹部中。 在包含发光转换元件并涂覆半导体主体的半导体主体周围的凹部内部模制杯状区域。 杯状部分形成为凹陷内部的凹陷或凹陷的基部上的环形边界。

公开(公告)号：US06432745B1

公开(公告)日：2002-08-13

申请号：US08866064

申请日：1997-05-30

申请人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

发明人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

IPC分类号： H01L2144

CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

摘要： In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

摘要翻译： 在用于半导体部件的引线框架技术的两极SMT微型外壳中，半导体芯片安装在一个引线框架部分上并与另外的引线框部分接触。 另外的引线框架部分被从芯片封装的壳体中导出，作为焊接端子。 不需要修整或成形工艺，并且外壳紧凑并且能够进一步小型化。 作为引线框架的冲压部分的焊接端子从彼此相对的壳体侧壁横向突出，至少直到形成部件安装表面的壳体底板。 芯片安装表面和部件的安装表面彼此成直角。

公开(公告)号：US5981979A

公开(公告)日：1999-11-09

申请号：US979535

申请日：1997-11-26

申请人： Herbert Brunner

发明人： Herbert Brunner

IPC分类号： H01L33/48 ,  H01L33/54 ,  H01L33/62 ,  H05K3/34 ,  H01L33/00

CPC分类号： H01L33/62 ,  H01L33/54 ,  H05K3/3426 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L33/486 ,  Y02P70/613

摘要： A surface-mountable radiation-emitting semiconductor component includes an integrally constructed sheath of radiation-permeable material. The sheath has mutually opposite sides with a bottom surface and a radiation exit surface. The sheath also has a PCB bearing surface which is substantially perpendicular to the bottom surface and is located in one and the same plane as soldering surfaces of terminal leads protruding through the bottom surface out of the sheath.

摘要翻译： 可表面安装的辐射发射半导体部件包括一体构造的辐射可透过材料的护套。 护套具有相互相对的侧面，其具有底表面和辐射出射表面。 护套还具有基本上垂直于底表面的PCB支承表面，并且位于与通过底表面伸出护套的端子引线的焊接表面的同一平面中。

公开(公告)号：US4295745A

公开(公告)日：1981-10-20

申请号：US128815

申请日：1980-03-10

申请人： Herbert Brunner

发明人： Herbert Brunner

IPC分类号： B01F7/00 ,  B01F13/04 ,  B01F15/00 ,  G21F9/00 ,  G21F9/16 ,  G21F9/30 ,  G21F9/34 ,  G21F9/36 ,  B01F7/32

CPC分类号： B01F7/00175 ,  B01F13/04 ,  G21F9/008 ,  G21F9/165 ,  G21F9/34

摘要： A stirrer which permits homogenous and quick thorough mixing for the conditioning of bioinjurious waste, particularly radioactive waste, by means of a binder in the final storage container. The stirrer has a portion rotatable on another portion fixed in the container. The rotatable portion includes closed frame means having two or more opposite axially staggered stirrer arms secured to a hollow central bearing sleeve having axially spaced parts. The fixed portion includes a rod-like part upstanding centrally from the bottom of the container with the sleeve journalled thereon. The fixed portion is provided with one or more mixing elements secured thereto and disposed between the sleeve parts.

摘要翻译： 一种搅拌器，其允许通过最终存储容器中的粘合剂均匀且快速地充分混合以调节生物危害废物，特别是放射性废物。 搅拌器具有可在固定在容器中的另一部分上旋转的部分。 可旋转部分包括闭合的框架装置，该框架装置具有两个或更多个相对的轴向交错的搅拌臂，该搅动臂固定到具有轴向间隔开的部分的空心中心轴承套筒上。 固定部分包括从容器的底部中心竖立的杆状部分，套筒支承在其上。 固定部分设置有固定到其上的一个或多个混合元件并且设置在套筒部分之间。

公开(公告)号：US09406853B2

公开(公告)日：2016-08-02

申请号：US13982225

申请日：2011-12-21

申请人： Tobias Gebuhr ,  Hans-Christoph Gallmeier ,  Herbert Brunner ,  Kirstin Petersen

发明人： Tobias Gebuhr ,  Hans-Christoph Gallmeier ,  Herbert Brunner ,  Kirstin Petersen

IPC分类号： H01L33/38 ,  H01L33/46 ,  H01L33/50 ,  H01L33/60 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62

CPC分类号： H01L33/60 ,  H01L33/50 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/24 ,  H01L2933/005 ,  H01L2933/0066

摘要： A method for manufacturing at least one optoelectronic semiconductor device includes providing a substrate and applying a number of optoelectronic semiconductor chips, which are arranged spaced apart from one another in a lateral direction, on an upper face of the substrate. At least one reflective coating is applied to the exposed areas of the substrate and the lateral surfaces of the optoelectronic semiconductor chips. Openings are introduced into the reflective coating, which completely penetrate the reflective coating. Electrically conductive material is arranged on the reflective coating and at least on some parts of the openings. Radiation penetration surfaces of the optoelectronic semiconductor chips are free of the reflective coating and the reflective coating does not laterally extend beyond the optoelectronic semiconductor chips.

摘要翻译： 一种用于制造至少一个光电子半导体器件的方法包括：在衬底的上表面上提供衬底和施加多个在横向彼此间隔开的光电子半导体芯片。 至少一个反射涂层施加到基板的暴露区域和光电子半导体芯片的侧表面。 开口被引入到完全穿透反射涂层的反射涂层中。 导电材料布置在反射涂层上并且至少在开口的某些部分上。 光电子半导体芯片的辐射穿透表面没有反射涂层，反射涂层不横向延伸超过光电子半导体芯片。

公开(公告)号：US08835937B2

公开(公告)日：2014-09-16

申请号：US10588167

申请日：2005-02-18

申请人： Ralph Wirth ,  Herbert Brunner ,  Stefan Illek ,  Dieter Eissler

发明人： Ralph Wirth ,  Herbert Brunner ,  Stefan Illek ,  Dieter Eissler

IPC分类号： H01L33/00 ,  H01L31/0224 ,  H01L33/38

CPC分类号： H01L31/022408 ,  H01L31/022416 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/382 ,  H01L2224/16225

摘要： Disclosed is an optoelectronic component (1) comprising a semiconductor function region (2) with an active zone (400) and a lateral main direction of extension, said semiconductor function region including at least one opening (9, 27, 29) through the active zone, and there being disposed in the region of the opening a connecting conductor material (8) that is electrically isolated (10) from the active zone in at least in a subregion of the opening. Further disclosed are a method for producing such an optoelectronic component and a device comprising a plurality of optoelectronic components. The component and the device can be produced entirely on-wafer.

摘要翻译： 公开了一种光电子部件（1），其包括具有有源区（400）和横向主延伸方向的半导体功能区（2），所述半导体功能区包括至少一个开口（9,27,29） 并且在所述开口的区域中设置有至少在所述开口的一个子区域中与所述活性区电隔离（10）的连接导体材料（8）。 进一步公开的是制造这种光电子部件的方法和包括多个光电子部件的器件。 组件和设备可以完全在晶片上生产。

公开(公告)号：US08487323B2

公开(公告)日：2013-07-16

申请号：US12675009

申请日：2008-08-06

申请人： Steffen Köhler ,  Stefan Grötsch ,  Herbert Brunner ,  Rainer Huber

发明人： Steffen Köhler ,  Stefan Grötsch ,  Herbert Brunner ,  Rainer Huber

IPC分类号： H01L33/62 ,  F21V21/005

CPC分类号： F21S2/005 ,  F21K9/00 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01R13/113 ,  H01L2924/00014

摘要： An LED housing having a housing cavity, a carrier element, LED chips, the LED housing being formed in such a way that it may connect a plurality of LED housings of identical construction and, by its shaping, is additionally mountable in various ways.

摘要翻译： LED壳体具有壳体腔，载体元件，LED芯片，LED壳体以这样的方式形成，使得其可以连接多个具有相同构造的LED壳体，并且通过其成形可以以各种方式安装。

公开(公告)号：US20130134473A1

公开(公告)日：2013-05-30

申请号：US13698302

申请日：2011-06-08

申请人： Herbert Brunner ,  Patrick Ninz

发明人： Herbert Brunner ,  Patrick Ninz

IPC分类号： H01L33/40

CPC分类号： H01L33/40 ,  H01L24/73 ,  H01L33/0079 ,  H01L33/387 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/12036 ,  H01L2924/12042 ,  H05K2201/10106 ,  H05K2201/10969 ,  H01L2924/00014 ,  H01L2924/00

摘要： A radiation-emitting semiconductor body is provided which, besides an epitaxial semiconductor layer sequence having an active zone that is suitable for generating electromagnetic radiation, has a carrier layer that is intended to mechanically stabilize the epitaxial semiconductor layer sequence. The semiconductor body furthermore has contact structures for electrical contacting of the semiconductor body, which respectively have a volume region and a surface bonding region. The surface bonding region is formed from a material which is different from the material of the volume region.

摘要翻译： 提供了一种辐射发射半导体本体，除了具有适于产生电磁辐射的有源区的外延半导体层序列之外，还具有旨在使外延半导体层序列机械稳定的载体层。 半导体本体还具有用于半导体主体的电接触的接触结构，该接触结构分别具有体积区域和表面结合区域。 表面结合区域由与体积区域的材料不同的材料形成。

公开(公告)号：US08278767B2

公开(公告)日：2012-10-02

申请号：US13000390

申请日：2009-08-04

申请人： Ewald K. M. Günther ,  Siegfried Herrmann ,  Ulrich Zehnder ,  Herbert Brunner

发明人： Ewald K. M. Günther ,  Siegfried Herrmann ,  Ulrich Zehnder ,  Herbert Brunner

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L33/645 ,  H01L2924/0002 ,  H05B33/0803 ,  H01L2924/00

摘要： An optoelectronic component includes a carrier with a mounting side and having at least one functional element, at least one substrateless optoelectronic semiconductor chip with a top and an opposed bottom and is electrically conductive by way of the top and the bottom, wherein the bottom faces the mounting side and the semiconductor chip is mounted on the mounting side, and at least one structured electrical contact film located on the top.

摘要翻译： 光电子部件包括具有安装侧并具有至少一个功能元件的载体，至少一个具有顶部和相对底部的无基底光电半导体芯片，并且通过顶部和底部导电，其中底部面向 安装侧，半导体芯片安装在安装侧，并且至少一个结构化电接触膜位于顶部。