公开(公告)号：US08156646B2

公开(公告)日：2012-04-17

申请号：US12494948

申请日：2009-06-30

Applicant: Tsutomu Iwai ,  Yoshihiro Kodera ,  Shinya Maeda ,  Hiroyuki Watanabe ,  Kazunari Suzuki ,  Kiyotaka Tsukada

Inventor： Tsutomu Iwai ,  Yoshihiro Kodera ,  Shinya Maeda ,  Hiroyuki Watanabe ,  Kazunari Suzuki ,  Kiyotaka Tsukada

IPC: H01K3/10 ,  H01L21/44

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L23/498 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K3/244 ,  H05K3/3463 ,  H05K3/4644 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A composite layer composed of an Ni layer and a Pd layer is formed on a solder pad, and a solder on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by thermal stress.

Abstract translation: 在焊盘上形成由Ni层和Pd层构成的复合层，复合层上的焊料由不含铅的焊料构成。 由于Pd层（钯层）减少诸如焊料排斥性的现象，因此可以提高与焊料的粘合性。 由于Pd层比金层具有更高的刚度，因此热应力被吸收到Pd层中并进行缓冲，从而通过热应力降低对焊料凸块或焊料层的应力传递程度。

公开(公告)号：US20080264681A1

公开(公告)日：2008-10-30

申请号：US11576987

申请日：2005-03-15

Applicant: Tsutomu Iwai ,  Yoshihiro Kodera ,  Shinya Maeda ,  Hiroyuki Watanabe ,  Kazunari Suzuki ,  Kiyotaka Tsukada

Inventor： Tsutomu Iwai ,  Yoshihiro Kodera ,  Shinya Maeda ,  Hiroyuki Watanabe ,  Kazunari Suzuki ,  Kiyotaka Tsukada

IPC: H05K1/09 ,  B23K31/02

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L23/498 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K3/244 ,  H05K3/3463 ,  H05K3/4644 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A composite layer composed of an Ni layer and a Pd layer is formed on a solder pad, and a solder on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by thermal stress.

Abstract translation: 在焊盘上形成由Ni层和Pd层构成的复合层，复合层上的焊料由不含铅的焊料构成。 由于Pd层（钯层）减少诸如焊料排斥性的现象，因此可以提高与焊料的粘合性。 由于Pd层比金层具有更高的刚度，因此热应力被吸收到Pd层中并进行缓冲，从而通过热应力降低对焊料凸块或焊料层的应力传递程度。

公开(公告)号：US06284353B1

公开(公告)日：2001-09-04

申请号：US09348935

申请日：1999-07-07

Applicant: Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

Inventor： Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

IPC: B32B300

CPC classification number: H01L24/32 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/112 ,  H05K1/116 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/242 ,  H05K3/243 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/428 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09381 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/0959 ,  H05K2201/09781 ,  H05K2203/0554 ,  H05K2203/0571 ,  H05K2203/107 ,  H05K2203/175 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

公开(公告)号：US5144536A

公开(公告)日：1992-09-01

申请号：US556521

申请日：1990-07-24

Applicant: Kiyotaka Tsukada ,  Yukihiro Noda

Inventor： Kiyotaka Tsukada ,  Yukihiro Noda

IPC: H01L21/48 ,  H01L23/15 ,  H05K1/03

CPC classification number: H05K1/0306 ,  H01L21/4807 ,  H01L23/15 ,  H01L2924/0002 ,  H05K2201/0116 ,  H05K3/4629 ,  Y10T29/49163

Abstract: An electronic circuit substrate excellent in reliability, which comprises a porous ceramic sintered body with film devices such as a conductive circuit, a resistor and a capacitor directly formed on a surface thereof. A resin is filled in the pores of the porous ceramic sintered body, and the bottom surface of the film devices are fit into the pores and recesses on the surface of the porous ceramic sintered body in close contact therewith in a wedged state. A method of producing the aforesaid electronic circuit substrate comprises the steps of forming film devices directly on a surface of a porous ceramic sintered body. Then, filling the pores of the porous ceramic sintered body with a resin so as to fit the under surface of the film devices into the pores and recesses on the surface of the porous ceramic sintered body in close contact therewith in a wedge state.

公开(公告)号：US5114886A

公开(公告)日：1992-05-19

申请号：US486237

申请日：1990-02-28

Applicant: Kiyotaka Tsukada

Inventor： Kiyotaka Tsukada

IPC: C04B35/56 ,  C04B38/00 ,  C04B41/47 ,  C04B41/48 ,  C04B41/49 ,  C04B41/81 ,  C04B41/82 ,  C04B41/83 ,  C04B41/84 ,  F16K3/08 ,  F16K11/06 ,  F16K11/078

CPC classification number: C04B41/009 ,  C04B38/00 ,  C04B41/47 ,  C04B41/48 ,  C04B41/4838 ,  C04B41/4961 ,  C04B41/82 ,  C04B41/83 ,  C04B41/84 ,  F16K11/0787 ,  F16K3/08 ,  Y10T137/86823 ,  Y10T29/49405

Abstract: A sliding material made of a sintered silicon carbide having open pores of a three dimensional network structure, the open pores present at a rate of 5 to 40 percent by volume, with the open pores being impregnated with a lubricant, where the lubricant is selected from a group of lubricants consisting of fluorine-type oils and silicone-type oils.

公开(公告)号：US20110080714A1

公开(公告)日：2011-04-07

申请号：US12894968

申请日：2010-09-30

Applicant: Kiyotaka Tsukada ,  Tetsuya Muraki

Inventor： Kiyotaka Tsukada ,  Tetsuya Muraki

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K1/09

CPC classification number: H05K3/202 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49833 ,  H01L25/072 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H05K3/28 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/0969 ,  H05K2201/10166 ,  H05K2201/10303 ,  H01L2924/00

Abstract: A circuit board comprises a first conductive post for electrically connecting to the first electrode of the semiconductor device, a first metal plate connecting to the first conductive post, a second conductive post for electrically connecting to the second electrode of the semiconductor device, a second metal plate connecting to the second conductive post, a third conductive post for electrically connecting to the third electrode of the semiconductor device, and a third metal plate connecting to the third conductive post.

Abstract translation: 电路板包括用于电连接到半导体器件的第一电极的第一导电柱，连接到第一导电柱的第一金属板，用于电连接到半导体器件的第二电极的第二导电柱，第二金属 板，连接到第二导电柱，用于电连接到半导体器件的第三电极的第三导电柱，以及连接到第三导电柱的第三金属板。

公开(公告)号：US07832098B2

公开(公告)日：2010-11-16

申请号：US12098582

申请日：2008-04-07

Applicant: Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

Inventor： Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC: H01K3/10

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract translation: 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。

公开(公告)号：US07786389B2

公开(公告)日：2010-08-31

申请号：US11939774

申请日：2007-11-14

Applicant: Kiyotaka Tsukada ,  Terumasa Ninomaru ,  Masaki Kizaki

Inventor： Kiyotaka Tsukada ,  Terumasa Ninomaru ,  Masaki Kizaki

IPC: H05K1/00

CPC classification number: H05K1/028 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01R12/714 ,  H05K1/0366 ,  H05K1/141 ,  H05K3/28 ,  H05K3/363 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/029 ,  H05K2203/1536

Abstract: A flexible printed wiring board includes a first conductor layer in the element mounting part adjacent to the top surface of the wiring board; a second conductor layer in the element mounting part adjacent to the bottom surface of the wiring board; and a third conductor layer between the first conductor layer and the second conductor layer, wherein the first and third conductor layers extend through and beyond the bending part, and the second conductor layer is absent in the bending part.

Abstract translation: 柔性印刷布线板包括与元件安装部分相邻的第一导体层，与布线板的顶表面相邻; 所述元件安装部分中的与所述布线板的底面相邻的第二导体层; 以及在所述第一导体层和所述第二导体层之间的第三导体层，其中所述第一和第三导体层延伸穿过所述弯曲部分并且超过所述弯曲部分，并且所述第二导体层在所述弯曲部分中不存在。

公开(公告)号：US07765692B2

公开(公告)日：2010-08-03

申请号：US12237955

申请日：2008-09-25

Applicant: Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

Inventor： Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

IPC: H01K3/10 ,  B28B19/00

CPC classification number: H01L24/32 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/112 ,  H05K1/116 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/242 ,  H05K3/243 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/428 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09381 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/0959 ,  H05K2201/09781 ,  H05K2203/0554 ,  H05K2203/0571 ,  H05K2203/107 ,  H05K2203/175 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

Abstract translation: 在具有导体电路（6）的绝缘板（7）的表面上印刷包括热固性树脂的阻焊剂。 然后将阻焊剂热固化以形成具有低热膨胀系数的绝缘膜（1）。 然后将激光束（2）施加到要形成开口的绝缘膜的部分，以烧掉用于形成开口（10）的相同部分，由此导体电路（6）暴露。 该开口可以通过在其内表面上形成金属电镀膜而形成为导电孔。 优选地，形成外部连接垫以覆盖开口。 通过使用在电镀完成后优选用激光束切断的电镀铅来形成金属涂膜。

公开(公告)号：US07612295B2

公开(公告)日：2009-11-03

申请号：US11420421

申请日：2006-05-25

Applicant: Masaru Takada ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Hiroyuki Kobayashi ,  Mitsuhiro Kondo

Inventor： Masaru Takada ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Hiroyuki Kobayashi ,  Mitsuhiro Kondo

IPC: H05K1/16

CPC classification number: H01L24/49 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/021 ,  H05K1/113 ,  H05K1/114 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/3457 ,  H05K3/385 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4697 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2203/0315 ,  H05K2203/0554 ,  H05K2203/1581 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon another. The first conductive layer (11) is constituted as a parts connecting layer and the n-th conductive layer (13) is constituted as an external connecting layer which is connected to external connecting terminals (7). The second to (n−1)-th conductive layers (12) are constituted as current transmitting layers for transmitting internal currents. The surface of the n-th conductive layer (13) is coated with the outermost n-th insulating layer (23) in a state where the external connecting terminals (7) are exposed on the surface. It is preferable to constitute the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.

Abstract translation: 在印刷布线板中，奇数（n）个导电层（11-13）和绝缘层（21-23）交替层叠在另一个上。 第一导电层（11）构成为部分连接层，第n导电层（13）构成为连接到外部连接端子（7）的外部连接层。 第（n-1）个第二导电层（12）构成用于传输内部电流的电流传输层。 第n导电层（13）的表面在外部连接端子（7）暴露在表面上的状态下涂覆有最外层的第n绝缘层（23）。 优选构成玻璃布预浸料坯的初始绝缘层和树脂的外部绝缘层。