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    Sensor semiconductor device and method for fabricating the same
    42.
    发明申请
    Sensor semiconductor device and method for fabricating the same 审中-公开
    传感器半导体器件及其制造方法

    公开(公告)号：US20090057799A1

    公开(公告)日：2009-03-05

    申请号：US12229651

    申请日：2008-08-26

    申请人： Chang-Yueh Chan ,  Chih-Ming Huang ,  Chien-Ping Huang ,  Chin-Huang Chang ,  Cheng-Hsu Hsiao

    发明人： Chang-Yueh Chan ,  Chih-Ming Huang ,  Chien-Ping Huang ,  Chin-Huang Chang ,  Cheng-Hsu Hsiao

    IPC分类号： H01L31/00 ,  H01L21/00

    CPC分类号： H01L31/0203 ,  H01L31/02164 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A sensor semiconductor device and a method for fabricating the same are provided. At least one sensor chip is mounted and electrically connected to a lead frame. A first and a second encapsulation molding processes are sequentially performed to form a transparent encapsulant for encapsulating the sensor chip and a part of the lead frame and to form a light-impervious encapsulant for encapsulating the transparent encapsulant. The transparent encapsulant has a light-pervious portion formed at a position corresponding to and above a sensor zone of the sensor chip. The light-pervious portion is exposed from the light-impervious encapsulant. Light may penetrate the light-pervious portion, without using an additional cover board, thereby reducing manufacturing steps and costs. The above arrangement avoids prior-art problems of poor reliability caused by a porous encapsulant and poor signal reception caused by interference of ambient light entering into a conventional chip only encapsulated by a transparent encapsulant.

    摘要翻译： 提供一种传感器半导体器件及其制造方法。 至少一个传感器芯片被安装并电连接到引线框架。 依次执行第一和第二封装成型工艺以形成用于封装传感器芯片和引线框架的一部分的透明密封剂，并形成用于封装透明密封剂的不透光密封剂。 透明密封剂具有形成在对应于传感器芯片的传感器区域上方的位置处的透光部分。 透光部分从不透光的密封剂暴露出来。 光可以穿透透光部分，而不使用附加的盖板，从而减少制造步骤和成本。 上述布置避免了由多孔密封剂引起的可靠性差的现有技术问题，以及由仅通过透明密封剂封装的传统芯片的环境光的干扰引起的差信号接收。

    Sensor-type semiconductor package and fabrication
    45.
    发明申请
    Sensor-type semiconductor package and fabrication 审中-公开
    传感器型半导体封装和制造

    公开(公告)号：US20080105941A1

    公开(公告)日：2008-05-08

    申请号：US11982514

    申请日：2007-11-02

    申请人： Tse-Wen Chang ,  Chang-Yueh Chan ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

    发明人： Tse-Wen Chang ,  Chang-Yueh Chan ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

    IPC分类号： H01L31/0203 ,  H01L21/00

    CPC分类号： H01L31/0203 ,  H01L23/3128 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： The invention provides a sensor-type semiconductor package and fabrication method thereof. The fabrication method includes steps of: attaching a sensor chip to a chip carrier; electrically connecting the sensor chip and a chip carrier via a plurality of bonding wires; mounting a light-permeable body to the sensor chip with an adhesive layer as a partition therebetween, wherein the planar size of the light-permeable body is larger than a predefined planar size of the sensor-type semiconductor package to be formed; forming an encapsulant on the chip carrier for encapsulating the sensor chip and the bonding wires with the upper surface of the light-permeable body being exposed from the encapsulant; and cutting through the light-permeable body, the encapsulant and the chip carrier according to the predefined planar size. Accordingly the contacting area between the cut light-permeable body and the cut encapsulant increased and the bonding therebetween is reinforced.

    摘要翻译： 本发明提供一种传感器型半导体封装及其制造方法。 该制造方法包括以下步骤：将传感器芯片附接到芯片载体; 经由多根接合线电连接传感器芯片和芯片载体; 将透光体安装到传感器芯片上，其中粘合剂层作为其间的隔板，其中透光体的平面尺寸大于要形成的传感器型半导体封装的预定平面尺寸; 在所述芯片载体上形成密封剂，用于封装所述传感器芯片，并且所述接合线与所述透光体的上表面暴露于所述密封剂; 并根据预定的平面尺寸切穿透光体，密封剂和芯片载体。 因此，切割的透光体和切割的密封剂之间的接触面积增加，并且增强了它们之间的粘结。

    Semiconductor device and fabrication method thereof
    46.
    发明申请
    Semiconductor device and fabrication method thereof 审中-公开
    半导体器件及其制造方法

    公开(公告)号：US20070164386A1

    公开(公告)日：2007-07-19

    申请号：US11648045

    申请日：2006-12-28

    申请人： Cheng-Yi Chang ,  Chien-Ping Huang ,  Yu-Po Wang ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

    发明人： Cheng-Yi Chang ,  Chien-Ping Huang ,  Yu-Po Wang ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

    IPC分类号： H01L31/0203 ,  H01L21/56

    CPC分类号： H01L27/14687 ,  H01L24/97 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01033 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2224/85 ,  H01L2924/00014

    摘要： A semiconductor device and the fabrication method thereof are provided. The fabrication method includes providing a substrate module plate having a plurality of substrates; attaching at least one sensor chip to each of the substrates of the substrate module plate; electrically connecting each of the sensor chips to each of the substrates through bonding wires; forming an insulating layer between each sensor chip on the substrate module plate, wherein the height of the insulating layers are not greater than the thickness of the sensor chips so as to prevent flash from the insulating layers from contaminating the sensor chips; forming an adhesive lip on the insulating layer or forming a second insulating layer followed by forming the adhesive layer, wherein the adhesive layer or the second insulating layer is higher than the highest loop-height of the bonding wires; adhering a light transmitting cover to each adhesive layer to cover the sensor chip; and cutting the substrate module plate to separate the substrates to form a plurality of semiconductor devices each integrated with at least one sensor chip. As the adhesive layers are not in contact with the bonding wires, the problems of damaging or breaking the bonding wires can be prevented in the process of adhering the light transmitting cover.

    摘要翻译： 提供半导体器件及其制造方法。 该制造方法包括提供具有多个基板的基板模块板; 将至少一个传感器芯片附接到所述基板模块板的每个基板; 通过接合线将每个传感器芯片电连接到每个基板; 在衬底模块板上的每个传感器芯片之间形成绝缘层，其中绝缘层的高度不大于传感器芯片的厚度，以防止来自绝缘层的闪光污染传感器芯片; 在所述绝缘层上形成粘合剂唇缘或形成第二绝缘层，接着形成所述粘合剂层，其中所述粘合剂层或所述第二绝缘层高于所述接合线的最高环高度; 将透光盖粘附到每个粘合剂层以覆盖传感器芯片; 以及切割所述基板模块板以分离所述基板以形成多个半导体器件，每个半导体器件与至少一个传感器芯片集成。 由于粘合层不与接合线接触，所以在粘接透光罩的过程中可以防止损坏或断裂接合线的问题。

    Process applied to semiconductor
    48.
    发明申请
    Process applied to semiconductor 审中-公开
    工艺应用于半导体

    公开(公告)号：US20060137420A1

    公开(公告)日：2006-06-29

    申请号：US11319110

    申请日：2005-12-27

    申请人： Ru- Sheng Liu ,  Han-Lung Tsai ,  Cheng-Hsu Hsiao

    发明人： Ru- Sheng Liu ,  Han-Lung Tsai ,  Cheng-Hsu Hsiao

    IPC分类号： B21C23/00

    CPC分类号： H01L21/6835 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/32145 ,  H01L2924/3511

    摘要： A process applied to grinding, dicing, and/or stacking semiconductors is disclosed. One feature of the process is that after transparent material is stuck on its active surface, a semiconductor is ground from another surface thereof to become thinner, then the semiconductor is diced, by taking advantage of transparency of the transparent material, from its active surface, to obtain at least one smaller semiconductor unit such as die/dice or chip(s). Another feature is that the transparent material remains sticking to the active surface of the die by an adhesion layer until the die is attached to a carrier or another die, and then the transparent material and the adhesion layer are removed by taking advantage of a function of the adhesion layer: receiving a ray to lose adhesion between it and the active surface. Preferably the ray reaches the adhesion layer via the transparent material stuck on the active surface of the die.

    摘要翻译： 公开了一种应用于研磨，切割和/或堆叠半导体的方法。 该方法的一个特征是，在透明材料粘附在其有效表面上之后，从其另一表面研磨半导体以变薄，然后通过利用透明材料的透明度从其活性表面切割半导体， 以获得至少一个较小的半导体单元，例如芯片/芯片或芯片。 另一个特征是透明材料通过粘合层保持粘附到模具的活性表面，直到模具附接到载体或另一个模具，然后通过利用透明材料和粘合层的功能去除透明材料和粘附层 粘合层：接收光线以失去其与活性表面之间的粘附。 优选地，光线通过粘附在模具的有效表面上的透明材料到达粘附层。

    Semiconductor package with heat spreader
    50.
    发明授权
    Semiconductor package with heat spreader 有权
    半导体封装带散热器

    公开(公告)号：US06919630B2

    公开(公告)日：2005-07-19

    申请号：US10437557

    申请日：2003-05-13

    申请人： Cheng-Hsu Hsiao

    发明人： Cheng-Hsu Hsiao

    IPC分类号： H01L21/56 ,  H01L23/10 ,  H01L23/36 ,  H01L23/34

    CPC分类号： H01L23/36 ,  H01L21/563 ,  H01L23/10 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  Y10S257/93 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

    摘要： A semiconductor package with an embedded heat spreader (EHS) is proposed, which can be used for the fabrication of a semiconductor package, such as a FCBGA (Flip-Chip Ball Grid Array) package with a heat spreader, and which is characterized by the provision of a plurality of recessed portions, either in the heat spreader attach area of the substrate, or in the support portion of the heat spreader, or in both, so as to allow the fill-in portions of the adhesive layer that are filled in these recessed portions to form anchor structures to benefit the heat spreader against crosswise shear stress. Moreover, since the provision of these recessed portions allows an increase in the contact area of the adhesive layer with the substrate and the heat spreader, it can help increase the adhesive strength to provide the heat spreader more securely adhered in position on the substrate.

    摘要翻译： 提出了具有嵌入式散热器（EHS）的半导体封装，其可用于制造半导体封装，例如具有散热器的FCBGA（倒装芯片球栅阵列）封装，其特征在于： 在基板的散热器安装区域或散热器的支撑部分中或在两者中设置多个凹部，以便允许填充的粘合剂层的填充部分 这些凹陷部分形成锚结构，以便使散热器免受横向剪切应力的影响。 此外，由于设置这些凹部可以增加粘合剂层与基材和散热器的接触面积，所以可以有助于提高粘合强度，从而使散热器更牢固地粘附在基板上的适当位置。