公开(公告)号：US20150244148A1

公开(公告)日：2015-08-27

申请号：US14432109

申请日：2013-09-23

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Thomas Schwarz

IPC: H01S5/10 ,  H01S5/022

CPC classification number: H01S5/1082 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01S5/005 ,  H01S5/02212 ,  H01S5/02252 ,  H01S5/02288 ,  H01S5/02296 ,  H01S5/02469 ,  H01S5/32341 ,  H01S5/4018 ,  H01S5/4031 ,  H01L2924/00014

Abstract: An optoelectronic component includes a generating device for generating electromagnetic radiation and an outcoupling device for coupling out electromagnetic radiation from the generating device. A reducing device for reducing a radiation density of the outcoupled electromagnetic radiation is arranged on a radiation output side of the outcoupling device.

Abstract translation: 光电子部件包括用于产生电磁辐射的产生装置和用于耦合出来自发生装置的电磁辐射的输出耦合装置。 用于降低输出耦合的电磁辐射的辐射密度的还原装置被布置在输出耦合装置的辐射输出侧。

公开(公告)号：US20150243857A1

公开(公告)日：2015-08-27

申请号：US14424796

申请日：2013-08-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Sabathil ,  Stefan Illek ,  Thomas Schwarz ,  Walter Wegleiter

IPC: H01L33/56 ,  H01L33/60 ,  H01L33/54 ,  H01L33/62

CPC classification number: H01L33/56 ,  H01L33/36 ,  H01L33/38 ,  H01L33/382 ,  H01L33/385 ,  H01L33/405 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00

Abstract: An optoelectronic semi-conductor component includes an optoelectronic semi-conductor chip embedded into an electrically-insulating shaped body that has an upper face and a lower face. In the shaped body, an electrical via is also embedded which forms an electrically-conductive connection between the upper face and the lower face of the shaped body. On the upper face of the shaped body, a reflective layer is arranged which forms an electrically-conductive connection between an electrical semi-conductor chip contact and the via. The reflective layer covers at least 50% of the upper face of the shaped body.

Abstract translation: 光电半导体部件包括嵌入到电绝缘成形体中的光电半导体芯片，其具有上表面和下表面。 在成形体中，也嵌有电通孔，其在成形体的上表面和下表面之间形成导电连接。 在成形体的上表面上，布置反射层，其在电半导体芯片接触件和通孔之间形成导电连接。 反射层覆盖成形体的上表面的至少50％。

公开(公告)号：US20150235919A1

公开(公告)日：2015-08-20

申请号：US14413748

申请日：2013-07-16

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Sabathil ,  Stefan Illek ,  Thomas Schwarz

IPC: H01L23/373 ,  H01L31/024 ,  H01L33/64

CPC classification number: H01L23/3731 ,  H01L31/024 ,  H01L33/56 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2924/181 ,  H01L2933/0075 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Disclosed is a non-transitory computer-readable storage medium that stores a game program that processes progress of a game using a plurality of game mediums, the game program causing a computer to execute: moving each of the game mediums along a predetermined path in a game field including a plurality of regions; first displaying a selection object capable of selecting at least one of the plurality of regions so that the selection object is fired according to an operation detected by a predetermined input unit; and changing, when one of the plurality of regions is selected by the selection object, an attribute set in the region to change the predetermined path where the game medium moves.

Abstract translation: 公开了一种非暂时性计算机可读存储介质，其存储使用多个游戏介质处理游戏进程的游戏程序，所述游戏程序使得计算机执行：沿着预定路径移动每个游戏介质 游戏场包括多个区域; 首先显示能够选择多个区域中的至少一个的选择对象，使得根据由预定输入单元检测到的操作来触发选择对象; 以及当所述选择对象选择所述多个区域中的一个区域时，改变所述区域中设置的属性，以改变所述游戏介质移动的预定路径。

公开(公告)号：US20150194583A1

公开(公告)日：2015-07-09

申请号：US14414803

申请日：2013-07-16

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Mathias Sabathil ,  Stefan Illek ,  Thomas Schwarz

IPC: H01L33/60 ,  H01L33/54 ,  H01L33/56 ,  H01L25/075 ,  H01L33/48

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L25/167 ,  H01L25/50 ,  H01L31/00 ,  H01L31/02322 ,  H01L33/46 ,  H01L33/486 ,  H01L33/54 ,  H01L33/56 ,  H01L51/5271 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00

Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a first surface. The semiconductor chip is embedded in a mold body. The first surface is elevated with respect to a top side of the mold body. A reflective layer is arranged on the top side of the mold body.

Abstract translation: 光电子半导体部件包括具有第一表面的光电子半导体芯片。 半导体芯片嵌入模具体内。 第一表面相对于模具主体的顶侧被提升。 反射层设置在模体的顶侧。

公开(公告)号：US20250096206A1

公开(公告)日：2025-03-20

申请号：US18970720

申请日：2024-12-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael BRANDL ,  Andreas Dobner ,  Matthias Goldbach ,  Sebastian Wittmann ,  Uli Hiller ,  Markus Klein ,  Thomas Schwarz ,  Andreas Waldschik ,  Michael Wittmann ,  Matthias Bruckschloegl ,  Stefan Groetsch ,  Rainer Huber ,  Peter Brick ,  Ludwig Hofbauer

IPC: H01L25/075 ,  B60K35/00 ,  H01L33/60

Abstract: An optoelectronic device, in particular an at least partially transparent pane for example of a vehicle, comprises a first layer, in particular an intermediate layer arranged between a cover layer and a carrier layer, at least one electronic or optoelectronic component, which is at least partially or completely embedded in the first layer and at least one structured conductor layer. A first portion of the conductor layer is arranged on an upper surface of the first layer and a second portion of the conductor layer is arranged on a top surface of the electronic or optoelectronic component and is in contact with an electric contact of the electronic or optoelectronic component. The electric contact, in particular a contact pad, is arranged on the top surface.

公开(公告)号：US12249597B2

公开(公告)日：2025-03-11

申请号：US17638681

申请日：2020-10-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Sebastian Wittmann ,  Thomas Schwarz

IPC: H01L25/16 ,  H01L23/538 ,  H01L25/065 ,  H01L25/075 ,  H01L33/62 ,  G09G3/32 ,  H01L23/00

Abstract: A display device with a connection carrier and a plurality of pixels, which are drivable via row lines and column lines, is specified. The row lines and the column lines are arranged on the connection carrier. At least one row line is interrupted at an imaginary crossing point with a column line on the connection carrier. A bridging component is arranged on the connection carrier, which bridges the row line at the imaginary crossing point in an electrically conductive manner.

公开(公告)号：US12095015B2

公开(公告)日：2024-09-17

申请号：US17414861

申请日：2019-12-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Andreas Dobner ,  Frank Singer ,  Stefan Groetsch

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/00 ,  H01L33/50

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/50 ,  H01L2933/0058 ,  H01L2933/0091

Abstract: An optoelectronic light emitting device includes a pixel with a transparent or translucent carrier substrate, on which a semiconductor light emitting arrangement with at least one micro LED is arranged. The micro LED extends over a partial area of the pixel. The main radiation direction of the semiconductor light emitting arrangement is directed onto a backscattering surface element arranged behind the transparent carrier substrate in viewing direction. The semiconductor light emitting arrangement includes a beam shaping element.

公开(公告)号：US12040317B2

公开(公告)日：2024-07-16

申请号：US17541761

申请日：2021-12-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Brandl ,  Andreas Dobner ,  Matthias Goldbach ,  Sebastian Wittmann ,  Uli Hiller ,  Markus Klein ,  Thomas Schwarz ,  Andreas Waldschik ,  Michael Wittmann ,  Matthias Bruckschloegl ,  Stefan Groetsch ,  Rainer Huber ,  Peter Brick ,  Ludwig Hofbauer

IPC: H04W72/20 ,  H01L25/075 ,  H01L33/46 ,  H01L33/62 ,  H01L33/64 ,  H04W72/51 ,  B60J3/00 ,  B60K35/00 ,  B60K35/60 ,  B62J50/22

CPC classification number: H01L25/0756 ,  H01L33/46 ,  H01L33/62 ,  H01L33/641 ,  H04W72/20 ,  H04W72/51 ,  B60J3/00 ,  B60K35/00 ,  B60K35/60 ,  B60K2370/785 ,  B62J50/22

Abstract: An optoelectronic device comprises a plurality of optoelectronic light sources being arranged on a first layer, in particular an intermediate layer being arranged between a cover layer and a carrier layer. The first layer comprises or consists of an at least partially transparent material and each optoelectronic light source of the plurality of optoelectronic light sources comprises an individual light converter for converting light emitted by the associated light source into converted light. The light converter of each optoelectronic light source is arranged on the first layer and/or the associated optoelectronic light source.

公开(公告)号：US11610868B2

公开(公告)日：2023-03-21

申请号：US17039097

申请日：2020-09-30

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Peter Brick ,  Jean-Jacques Drolet ,  Hubert Halbritter ,  Laura Kreiner ,  Thomas Schwarz ,  Julia Stolz

IPC: H01L25/075 ,  H01L33/60 ,  H01L33/50 ,  H01L33/24 ,  H01L33/32

Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.

公开(公告)号：US20220406757A1

公开(公告)日：2022-12-22

申请号：US17638710

申请日：2020-08-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Alexander F. Pfeuffer ,  Tobias Meyer ,  Korbinian Perzlmaier ,  Thomas Schwarz ,  Sebastian Hoibl

IPC: H01L25/075 ,  H01L33/00 ,  H01L33/62

Abstract: In an embodiment a method for producing radiation-emitting semiconductor chips includes providing a semiconductor wafer, applying first contact layers on the semiconductor wafer, applying a second dielectric layer on the semiconductor wafer and the first contact layers, attaching a carrier arrangement to the semiconductor wafer, singulating the semiconductor wafer into semiconductor bodies and applying second contact layers on the semiconductor bodies, wherein the second dielectric layer is formed such that it mechanically stabilizes itself.