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    METHODS FOR REDUCING METAL OXIDE SURFACES TO MODIFIED METAL SURFACES
    41.
    发明申请
    METHODS FOR REDUCING METAL OXIDE SURFACES TO MODIFIED METAL SURFACES 审中-公开
    将金属氧化物表面还原成改性金属表面的方法

    公开(公告)号：US20140199497A1

    公开(公告)日：2014-07-17

    申请号：US13741151

    申请日：2013-01-14

    申请人： Tighe A. Spurlin ,  Steven T. Mayer ,  Jonathan D. Reid ,  Artur Kolics ,  Huanfeng Zhu

    发明人： Tighe A. Spurlin ,  Steven T. Mayer ,  Jonathan D. Reid ,  Artur Kolics ,  Huanfeng Zhu

    IPC分类号： B05D3/10

    CPC分类号： C23C18/1882 ,  C23C18/1653 ,  C25D5/34 ,  C25D21/12 ,  H01L21/76861 ,  H01L21/76873

    摘要： Method and apparatus for reducing metal oxide surfaces to modified metal surfaces are disclosed. Metal oxide surfaces are reduced to form a film integrated with a metal seed layer by contacting a solution with a reducing agent with the metal oxide surfaces. The solution with the reducing agent can contact the metal oxide surfaces under conditions that form an integrated film with the metal seed layer, and that reduces reoxidation from exposure the ambient environment. In some embodiments, an additive can be included with the reducing agent to form a surface protecting layer on the metal seed layer. In some embodiments, the metal is copper used in damascene copper structures.

    摘要翻译： 公开了将金属氧化物表面还原成改性金属表面的方法和装置。 通过使溶液与还原剂与金属氧化物表面接触，还原金属氧化物表面以形成与金属种子层一体化的膜。 具有还原剂的溶液可以在与金属种子层形成集成膜的条件下接触金属氧化物表面，并且减少暴露于周围环境中的再氧化。 在一些实施方案中，还原剂可以包含添加剂以在金属种子层上形成表面保护层。 在一些实施例中，金属是铜镶嵌铜结构中使用的铜。

    Process for electroplating metals into microscopic recessed features
    46.
    发明授权
    Process for electroplating metals into microscopic recessed features 有权
    将金属电镀成微观凹陷特征的工艺

    公开(公告)号：US08048280B2

    公开(公告)日：2011-11-01

    申请号：US11228712

    申请日：2005-09-16

    申请人： Steven T. Mayer ,  Vijay Bhaskaran ,  Evan E. Patton ,  Robert L. Jackson ,  Jonathan Reid

    发明人： Steven T. Mayer ,  Vijay Bhaskaran ,  Evan E. Patton ,  Robert L. Jackson ,  Jonathan Reid

    IPC分类号： C25D5/18 ,  C25D7/12 ,  H01L21/768

    CPC分类号： C25D3/02 ,  C25D3/38 ,  C25D5/022 ,  C25D5/18 ,  H01L21/2885 ,  H01L21/76877 ,  H05K3/423

    摘要： Several techniques are described for reducing or mitigating the formation of seams and/or voids in electroplating the interior regions of microscopic recessed features. Cathodic polarization is used to mitigate the deleterious effects of introducing a substrate plated with a seed layer into an electroplating solution. Also described are diffusion-controlled electroplating techniques to provide for bottom-up filling of trenches and vias, avoiding thereby sidewalls growing together to create seams/voids. A preliminary plating step is also described that plates a thin film of conductor on the interior surfaces of features leading to adequate electrical conductivity to the feature bottom, facilitating bottom-up filling.

    摘要翻译： 描述了几种用于减少或减轻在电镀微观凹陷特征的内部区域中的接缝和/或空隙的形成的技术。 阴极极化用于减轻将电镀有种子层的基板引入电镀溶液中的有害影响。 还描述了扩散控制的电镀技术，以提供沟槽和通孔的自下而上的填充，从而避免由此侧壁一起生长以产生接缝/空隙。 还描述了初步电镀步骤，在特征的内表面上镀覆导电薄膜，导致特征底部具有足够的导电性，便于自底向上填充。

    Method of electroplating using a high resistance ionic current source
    47.
    发明授权
    Method of electroplating using a high resistance ionic current source 有权
    使用高电阻离子电流源的电镀方法

    公开(公告)号：US07967969B2

    公开(公告)日：2011-06-28

    申请号：US12578310

    申请日：2009-10-13

    申请人： Steven T. Mayer ,  Jonathan D. Reid

    发明人： Steven T. Mayer ,  Jonathan D. Reid

    IPC分类号： C25D5/00 ,  C25D7/12 ,  C25D21/12

    CPC分类号： C25D17/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/008 ,  H01L21/2885 ,  Y10S204/07

    摘要： A substantially uniform layer of a metal is electroplated onto a work piece having a seed layer thereon. This is accomplished by employing a “high resistance ionic current source,” which solves the terminal problem by placing a highly resistive membrane (e.g., a microporous ceramic or fretted glass element) in close proximity to the wafer, thereby swamping the system's resistance. The membrane thereby approximates a constant current source. By keeping the wafer close to the membrane surface, the ionic resistance from the top of the membrane to the surface is much less than the ionic path resistance to the wafer edge, substantially compensating for the sheet resistance in the thin metal film and directing additional current over the center and middle of the wafer.

    摘要翻译： 将基本上均匀的金属层电镀在其上具有种子层的工件上。 这是通过使用“高电阻离子电流源”来实现的，其通过将高电阻膜（例如，微孔陶瓷或微波玻璃元件）放置在靠近晶片来解决端子问题，从而消除系统的电阻。 因此，膜近似于恒定电流源。 通过保持晶片靠近膜表面，从膜顶部到表面的离子电阻远小于对晶片边缘的离子路径电阻，基本上补偿薄金属膜中的薄层电阻并引导附加电流 在晶片的中心和中间。

    REDUCED ISOTROPIC ETCHANT MATERIAL CONSUMPTION AND WASTE GENERATION
    48.
    发明申请
    REDUCED ISOTROPIC ETCHANT MATERIAL CONSUMPTION AND WASTE GENERATION 有权
    减少等温蚀刻材料消耗和废物产生

    公开(公告)号：US20110056913A1

    公开(公告)日：2011-03-10

    申请号：US12871662

    申请日：2010-08-30

    申请人： Steven T. Mayer ,  David W. Porter

    发明人： Steven T. Mayer ,  David W. Porter

    IPC分类号： C23F1/46 ,  C23F1/08 ,  C23F1/00

    CPC分类号： C23F1/46 ,  C23F1/08 ,  C23F1/34 ,  C25C7/00 ,  H01L21/30604 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67051

    摘要： Methods and apparatus for isotropically etching a metal from a work piece, while recovering and reconstituting the chemical etchant are described. Various embodiments include apparatus and methods for etching where the recovered and reconstituted etchant is reused in a continuous loop recirculation scheme. Steady state conditions can be achieved where these processes are repeated over and over with occasional bleed and feed to replenish reagents and/or adjust parameters such as pH, ionic strength, salinity and the like.

    摘要翻译： 描述了在回收和重构化学蚀刻剂的同时从工件各向同性蚀刻金属的方法和装置。 各种实施例包括用于蚀刻的装置和方法，其中回收和重构的蚀刻剂以连续循环再循环方案重复使用。 可以实现稳定状态条件，其中这些方法反复反复，偶尔出血和进料以补充试剂和/或调节诸如pH，离子强度，盐度等参数。

    Monitoring of electroplating additives
    49.
    发明申请
    Monitoring of electroplating additives 有权
    电镀添加剂监测

    公开(公告)号：US20110025338A1

    公开(公告)日：2011-02-03

    申请号：US12462354

    申请日：2009-08-03

    申请人： Mark J. Willey ,  Lian Guo ,  Steven T. Mayer

    发明人： Mark J. Willey ,  Lian Guo ,  Steven T. Mayer

    IPC分类号： G01N27/06

    CPC分类号： G01N27/42

    摘要： The working electrode in the flow channel of a flow-through electrolytic detection cell is preconditioned by flowing a preconditioning electroplating solution with preconditioner species through the flow channel while applying a negative potential. Flow of liquid through the flow channel is rapidly switched from preconditioning solution to a target solution containing an organic target solute to be measured. The transient response of the system resulting from exposure of the working electrode to organic target solute is detected by measuring current density during an initial transient time period. An unknown concentration of target solute is determined by comparing the transient response with one or more transient responses characteristic of known concentrations. A preferred measuring system is operable to switch flow from preconditioning solution to target solution in about 200 milliseconds or less.

    摘要翻译： 通过电流检测单元的流动通道中的工作电极通过在施加负电位的情况下通过流动通道流动具有预调节剂种类的预处理电镀溶液来预处理。 通过流动通道的液体流从预处理溶液快速切换到含有待测量的有机靶溶质的目标溶液。 通过在初始瞬变时间段内测量电流密度来检测由工作电极暴露于有机靶溶质而产生的系统的瞬态响应。 通过将瞬态响应与已知浓度特征的一个或多个瞬态响应进行比较来确定目标溶质浓度未知。 优选的测量系统可操作以在大约200毫秒或更短的时间内将流从预处理溶液切换到目标溶液。

    Rotationally asymmetric variable electrode correction
    50.
    发明授权
    Rotationally asymmetric variable electrode correction 有权
    旋转不对称可变电极校正

    公开(公告)号：US07682498B1

    公开(公告)日：2010-03-23

    申请号：US11179984

    申请日：2005-07-11

    申请人： Steven T. Mayer ,  John S. Drewery

    发明人： Steven T. Mayer ,  John S. Drewery

    IPC分类号： B23H3/00 ,  C25D5/00 ,  C25D5/18 ,  C25D17/10 ,  B23H7/14 ,  C25D21/12

    CPC分类号： B23H3/04 ,  C25D5/04 ,  C25D5/18 ,  C25D7/123 ,  C25D17/001 ,  C25D17/12 ,  C25D21/12

    摘要： A work piece is electroplated or electroplanarized using an azimuthally asymmetric electrode. The azimuthally asymmetric electrode is rotated with respect to the work piece (i.e., either or both of the work piece and the electrode may be rotating). The azimuthal asymmetry provides a time-of-exposure correction to the current distribution reaching the work piece. In some embodiments, the total current is distributed among a plurality of electrodes in a reaction cell in order to tailor the current distribution in the electrolyte over time. Focusing elements may be used to create “virtual electrode” in proximity to the surface of the work piece to further control the current distribution in the electrolyte during plating or planarization.

    摘要翻译： 使用方位不对称电极对工件进行电镀或电平面化处理。 方位不对称电极相对于工件旋转（即，工件和电极中的任一个或两者可以旋转）。 方位不对称性提供了到达工件的当前分布的曝光时间校正。 在一些实施例中，总电流分布在反应池中的多个电极之间，以便随着时间的推移来调整电解质中的电流分布。 可以使用聚焦元件在工件的表面附近产生“虚拟电极”，以进一步控制在电镀或平坦化期间电解液中的电流分布。