公开(公告)号：US10026880B2

公开(公告)日：2018-07-17

申请号：US15509505

申请日：2015-09-08

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： David Racz ,  Michael Zitzlsperger ,  Georg Bogner

IPC: H01L33/58 ,  H01L33/48 ,  H01L33/50 ,  H01L33/62 ,  H01L25/075

Abstract: An optoelectronic component includes a carrier, a light source formed on the carrier, the light source having at least one luminous face formed by one or more light emitting diodes, wherein an at least partly transparent lamina is arranged on the luminous face, the lamina having a surface facing the luminous face and a surface facing away from the luminous face, wherein at least one conversion layer and a color scattering layer for generating a color by light scattering are arranged on at least one of the facing and facing-away surfaces, wherein the conversion layer is arranged upstream of the color scattering layer relative to an emission direction of light from the luminous face, such that light emitted by the luminous face can first be converted and then be scattered.

公开(公告)号：US09978916B2

公开(公告)日：2018-05-22

申请号：US15509507

申请日：2015-09-08

Applicant: OSRAM OPTO Semiconductors GmbH

Inventor： David Racz ,  Michael Zitzlsperger ,  Günter Spath

IPC: H01L33/58 ,  H01L33/48 ,  H01L33/50 ,  H01L33/62 ,  H01L33/44 ,  H01L33/54 ,  H01L25/075 ,  H01L25/16 ,  H01L33/56

Abstract: An optoelectronic component includes a carrier, and a light source arranged on a surface of the carrier, said light source including at least one luminous surface formed by at least one light-emitting diode, wherein a transparent converter-free spacer is arranged on the luminous surface such that a distance is formed between the luminous surface and a spacer surface of the spacer facing away from the luminous surface, and wherein the light source is potted by a potting compound such that the spacer surface is formed extending flush with a potting compound surface facing away from the surface of the carrier and a surface formed by a spacer surface and the potting compound surface is plane.

公开(公告)号：US09780273B2

公开(公告)日：2017-10-03

申请号：US14784414

申请日：2014-04-16

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Boris Eichenberg ,  Michael Zitzlsperger

IPC: H01L33/00 ,  H01L33/62 ,  H01L33/54 ,  H01L33/48 ,  H01L33/52

CPC classification number: H01L33/62 ,  H01L33/48 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00

Abstract: An optoelectronic component includes a carrier substrate; at least one light emitting semiconductor chip arranged on a surface of the carrier substrate; and a frame part at least laterally partly surrounding the light emitting semiconductor chip; and comprising an injection-molded body, and wherein the frame part includes an injection-molded body and a diaphragm part, the diaphragm part including a protuberance enclosed by the injection-molded body.

公开(公告)号：US09761512B2

公开(公告)日：2017-09-12

申请号：US14644268

申请日：2015-03-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Stephan Preuss ,  Michael Zitzlsperger

IPC: H01L23/495 ,  G01R31/26 ,  G01R27/02 ,  H01L33/62 ,  H01L21/66

CPC classification number: H01L23/49551 ,  G01R27/02 ,  G01R31/26 ,  H01L22/14 ,  H01L22/20 ,  H01L23/49555 ,  H01L23/49562 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A leadframe assembly is formed from an electrically conductive material. The leadframe assembly includes a first longitudinal element, at least one second longitudinal element, a plurality of first leadframe sections and a plurality of second leadframe sections.

公开(公告)号：US09620694B2

公开(公告)日：2017-04-11

申请号：US15102904

申请日：2014-12-10

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger ,  Matthias Goldbach

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2924/00014 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2224/4554

Abstract: An optoelectronic component includes a leadframe, a molded body connected to the leadframe, and an optoelectronic semiconductor chip arranged on the leadframe, wherein the leadframe includes an alignment opening, and wherein the molded body includes a recess via which the leadframe is exposed in the area of the alignment opening.

公开(公告)号：US20170095955A1

公开(公告)日：2017-04-06

申请号：US15126071

申请日：2015-03-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger

IPC: B29C45/14 ,  H01L23/043 ,  H01L21/56 ,  B29C45/02 ,  B29C43/18

CPC classification number: B29C45/14655 ,  B29C43/18 ,  B29C45/0053 ,  B29C45/02 ,  B29C2043/181 ,  B29C2793/0072 ,  B29K2705/04 ,  B29L2031/3481 ,  H01L21/4803 ,  H01L21/561 ,  H01L21/565 ,  H01L23/043

Abstract: A method of producing a housing for an electronic device including: in a three-dimensional molding process, a housing part assembly consisting of a plurality of contiguous plastics housing parts is produced using a plastics material; and the housing part assembly is split up into a plurality of individual plastics housing parts by a separation procedure, each one of the parts forming at least a part of a housing, wherein the molding process is transfer molding or compression molding, a mold is used for the molding process including mold pins by which first side faces molded on during the molding process are produced on each of the plastics housing parts, the separation procedure results in second side faces being produced on each of the plastics housing parts, and the first and second side faces form outer faces of the plastics housing parts.

公开(公告)号：US20160118553A1

公开(公告)日：2016-04-28

申请号：US14889653

申请日：2013-05-17

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Juergen Holz ,  Michael Zitzlsperger

IPC: H01L33/54 ,  H01L33/50

CPC classification number: H01L33/54 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/05554 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0091

Abstract: An optoelectronic component includes a housing having a first cavity open toward an upper side of the housing, and a second cavity open toward the upper side of the housing, wherein the first cavity and the second cavity connect by a connecting channel, an optoelectronic semiconductor chip is arranged in the first cavity, a potting material is arranged in a region of the first cavity enclosing the optoelectronic semiconductor chip, a bond wire is arranged between an electrical contact surface of the optoelectronic semiconductor chip and a bond surface of the housing, and the bond surface is arranged in the connecting channel.

Abstract translation: 光电子部件包括壳体，其具有朝向壳体的上侧开口的第一腔体和朝向壳体的上侧开口的第二腔体，其中第一腔体和第二腔室通过连接通道连接，光电半导体芯片 布置在第一空腔中，封装材料布置在封装光电半导体芯片的第一腔的区域中，在光电半导体芯片的电接触表面和壳体的接合表面之间布置有接合线，并且 接合表面布置在连接通道中。

公开(公告)号：US20160087182A1

公开(公告)日：2016-03-24

申请号：US14958740

申请日：2015-12-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger ,  Harald Jaeger

IPC: H01L33/62 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L33/486 ,  H01L33/54 ,  H01L33/60 ,  H01L33/64 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1715 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A surface-mountable optoelectronic component has a radiation passage face, an optoelectronic semiconductor chip and a chip carrier. A cavity is formed in the chip carrier and the semiconductor chip is arranged in the cavity. A molding surrounds the chip carrier at least in places. The chip carrier extends completely through the molding in a vertical direction perpendicular to the radiation passage face.

公开(公告)号：US20160043291A1

公开(公告)日：2016-02-11

申请号：US14783255

申请日：2014-04-09

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Tobias Gebuhr ,  Christian Ziereis ,  Michael Zitzlsperger

IPC: H01L33/56 ,  H01L25/075 ,  H01L33/54 ,  H01L33/48 ,  H01L33/08 ,  H01L25/00 ,  H01L33/62

CPC classification number: H01L33/56 ,  H01L25/0753 ,  H01L25/50 ,  H01L33/08 ,  H01L33/48 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: An optoelectronic component includes a carrier including a mounting surface, at least one light-emitting element arranged on the mounting surface and electrically conductively connected to the carrier, at least one reinforcing body integrated in the optoelectronic component, a housing consisting of a housing encapsulation compound or a housing molding compound, wherein the light emitting component is arranged in an emitter cavity of the housing, and a reinforcing body cavity in which the reinforcing body is arranged fully or partially encapsulated or encased with a reinforcing body encapsulation compound.

Abstract translation: 光电子部件包括载体，其包括安装表面，至少一个发光元件，其布置在安装表面上并导电地连接到载体，至少一个集成在光电子部件中的增强体，由壳体封装化合物 或壳体模制化合物，其中所述发光部件布置在所述壳体的发射器腔体中，以及加强体腔体，其中所述增强体被完全或部分地包封或包裹有增强体包封化合物。

公开(公告)号：US09190394B2

公开(公告)日：2015-11-17

申请号：US14346687

申请日：2012-09-21

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Frank Singer ,  Michael Zitzlsperger ,  Stefan Groetsch

IPC: H01L29/18 ,  H01L29/22 ,  H01L25/075 ,  H01L33/62 ,  F21S8/10 ,  H01L33/64

CPC classification number: H01L25/0753 ,  F21S41/141 ,  H01L24/73 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/19107 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

Abstract: An LED module has an electrically insulating main body, a base surface and a mounting surface located opposite the base surface. A number of electrical connection contacts are arranged at the mounting surface. The connection contacts do not adjoin the base surface. A heat sink is arranged in the main body. The heat sink extends from the mounting surface as far as the base surface. Furthermore, the LED module has a number of LED chips, each having an electrically insulating carrier substrate at a chip underside and two chip contacts at a chip top side. The LED chips are arranged with the electrically insulating carrier substrate on the heat sink.

Abstract translation: LED模块具有电绝缘主体，基面和与基面相对的安装面。 多个电连接触点设置在安装表面。 连接触点不与基面相邻。 散热器布置在主体中。 散热片从安装表面延伸到基面最远处。 此外，LED模块具有多个LED芯片，每个LED芯片在芯片下侧具有电绝缘载体基板，在芯片顶侧具有两个芯片触点。 LED芯片布置有散热器上的电绝缘载体衬底。