公开(公告)号：US08378231B2

公开(公告)日：2013-02-19

申请号：US12510028

申请日：2009-07-27

申请人： Kiyotaka Tsukada ,  Toshihiro Nomura ,  Daisuke Minoura

发明人： Kiyotaka Tsukada ,  Toshihiro Nomura ,  Daisuke Minoura

IPC分类号： H05K1/11

CPC分类号： H05K1/145 ,  H01L24/01 ,  H01L24/25 ,  H01L2224/2518 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/0204 ,  H05K3/284 ,  H05K3/306 ,  H05K2201/096 ,  H05K2201/10166 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10643 ,  H05K2201/10871 ,  H05K2201/10946 ,  Y10T29/4913 ,  Y10T29/49153 ,  H01L2924/00

摘要： A semiconductor device includes wiring boards each having an insulating board, conductor circuits and through-holes, the insulating board having top and bottom surfaces, the conductor circuits formed on the top and bottom surfaces, the through holes penetrating the insulating board and electrically connecting the conductor circuits of the top and bottom surfaces; conductor posts each having flange, head and leg portions, the flange portion having first and second surfaces and having an external diameter larger than that of the through-hole, the head portion protruding from the first surface, the leg portion protruding from the second surface; and electronic components each having an electrode formed on one or more surfaces and connected to the leg portion. The head portion is inserted until the first surface of the flange portion comes into contact with the bottom surface of the wiring board and electrically connected at an inner wall of the through-hole.

摘要翻译： 半导体器件包括各自具有绝缘板，导体电路和通孔的布线板，所述绝缘板具有顶表面和底表面，所述导体电路形成在顶表面和底表面上，所述通孔穿过绝缘板并电连接 顶表面和底表面的导体电路; 导体柱各自具有凸缘，头部和腿部，凸缘部分具有第一和第二表面，并且具有比通孔大的外径，头部从第一表面突出，腿部从第二表面突出 ; 以及各自具有形成在一个或多个表面上并连接到所述腿部的电极的电子部件。 插入头部直到凸缘部分的第一表面与布线板的底表面接触并且在通孔的内壁处电连接。

公开(公告)号：US08327533B2

公开(公告)日：2012-12-11

申请号：US12407685

申请日：2009-03-19

申请人： Kiyotaka Tsukada ,  Takamichi Sugiura

发明人： Kiyotaka Tsukada ,  Takamichi Sugiura

IPC分类号： H05K3/38 ,  H05K3/46 ,  H05K3/42

CPC分类号： H05K3/4644 ,  H05K3/0038 ,  H05K3/384 ,  H05K3/386 ,  H05K3/388 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/0353 ,  Y10T29/49126 ,  Y10T29/49156 ,  Y10T156/10

摘要： A multilayer printed wiring board is manufactured by a method in which a core substrate is provided, an insulation layer including a thermosetting resin material is formed over the core substrate, an uncured resin layer including a thermoplastic resin material is placed on the insulation layer, the uncured resin layer is cured to form a resin complex layer including a resin complex comprising the thermosetting resin material and the thermoplastic resin material, and a conductive circuit is formed over the resin complex layer.

摘要翻译： 通过设置芯基板的方法制造多层印刷布线板，在芯基板上形成包含热固性树脂材料的绝缘层，将包含热塑性树脂材料的未固化树脂层放置在绝缘层上， 固化未固化的树脂层以形成包含含有热固性树脂材料和热塑性树脂材料的树脂配合物的树脂复合层，并且在树脂复合层上形成导电电路。

公开(公告)号：US20120125680A1

公开(公告)日：2012-05-24

申请号：US13357663

申请日：2012-01-25

申请人： Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

发明人： Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC分类号： H05K1/02 ,  C25D5/02 ,  B23K1/20 ,  B23K31/02 ,  H05K3/46 ,  C25D7/00

CPC分类号： H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be prevented. Thus, the reliability of the connection of the via holes can be improved.

摘要翻译： 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以防止通孔的连接的可靠性。 因此，可以提高通孔连接的可靠性。

公开(公告)号：US07568922B2

公开(公告)日：2009-08-04

申请号：US11304770

申请日：2005-12-16

申请人： Takahiro Yamashita ,  Hiroyuki Watanabe ,  Kiyotaka Tsukada ,  Michio Ido ,  Morio Nakao

发明人： Takahiro Yamashita ,  Hiroyuki Watanabe ,  Kiyotaka Tsukada ,  Michio Ido ,  Morio Nakao

IPC分类号： H01R12/00 ,  H05K1/00

CPC分类号： H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/113 ,  H05K3/3457 ,  H05K2201/0347 ,  H05K2201/09436 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/098 ,  Y10T29/49144 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： This invention provides a printed wiring board having an intensified drop impact resistance of a joint portion between pad and solder. An electrode pad comprises pad portion loaded with solder ball and a cylindrical portion projecting to the solder ball supporting the pad portion. An outer edge of the pad portion extends sideway from a cylindrical portion so that the outer edge is capable of bending. If the outer edge bends when stress is applied to the solder ball 30, stress on the outer edge of the pad portion on which stress is concentrated can be relaxed so as to intensify the joint strength between an electrode pad and solder ball.

摘要翻译： 本发明提供了一种印刷电路板，其具有焊盘和焊料之间的接合部分的强烈的耐滴落冲击性。 电极焊盘包括装载有焊球的焊盘部分和突出到支撑焊盘部分的焊球的圆柱形部分。 衬垫部分的外边缘从圆筒部分侧向延伸，使得外边缘能够弯曲。 如果当对焊球30施加应力时外边缘弯曲，则可以放松应力集中的焊盘部分的外边缘上的应力，从而加强电极焊盘和焊球之间的接合强度。

公开(公告)号：US20080189943A1

公开(公告)日：2008-08-14

申请号：US12098582

申请日：2008-04-07

申请人： Naohiro HIROSE ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

发明人： Naohiro HIROSE ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC分类号： H05K3/42 ,  H01L21/306

CPC分类号： H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

摘要翻译： 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口部20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。

公开(公告)号：US20080173473A1

公开(公告)日：2008-07-24

申请号：US11875486

申请日：2007-10-19

申请人： Naohiro HIROSE ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

发明人： Naohiro HIROSE ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC分类号： H01R12/04

CPC分类号： H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

摘要翻译： 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口部20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。

公开(公告)号：US07310238B2

公开(公告)日：2007-12-18

申请号：US11498070

申请日：2006-08-03

申请人： Kiyotaka Tsukada

发明人： Kiyotaka Tsukada

IPC分类号： H05K1/18

CPC分类号： H01G4/33 ,  H01G4/008 ,  H01G4/1218 ,  H05K1/162 ,  H05K3/025 ,  H05K3/143 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/068 ,  H05K2201/09763

摘要： The present invention provides a thin-film embedded capacitance having a substantial electrostatic capacity per unit area, and a method for manufacturing thereof.A thin film embedded capacitance comprising: a metallic thin-film for wiring made of a metallic material in a non-yield state; the first electrode formed on the film for wiring; a dielectric material layer formed on the first electrode and the film for wiring, at a temperature not lower than ordinary room temperature to lower than a yield temperature of the film for wiring, having a coefficient of thermal expansion lower than that the film for wiring; and the second electrode formed on the dielectric material layer, and a method for manufacturing thereof.

摘要翻译： 本发明提供了具有每单位面积的显着静电容量的薄膜嵌入式电容及其制造方法。 一种薄膜嵌入式电容器，包括：用于非金属材料制成的布线的金属薄膜; 形成在用于布线的膜上的第一电极; 在不低于普通室温至低于布线用膜的屈服温度的温度下形成的第一电极和布线用电介质材料层，其热膨胀系数低于布线用膜; 和形成在电介质材料层上的第二电极及其制造方法。

公开(公告)号：US20070030627A1

公开(公告)日：2007-02-08

申请号：US11498070

申请日：2006-08-03

申请人： Kiyotaka Tsukada

发明人： Kiyotaka Tsukada

IPC分类号： H01G4/06

CPC分类号： H01G4/33 ,  H01G4/008 ,  H01G4/1218 ,  H05K1/162 ,  H05K3/025 ,  H05K3/143 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/068 ,  H05K2201/09763

摘要： The present invention provides a thin-film embedded capacitance having a substantial electrostatic capacity per unit area, and a method for manufacturing thereof. A thin film embedded capacitance comprising: a metallic thin-film for wiring made of a metallic material in a non-yield state; the first electrode formed on the film for wiring; a dielectric material layer formed on the first electrode and the film for wiring, at a temperature not lower than ordinary room temperature to lower than a yield temperature of the film for wiring, having a coefficient of thermal expansion lower than that the film for wiring; and the second electrode formed on the dielectric material layer, and a method for manufacturing thereof.

公开(公告)号：US4540677A

公开(公告)日：1985-09-10

申请号：US656161

申请日：1984-09-27

申请人： Ryo Enomoto ,  Kiyotaka Tsukada

发明人： Ryo Enomoto ,  Kiyotaka Tsukada

IPC分类号： C04B35/111 ,  C04B35/565 ,  C04B35/584 ,  C04B35/634 ,  C04B35/00

CPC分类号： C04B35/63436 ,  C04B35/111 ,  C04B35/565 ,  C04B35/584 ,  C04B35/634

摘要： A powder composition for producing sintered ceramic, which composition contains fluororesin powder which has not been used in the prior art as one of the materials constituting a molding assistant to be blended in the composition. With this composition, it is possible to produce a high-density green molding with few molding defects under a relatively low molding pressure. The invention also provides a process for producing such a composition.

摘要翻译： 一种用于制造烧结陶瓷的粉末组合物，该组合物含有在现有技术中未使用的氟树脂粉末作为组合物中混合的成型助剂的材料之一。 通过该组合物，可以在相对较低的成型压力下生产具有少量成型缺陷的高密度绿色模制品。 本发明还提供了一种制备这种组合物的方法。

公开(公告)号：US4485182A

公开(公告)日：1984-11-27

申请号：US516760

申请日：1983-07-25

申请人： Ryo Enomoto ,  Kiyotaka Tsukada

发明人： Ryo Enomoto ,  Kiyotaka Tsukada

IPC分类号： C04B35/111 ,  C04B35/565 ,  C04B35/584 ,  C04B35/634 ,  C04B35/00

CPC分类号： C04B35/63436 ,  C04B35/111 ,  C04B35/565 ,  C04B35/584 ,  C04B35/634

摘要： A powder composition for producing sintered ceramic, which composition contains fluororesin powder which has not been used in the prior art as one of the materials constituting a molding assistant to be blended in the composition. With this composition, it is possible to produce a high-density green molding with few molding defects under a relatively low molding pressure. The invention also provides a process for producing such a composition.

摘要翻译： 一种用于制造烧结陶瓷的粉末组合物，该组合物含有在现有技术中未使用的氟树脂粉末作为组合物中混合的成型助剂的材料之一。 通过该组合物，可以在相对较低的成型压力下生产具有少量成型缺陷的高密度绿色模制品。 本发明还提供了一种制备这种组合物的方法。