公开(公告)号：US09825001B2

公开(公告)日：2017-11-21

申请号：US14867222

申请日：2015-09-28

Applicant: NICHIA CORPORATION

Inventor： Hiroto Tamaki ,  Takuya Nakabayashi

IPC: H01L23/00 ,  H01L33/50 ,  H01L33/48

CPC classification number: H01L24/97 ,  H01L33/486 ,  H01L33/505 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2933/0041 ,  H01L2924/00014

Abstract: A method of manufacturing a light emitting device includes: preparing a light-transmissive member including a light reflective sheet that has a through-hole, and a color conversion material layer that is composed of a light-transmissive resin containing a color conversion material and disposed in the through-hole, preparing a light emitting element, fixing the color conversion material layer to the light emitting element, covering a side surface of the light emitting element with a light-reflective member, and cutting the light-reflective member and light-reflective sheet.

公开(公告)号：US09808970B2

公开(公告)日：2017-11-07

申请号：US13893924

申请日：2013-05-14

Applicant: NICHIA CORPORATION

Inventor： Masaki Hayashi ,  Hiroto Tamaki ,  Masafumi Kuramoto ,  Tomohide Miki ,  Takayuki Sano ,  Tomohisa Kishimoto

IPC: B29C45/02 ,  B29C45/28 ,  B29D11/00 ,  H01L33/26 ,  B29K63/00

CPC classification number: B29C45/02 ,  B29C45/2806 ,  B29D11/0074 ,  B29K2063/00 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/181 ,  Y10T428/31511 ,  H01L2924/00012

Abstract: A light-emitting device includes a light-emitting element on a molded part. The molded part is formed by molding and curing a thermosetting epoxy resin composition comprising (A) the reaction product of a triazine derived epoxy resin with an acid anhydride, (B) an internal parting agent having m.p. 50-90° C., (C) a reflective agent, (D) an inorganic filler, and (E) a curing catalyst.

公开(公告)号：US09773959B2

公开(公告)日：2017-09-26

申请号：US14603148

申请日：2015-01-22

Applicant: NICHIA CORPORATION

Inventor： Masato Fujitomo ,  Hiroto Tamaki ,  Shinji Nishijima ,  Yuichiro Tanda ,  Tomohide Miki

IPC: H01L33/48 ,  H01L33/62 ,  H01L23/00 ,  H01L31/0203 ,  H01L31/02 ,  H01L33/52 ,  H01L25/16

CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L25/167 ,  H01L31/02002 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

公开(公告)号：US09748164B2

公开(公告)日：2017-08-29

申请号：US14196778

申请日：2014-03-04

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi ,  Yoshitaka Bando ,  Hiroto Tamaki

IPC: H01L23/495 ,  H01L33/62

CPC classification number: H01L23/49537 ,  H01L21/4828 ,  H01L23/49503 ,  H01L23/49544 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49582 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A lead frame of high quality which can endure direct bonding to the electrodes of a semiconductor element and a metal member, and a semiconductor device of high reliability which utilizing the lead frame. The lead frame includes a pair of lead frame portions which are arranged spaced apart from and opposite to each other to be electrically connected to a pair of electrodes of a semiconductor element respectively, and a pair of support bars which are arranged spaced apart from the lead portions and extending from a side of either one of the lead portions to a side of the other lead portion.

公开(公告)号：US09705053B2

公开(公告)日：2017-07-11

申请号：US14747640

申请日：2015-06-23

Applicant: NICHIA CORPORATION

Inventor： Takeshi Ikegami ,  Hiroto Tamaki

IPC: H01L33/00 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62 ,  H01L27/15 ,  H01L33/32 ,  H01L25/075 ,  H01L33/60

CPC classification number: H01L33/502 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/20 ,  H01L33/32 ,  H01L33/46 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2924/01078 ,  H01L2933/0041

Abstract: A light emitting device includes at least one semiconductor light emitting element, and a wavelength conversion layer which is formed on a surface of the semiconductor light emitting element and which includes a resin layer containing a wavelength conversion member for converting a wavelength of light emitted from the semiconductor light emitting element. The wavelength conversion layer covers an upper surface or the upper surface and a side surface of the semiconductor light emitting element. A content of an inorganic material including the wavelength conversion member, or a content of an inorganic material including the wavelength conversion member and an inorganic filler, in the resin layer is 30% by mass or more and 99% by mass or less.

公开(公告)号：US09666774B2

公开(公告)日：2017-05-30

申请号：US14866317

申请日：2015-09-25

Applicant: Nichia Corporation

Inventor： Suguru Beppu ,  Yoichi Bando ,  Hiroto Tamaki ,  Takuya Nakabayashi

IPC: H01L33/60 ,  H01L33/50

CPC classification number: H01L33/60 ,  H01L33/50 ,  H01L2224/73253 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.

公开(公告)号：US09653659B2

公开(公告)日：2017-05-16

申请号：US14561626

申请日：2014-12-05

Applicant: NICHIA CORPORATION

Inventor： Takeshi Ikegami ,  Tadao Hayashi ,  Hiroto Tamaki

IPC: H01L33/50

CPC classification number: H01L33/502 ,  H01L33/486 ,  H01L33/501 ,  H01L33/505 ,  H01L33/508 ,  H01L2224/16225 ,  H01L2933/0033 ,  H01L2933/0041

Abstract: Provided is a light emitting device having a phosphor layer on a surface of a semiconductor light emitting element and reducing unevenness in light distribution color, and a method of manufacturing the same. A light emitting device 100 includes a light emitting element 20 with a supporting body which is composed of a semiconductor light emitting element 1 and a supporting body 10, and a phosphor layer 7 which continuously covers an upper surface and side surfaces of the semiconductor light emitting element 1, and side surfaces of the supporting body 10. The phosphor layer 7 is configured such that at least a lower portion of the side surface of the supporting body 10 is thinner than the upper surface and the side surface of the semiconductor light emitting element 1. Such a configuration of the phosphor layer can be formed by applying a spray-coating of a slurry containing phosphor particles and a thermosetting resin in a solvent on the semiconductor light emitting element 1 side of the light emitting element 20 which has the supporting body.

公开(公告)号：US09548261B2

公开(公告)日：2017-01-17

申请号：US14196805

申请日：2014-03-04

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi ,  Yoshitaka Bando ,  Hiroto Tamaki

IPC: H01L23/495 ,  H01L33/62

CPC classification number: H01L23/49503 ,  H01L23/49562 ,  H01L23/49582 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A lead frame of high quality which can endure direct bonding to a semiconductor element, and a semiconductor device of high reliability which utilizing the lead frame. A lead frame includes a plurality of connected units, each unit including a pair of lead portions arranged spaced apart and opposite from each other, for mounting a semiconductor element and electrically connecting to a pair of electrodes of the semiconductor element respectively. The lead portions respectively include an element mounting region arranged on a surface thereof to mount the semiconductor element, and a groove extending from opposing end surfaces of each of the pair of lead portions, in a direction away from the end surfaces and bending in a surrounding manner along outer periphery of the element mounting region.

Abstract translation: 可以承受与半导体元件的直接接合的高质量的引线框架，以及利用引线框架的高可靠性的半导体器件。 引线框架包括多个连接的单元，每个单元包括彼此间隔开并相对布置的一对引线部分，用于安装半导体元件并电连接到半导体元件的一对电极。 引线部分分别包括布置在其表面上以安装半导体元件的元件安装区域和从远离端面的方向从一对引线部分的每一个的相对端表面延伸的凹槽，并在周围 方式沿着元件安装区域的外周。

公开(公告)号：US09368704B2

公开(公告)日：2016-06-14

申请号：US14196754

申请日：2014-03-04

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi ,  Yoshitaka Bando ,  Hiroto Tamaki

IPC: H01L33/00 ,  H01L33/62 ,  H01L23/495

CPC classification number: H01L33/62 ,  H01L23/495 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A lead frame of high quality which can endure direct bonding to a light emitting element, and a light emitting device of high reliability which utilizing the lead frame. A lead frame includes a clad material which is a stacked layer of at least a first metal layer and a second metal layer, the second metal layer made of a metal which is different from the metal of the first metal layer, and a through portion. In the through-portion, an end surface of the first metal layer and an end surface of the second metal layer are covered with a plated layer. The end surface of either the first metal layer or the second metal layer protrudes farther into the through-portion than the end surface of the other metal layer.

Abstract translation: 可以承受与发光元件的直接接合的高质量的引线框架和利用引线框架的高可靠性的发光器件。 引线框架包括作为至少第一金属层和第二金属层的堆叠层的包覆材料，由与第一金属层的金属不同的金属制成的第二金属层和贯通部。 在贯通部中，第一金属层的端面和第二金属层的端面被电镀层覆盖。 第一金属层或第二金属层的端面比另一金属层的端面进一步向贯通部突出。

公开(公告)号：US09190587B2

公开(公告)日：2015-11-17

申请号：US14015171

申请日：2013-08-30

Applicant: NICHIA CORPORATION

Inventor： Yukitoshi Marutani ,  Hiroto Tamaki ,  Tadaaki Miyata

IPC: H01L33/62 ,  H01L25/075 ,  F21K99/00 ,  F21Y101/02 ,  F21Y103/00

CPC classification number: H01L25/0753 ,  F21K9/27 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16

Abstract: A light-emitting device may comprise a substrate, an electric wire fixed to the substrate, and a plurality of light-emitting diodes mounted to the electric wire. According to one embodiment, each of the plurality of light-emitting diodes is an LED chip, and the light-emitting diodes on the substrate are sealed individually or collectively by one or more sealing members. According to another embodiment, the substrate has a plurality of through holes, wherein a plurality of portions of the electric wire provided on a rear surface side of the substrate communicates with a front surface side of the substrate at the plurality of through holes of the substrate, and wherein the plurality of light-emitting diodes is respectively mounted to the respective portions of the electric wire that communicate with the front surface side of the substrate. Other embodiments relate to methods of manufacturing a light-emitting device.

Abstract translation: 发光装置可以包括基板，固定到基板的电线和安装到电线的多个发光二极管。 根据一个实施例，多个发光二极管中的每一个是LED芯片，并且基板上的发光二极管被一个或多个密封构件单独地或共同地密封。 根据另一实施例，基板具有多个通孔，其中设置在基板的背面侧的电线的多个部分与基板的表面侧在基板的多个通孔处连通 并且其中多个发光二极管分别安装到与基板的前表面侧连通的电线的各个部分。 其他实施例涉及制造发光器件的方法。