公开(公告)号：US20140069574A1

公开(公告)日：2014-03-13

申请号：US14077434

申请日：2013-11-12

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： TZYY JANG TSENG ,  CHANG MING LEE ,  WEN FANG LIU ,  CHENG PO YU

IPC: H05K3/12 ,  H05K3/18 ,  H05K3/02

CPC classification number: H05K3/12 ,  C23C18/1605 ,  C23C18/165 ,  C25D5/022 ,  H05K1/0203 ,  H05K1/056 ,  H05K3/02 ,  H05K3/181 ,  H05K3/188 ,  H05K3/3436 ,  H05K2201/0187 ,  Y10T29/302 ,  Y10T29/49155 ,  Y10T156/10

Abstract: A manufacturing method of a circuit board is provided. In the manufacturing method, an electrically insulating layer and at least one electrically insulating material are formed on a plane of a thermally conductive plate, and a metal pattern layer located on the electrically insulating layer is formed. The electrically insulating layer partially covers the plane, and the electrically insulating material covers the plane where is not covered by the electrically insulating layer. The electrically insulating material touches the thermally conductive plate. A thermal conductivity of the electrically insulating material is larger than that of the electrically insulating layer.

Abstract translation: 提供电路板的制造方法。 在制造方法中，在导热板的平面上形成电绝缘层和至少一个电绝缘材料，形成位于电绝缘层上的金属图案层。 电绝缘层部分地覆盖该平面，并且电绝缘材料覆盖未被电绝缘层覆盖的平面。 电绝缘材料接触导热板。 电绝缘材料的导热率大于电绝缘层的热导率。

公开(公告)号：US08657252B2

公开(公告)日：2014-02-25

申请号：US12945085

申请日：2010-11-12

Applicant: Yuichi Furukawa ,  Jun Yaokawa ,  Yasushi Iwata

Inventor： Yuichi Furukawa ,  Jun Yaokawa ,  Yasushi Iwata

IPC: B29C33/56 ,  B28B7/38

CPC classification number: B22C3/00 ,  B05D5/08 ,  B22C9/061 ,  B22D17/2209 ,  C23C8/02 ,  C23C8/20 ,  C23C18/165 ,  C23C18/1689 ,  C23C18/1696 ,  C23C18/1698 ,  C23C18/32 ,  C23C28/00

Abstract: A surface-treated mold that includes a mold, a metal layer that is provided on a surface of the mold and contains at least one metal selected from nickel, chromium, tungsten and brass, and a carbon film that is provided on a surface of the metal layer, wherein the metal layer contains carbon, and the carbon concentration in the metal layer is higher between the boundary with the carbon film and the center of the metal layer than that between the boundary with the mold and the center of the metal layer.

Abstract translation: 一种表面处理的模具，其包括模具，设置在所述模具的表面上并且包含至少一种选自镍，铬，钨和黄铜的金属的金属层和设置在所述模具的表面上的碳膜 金属层，其中金属层含有碳，并且与碳膜的边界和金属层的中心之间的金属层中的碳浓度高于与模具的边界和金属层的中心之间的碳浓度。

公开(公告)号：US08632864B2

公开(公告)日：2014-01-21

申请号：US12545926

申请日：2009-08-24

Applicant: Ling Hao ,  David P. Hartrick ,  Lee A. Chase ,  Alan D. Fanta ,  Daniel W. Irvine ,  Yong Zhang ,  Maoshi Guan

Inventor： Ling Hao ,  David P. Hartrick ,  Lee A. Chase ,  Alan D. Fanta ,  Daniel W. Irvine ,  Yong Zhang ,  Maoshi Guan

IPC: B32B15/00

CPC classification number: C09D5/28 ,  B05D5/067 ,  C08J7/045 ,  C23C18/165 ,  C23C18/1651 ,  C23C18/2006 ,  C23C18/22 ,  C23C18/30 ,  C23C18/54

Abstract: A decorative metal finish for a part with a non-conductive surface where the non-conductive surface is lightly roughened to improve its adherence capabilities. A thin metal layer is electrolessly deposited on the lightly roughened surface to provide a bright durable metal finish on the non-conductive surface. An translucent finish is deposited over the thin metal layer to provide protection for the metal finish.

Abstract translation: 用于具有非导电表面的部件的装饰金属表面，其中非导电表面被粗糙地粗糙化以提高其粘附能力。 薄金属层无电沉积在轻度粗糙的表面上，以在非导电表面上提供光亮耐用的金属表面。 半透明的表面沉积在薄金属层上，为金属表面提供保护。

公开(公告)号：US20140017575A1

公开(公告)日：2014-01-16

申请号：US13885616

申请日：2011-11-16

Applicant: Sven Göthe ,  Björn Atthoff ,  Karl-Gunnar Larsson

Inventor： Sven Göthe ,  Björn Atthoff ,  Karl-Gunnar Larsson

IPC: C23C16/02 ,  H01M8/02 ,  H01L31/04 ,  H05K1/02

CPC classification number: C23C16/0272 ,  B05D1/62 ,  C23C18/1601 ,  C23C18/165 ,  C23C18/1651 ,  C23C18/1803 ,  C23C18/1834 ,  C23C18/1851 ,  C23C18/2006 ,  C23C18/2013 ,  C23C18/2086 ,  H01L31/04 ,  H01M4/8825 ,  H01M4/886 ,  H01M8/02 ,  H05K1/02 ,  H05K3/387 ,  H05K2203/095 ,  H05K2203/1168 ,  Y10T428/12063 ,  Y10T428/12396 ,  Y10T428/12493

Abstract: A method for applying a metal on a substrate comprises: a) applying a coating by treatment in a plasma, comprising a compound selected from alkanes up to 10 carbon atoms, and unsaturated monomers, and b1) producing polymers on the surface of said substrate, said polymers comprising carboxylic groups and adsorbed ions of a second metal, reducing said ions to the second metal, or alternatively b2) producing polymers on the surface, bringing the surface of said substrate in contact with a dispersion of colloidal metal particles of at least one second metal, and c) depositing said first metal on said second metal. Advantages include that materials sensitive to for instance low pH or solvents can be coated. Substrates including glass, SiO2 with very few of no abstractable hydrogen atoms as well as polymer materials containing halogen atoms can be coated with good adhesion.

Abstract translation: 一种在基材上施用金属的方法包括：a）通过在等离子体中处理涂覆涂层，所述等离子体包含选自最多10个碳原子的化合物和不饱和单体，和b1）在所述基材的表面上制备聚合物， 所述聚合物包含羧基和第二金属的吸附离子，将所述离子还原成第二金属，或者b2）在表面上产生聚合物，使所述基材的表面与至少一种的胶态金属颗粒的分散体接触 第二金属，和c）将所述第一金属沉积在所述第二金属上。 优点包括可以涂覆对例如低pH或溶剂敏感的材料。 包括玻璃，极少数无法提取氢原子的SiO 2以及含有卤素原子的聚合物材料的底材可以以良好的粘合力涂覆。

公开(公告)号：US20140001150A1

公开(公告)日：2014-01-02

申请号：US13537361

申请日：2012-06-29

Applicant: Roy J. Lecesse

Inventor： Roy J. Lecesse

IPC: H05K3/00

CPC classification number: H05K3/429 ,  C23C18/165 ,  C23C18/1653 ,  C23C18/38 ,  H05K3/42 ,  H05K3/422 ,  H05K3/423 ,  H05K2201/09645 ,  H05K2203/0207 ,  H05K2203/1476

Abstract: A method and system for constructing a printed circuit board with multifunctional holes. A first conductive material is deposited into a hole in a substrate to form a first plating on an inner surface of the hole. At least one outer portion of the hole is modified to have a larger diameter than the original hole and to remove the first conductive material from that outer portion. A seed material is deposited into the modified hole. An etchant is applied to the hole to non-mechanically remove the first conductive material from the unmodified portion of the hole. Another conductive material is deposited to into the modified hole that adheres to the seed material in the modified outer portion via to form a second plating at the outer portion.

Abstract translation: 一种用于构造具有多功能孔的印刷电路板的方法和系统。 将第一导电材料沉积在基底中的孔中以在孔的内表面上形成第一电镀。 孔的至少一个外部部分被修改为具有比原始孔更大的直径并且从该外部部分移除第一导电材料。 种子材料沉积到修改的孔中。 将蚀刻剂施加到孔以从孔的未修改部分非机械地去除第一导电材料。 另一种导电材料被沉积到修饰的孔中，该修饰的孔粘附在改进的外部部分通孔中的种子材料上，以在外部部分形成第二电镀。

公开(公告)号：US08613807B2

公开(公告)日：2013-12-24

申请号：US12656459

申请日：2010-01-29

Applicant: Toshio Horie ,  Gaku Kitahara ,  Nobuaki Suzuki ,  Fumio Shimizu ,  Takao Kobayashi ,  Ken-ichi Suzuki ,  Shigeki Oshima

Inventor： Toshio Horie ,  Gaku Kitahara ,  Nobuaki Suzuki ,  Fumio Shimizu ,  Takao Kobayashi ,  Ken-ichi Suzuki ,  Shigeki Oshima

IPC: C23C8/00 ,  B32B9/00 ,  H01B1/02

CPC classification number: H01B1/02 ,  C23C18/165 ,  C23C18/1689 ,  C23C18/1696 ,  C23C18/36 ,  C23C30/00

Abstract: A conductive film comprises a phosphide particle coated film formed by attaching raw material particles including phosphide particles comprising a compound of Ti and/or Fe, and P to a surface of a substrate material. This conductive film exhibits good corrosion resistant conductivity, and can be easily formed at low costs because of comprising the phosphide particle coated film. A corrosion-resistant conduction film comprises an iron-containing titanium phosphide layer containing Ti, Fe and P as essential basic elements. A corrosion-resistant conduction material having this corrosion-resistant conduction film on a surface of a substrate exhibits good corrosion resistance or conductivity. This corrosion-resistant conduction material can be obtained, for example, by a process comprising a plating step of forming an Ni plating layer on a surface of a Ti-based material substrate and a nitriding step of applying nitriding treatment to the Ti-based material substrate after the plating step at not more than 880 deg. C.

Abstract translation: 导电膜包括通过将包含Ti和/或Fe化合物的磷化物颗粒和P的原料颗粒附着到基材的表面而形成的磷化物颗粒涂布膜。 该导电膜表现出良好的耐腐蚀性导电性，并且由于包含磷化物粒子涂布膜，可以以低成本容易地形成。 耐腐蚀导电膜包括含有Ti，Fe和P作为必需碱性元素的含铁磷化钛层。 在基板表面具有这种耐腐蚀导电膜的耐腐蚀导电材料表现出良好的耐腐蚀性或导电性。 该耐腐蚀导电材料可以通过例如在Ti基材料基板的表面上形成Ni镀层的镀覆工序和对Ti系材料进行氮化处理的氮化工序 电镀步骤后的基板不大于880度。 C。

公开(公告)号：US08320101B2

公开(公告)日：2012-11-27

申请号：US12817352

申请日：2010-06-17

Applicant: Shunsuke Takeuchi ,  Kenichi Kawasaki ,  Akihiro Motoki ,  Makoto Ogawa

Inventor： Shunsuke Takeuchi ,  Kenichi Kawasaki ,  Akihiro Motoki ,  Makoto Ogawa

IPC: H01G4/228

CPC classification number: H01G4/30 ,  C23C18/165 ,  C23C18/1692 ,  C25D5/10 ,  C25D5/14 ,  C25D5/50 ,  H01G4/012 ,  H01G4/2325 ,  Y10T29/413 ,  Y10T29/435

Abstract: In a method for manufacturing a multilayer electronic component, after a plating layer for forming an external electrode is formed on an end surface of a laminate, conditions for heat-treating the laminate are set such that interdiffusion layers have ends which face internal electrodes and which are spaced from the end surface of the laminate at a distance of about 0.5 μm to about 1.9 μm.

Abstract translation: 在多层电子部件的制造方法中，在层叠体的端面上形成用于形成外部电极的镀覆层之后，设定层叠体的热处理条件，使得相互扩散层具有面向内部电极的端部， 与层压体的端面间隔约0.5μm至约1.9μm的距离。

公开(公告)号：US20120210718A1

公开(公告)日：2012-08-23

申请号：US12929878

申请日：2011-02-22

Applicant: Benjamin Paul Lacy ,  Andres Garcia-Crespo

Inventor： Benjamin Paul Lacy ,  Andres Garcia-Crespo

IPC: F23R3/42 ,  C23C16/00 ,  B32B37/00 ,  F04D29/38 ,  B32B3/10 ,  B32B3/30 ,  B32B15/04 ,  B23K31/02 ,  C25D5/02

CPC classification number: B23K31/02 ,  B23K1/0018 ,  B23K35/007 ,  B23K35/0233 ,  B23K35/3033 ,  B23K2101/001 ,  B23K2101/34 ,  B23K2103/18 ,  B23K2103/26 ,  B23K2103/52 ,  C04B37/026 ,  C04B2237/123 ,  C04B2237/38 ,  C04B2237/40 ,  C04B2237/592 ,  C04B2237/597 ,  C04B2237/72 ,  C04B2237/76 ,  C04B2237/84 ,  C23C18/165 ,  C25D5/54 ,  F01D5/282 ,  F01D5/284 ,  F05D2300/6033 ,  Y10T156/10 ,  Y10T428/12486 ,  Y10T428/24612 ,  Y10T428/24917

Abstract: Method of joining a ceramic matrix composite article to a metallic component by providing the ceramic matrix composite article with a metallic region which bonds to the metallic component.

Abstract translation: 通过向陶瓷基复合制品提供与金属组分结合的金属区域将陶瓷基复合材料制品与金属组分接合的方法。

公开(公告)号：US08247301B2

公开(公告)日：2012-08-21

申请号：US12734590

申请日：2008-11-26

Applicant: Junichi Ito ,  Atsushi Yabe ,  Junnosuke Sekiguchi ,  Toru Imori

Inventor： Junichi Ito ,  Atsushi Yabe ,  Junnosuke Sekiguchi ,  Toru Imori

IPC: H01L21/331 ,  H01L21/8222

CPC classification number: H01L21/2855 ,  C23C18/1637 ,  C23C18/165 ,  C23C18/1653 ,  C23C18/40 ,  H01L21/288 ,  H01L21/76843 ,  H01L21/76874 ,  H01L23/53238 ,  H01L2221/1089 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A substrate having, on a base material, a barrier film for preventing copper diffusion containing one or more metal elements selected from tungsten, molybdenum and niobium, a metal element having a catalytic function in electroless plating such as ruthenium, rhodium, and iridium, and nitrogen contained in the form of a nitride of the aforementioned one or more metal elements selected from tungsten, molybdenum and niobium. The barrier film for preventing copper diffusion is manufactured by sputtering in a nitrogen atmosphere using a target containing one or more metal elements selected from tungsten, molybdenum and niobium and the aforementioned metal element having a catalytic function in electroless plating.

Abstract translation: 在基材上具有防止含有选自钨，钼和铌中的一种或多种金属元素的铜扩散用阻挡膜的基板，在无电解电镀如钌，铑和铱中具有催化功能的金属元素，以及 氮以上述一种或多种选自钨，钼和铌的金属元素的氮化物的形式存在。 通过使用含有选自钨，钼和铌中的一种或多种金属元素的靶和在化学镀中具有催化功能的上述金属元素在氮气气氛中溅射来制造防止铜扩散的阻挡膜。

公开(公告)号：US08198191B2

公开(公告)日：2012-06-12

申请号：US12843422

申请日：2010-07-26

Applicant: Sung Hen Cho ,  Ki Yong Song ,  Sang Eun Park

Inventor： Sung Hen Cho ,  Ki Yong Song ,  Sang Eun Park

IPC: H01L21/4763

CPC classification number: H05K3/048 ,  C23C18/1603 ,  C23C18/165 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1696 ,  C23C18/1893 ,  C23C18/40 ,  C23C18/405 ,  H05K3/181 ,  H05K3/389 ,  Y10T428/12493

Abstract: Disclosed herein is a method of preparing a low resistance metal line, in which a wet plating technique is used instead of a vacuum film forming process in order to simplify the process and decrease the manufacturing cost. In addition, a self-assembled monolayer is formed that facilitates the increased adsorption density and strength of the metal catalyst resulting in the formation of a high-density metal catalyst layer, thereby obtaining a high-quality metal line. Also disclosed herein, are a patterned metal line structure, and a display device using the same.

Abstract translation: 本文公开了一种制备低电阻金属线的方法，其中使用湿电镀技术代替真空成膜工艺，以简化工艺并降低制造成本。 此外，形成自组装单层，其有助于增加金属催化剂的吸附密度和强度，导致形成高密度金属催化剂层，从而获得高质量的金属线。 这里也公开了图案化的金属线结构，以及使用该结构的显示装置。