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    Integrated semiconductor outline package
    41.
    发明授权
    Integrated semiconductor outline package 有权
    集成半导体外形封装

    公开(公告)号：US08169069B2

    公开(公告)日：2012-05-01

    申请号：US12513906

    申请日：2006-12-05

    Applicant: Stanley Job Doraisamy ,  Wae Chet Yong

    Inventor： Stanley Job Doraisamy ,  Wae Chet Yong

    IPC: H01L21/302

    CPC classification number: H05K1/18 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49562 ,  H01L2924/0002 ,  H05K1/0263 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/10659 ,  H01L2924/00

    Abstract: A transistor outline package is provided for a semiconductor integrated device suitable for use in a control module of an automobile for connection between a printed circuit board and a bus bar of such a module. The package includes a package housing, having a first end suitable for mounting to a PCB and which has a width. The package is also formed with a leadframe which includes a heat sink and ground plane blade suitable for connection to a bus bar, a plurality of connector leads suitable for connection to a PCB and at least one source tab lead suitable for connection to a module connector of such a control module. The plurality of connection leads and the source tab lead extend from the first end of the package housing side by side in the direction along and within the width of the first end of the package housing.

    Abstract translation: 为适用于汽车的控制模块的半导体集成器件提供晶体管外形封装，用于连接印刷电路板和这种模块的母线。 封装包括封装壳体，其具有适于安装到PCB并具有宽度的第一端。 该封装还形成有引线框架，该引线框架包括适于连接到母线的散热器和接地平面叶片，适合于连接到PCB的多个连接器引线和适于连接到模块连接器的至少一个源极突起引线 的这种控制模块。 多个连接引线和源极突片从包装壳体的第一端沿着包装壳体的第一端的宽度方向并排地延伸。

    INTEGRATED CIRCUITS HAVING LEAD CONTACTS AND LEADLESS CONTACT PADS CONNECTED TO A SURFACE OF A PRINTED WIRING BOARD, AND METHODS FOR CONNECTING THE SAME
    42.
    发明申请
    INTEGRATED CIRCUITS HAVING LEAD CONTACTS AND LEADLESS CONTACT PADS CONNECTED TO A SURFACE OF A PRINTED WIRING BOARD, AND METHODS FOR CONNECTING THE SAME 审中-公开
    具有连接到印刷电路板表面的引线接触和无铅接触垫的集成电路及其连接方法

    公开(公告)号：US20110157855A1

    公开(公告)日：2011-06-30

    申请号：US13042903

    申请日：2011-03-08

    Applicant: Deepak K. Pai

    Inventor： Deepak K. Pai

    IPC: H05K7/00 ,  B23K31/02 ,  B23K31/12 ,  B23K1/20

    CPC classification number: H05K3/341 ,  H01L23/4822 ,  H01L24/13 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/351 ,  H05K3/3421 ,  H05K3/3436 ,  H05K2201/10659 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2924/00

    Abstract: A method is provided for connecting an integrated circuit to a surface of a printed wiring board. The integrated circuit includes lead contacts and leadless contact pads. A first solder paste is applied to the leadless contact pads of the integrated circuit, and preformed conductive pieces are placed on the first solder paste. The preformed conductive pieces are slugs that have, for example, a cylindrical shape or a rectangular cross-section. The preformed conductive pieces are heated and brought into electrical contact with the leadless contact pads. The lead contacts are formed into gull wings. The bases of the preformed conductive pieces are generally aligned in a plane, and the bases of the gull wings are substantially coplanar with the plane such that they collectively generally define a contact plane. A second solder paste is applied on the surface, and the bases of the gull wings and the preformed conductive pieces are soldered to the second solder paste on the surface so that the integrated circuit is in electrical contact with the surface through both the leadless contact pads and the lead contacts. The preformed conductive pieces comprise a conductive material (e.g., a copper alloy) that has a higher melting point than the first solder paste and the second solder paste such that the preformed conductive pieces do not melt during heating or soldering that is described above.

    Abstract translation: 提供了一种用于将集成电路连接到印刷电路板的表面的方法。 集成电路包括引线触点和无引线接触焊盘。 将第一焊膏施加到集成电路的无引线接触焊盘，并将预成型的导电片放置在第一焊膏上。 预成型的导电片是具有例如圆柱形或矩形横截面的块塞。 预成型的导电片被加热并与无引线接触垫电接触。 铅触点形成鸥翼。 预制导电片的基部通常在平面中对准，并且鸥翼的基部与平面基本共面，使得它们共同地限定接触平面。 在表面上施加第二焊膏，并且将鸥翼和预成型导电片的基底焊接到表面上的第二焊膏，使得集成电路通过两个无引线接触焊盘与表面电接触 和铅触点。 预成型的导电片包括具有比第一焊膏和第二焊膏更高的熔点的导电材料（例如，铜合金），使得预先形成的导电片在上述加热或焊接期间不熔化。

    Apparatus and methods of attaching hybrid vlsi chips to printed wiring boards
    43.
    发明申请
    Apparatus and methods of attaching hybrid vlsi chips to printed wiring boards 审中-公开
    将混合型vlsi芯片连接到印刷电路板的装置和方法

    公开(公告)号：US20110101075A1

    公开(公告)日：2011-05-05

    申请号：US12929224

    申请日：2011-01-10

    Applicant: Deepak K. Pai

    Inventor： Deepak K. Pai

    IPC: B23K31/12 ,  B23K31/02 ,  B23K1/20

    CPC classification number: H05K3/341 ,  H01L23/4822 ,  H01L24/13 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/351 ,  H05K3/3421 ,  H05K3/3436 ,  H05K2201/10659 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2924/00

    Abstract: A method for preparing an integrated circuit for connection to a surface, the integrated circuit including lead contacts and leadless contacts, is provided. The method includes providing the integrated circuit, applying a first solder paste to the leadless contacts, forming solder balls on the applied solder paste, heating the solder balls, thereby removing at least a portion of the first solder paste and bringing the solder balls into electrical contact with the leadless contacts, the base of the solder balls being generally aligned in a plane, and bending the lead contacts into gull wings, with the base of the gull wings being substantially coplanar with the plane. The base of the gull wings and the base of the at least one of the solder balls collectively generally define a contact plane for potential future contact with the surface.

    Abstract translation: 提供了一种用于制备用于连接到表面的集成电路的方法，所述集成电路包括引线触点和无引线触点。 该方法包括提供集成电路，将第一焊膏施加到无引线触点，在所施加的焊膏上形成焊球，加热焊球，从而去除至少一部分第一焊膏并使焊球进入电 与无引线触点接触，焊球的基部通常在平面中对准，并且将引线触点弯曲成鸥翼，鸥翼的基部与平面基本上共面。 鸥翼的基部和至少一个焊球的基部通常限定接触平面，以便将来与表面接触。

    Low Profile Inductors For High Density Circuit Boards
    44.
    发明申请
    Low Profile Inductors For High Density Circuit Boards 有权

    公开(公告)号：US20110018669A1

    公开(公告)日：2011-01-27

    申请号：US12507751

    申请日：2009-07-22

    Applicant: Alexandr Ikriannikov

    Inventor： Alexandr Ikriannikov

    IPC: H01F27/29

    CPC classification number: H01F27/2847 ,  H01F17/06 ,  H01F27/292 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/1003 ,  H05K2201/10659 ,  Y02P70/611

    Abstract: An inductor includes a core formed of a magnetic material and a foil winding wound at least partially around or through at least a portion of the core. A first end of the winding extends away from the core to form an extended output tongue configured and arranged to supplement or serve as a substitute for a printed circuit board foil trace. A second end of the winding forms a solder tab. At least a portion of the extended output tongue and the solder tab are formed at a same height relative to a bottom surface of the core. Another inductor includes a core formed of a magnetic material, a winding wound at least partially around or through at least a portion of the core, and a ground return conductor attached to the core. The core does not form a magnetic path loop around the ground return conductor.

    SEMICONDUCTOR MODULE AND ELECTRONIC CIRCUIT-INTEGRATED MOTOR DEVICE USING SAME
    45.
    发明申请
    SEMICONDUCTOR MODULE AND ELECTRONIC CIRCUIT-INTEGRATED MOTOR DEVICE USING SAME 有权
    使用相同的半导体模块和电子电路集成电动机

    公开(公告)号：US20100327709A1

    公开(公告)日：2010-12-30

    申请号：US12822403

    申请日：2010-06-24

    Applicant: Hideki MINATO ,  Hideki Kabune ,  Atsushi Furumoto ,  Ayako Iwai

    Inventor： Hideki MINATO ,  Hideki Kabune ,  Atsushi Furumoto ,  Ayako Iwai

    IPC: H02K5/22 ,  H02K11/00 ,  H05K1/02

    CPC classification number: H05K1/18 ,  H01L2224/73221 ,  H01L2924/0002 ,  H02K11/33 ,  H02K2211/03 ,  H02M7/003 ,  H05K2201/1003 ,  H05K2201/1053 ,  H05K2201/10659 ,  H01L2924/00

    Abstract: A V1 semiconductor module has a coil terminal, which is directly connectable to a lead wire of a coil. As a result, the number of parts required to connect electronic parts is reduced. Further, since no printed circuit board is required, the coil terminal can be shaped in any size without being limited in correspondence to the thickness of a copper film of the substrate. The coil terminal and control terminals, which are connected to the printed circuit board having a control circuit for controlling current supply to the coil, are provided on different wall surfaces of a resin part. Thus, the coil and the printed circuit board can be readily connected to the coil terminal and the control terminals, respectively, resulting in simplification of the device.

    Abstract translation: V1半导体模块具有可直接连接到线圈的引线的线圈端子。 结果，减少了连接电子部件所需的部件数量。 此外，由于不需要印刷电路板，所以线圈端子可以成形为任何尺寸，而不受对应于基板的铜膜厚度的限制。 连接到具有用于控制向线圈供电的控制电路的印刷电路板的线圈端子和控制端子设置在树脂部件的不同壁面上。 因此，线圈和印刷电路板可以分别容易地连接到线圈端子和控制端子，从而简化了装置。

    Display device
    48.
    发明授权
    Display device 有权
    显示设备

    公开(公告)号：US07352427B2

    公开(公告)日：2008-04-01

    申请号：US11075797

    申请日：2005-03-10

    Applicant: Kazuhiro Ogawa ,  Kazuhiko Yanagawa

    Inventor： Kazuhiro Ogawa ,  Kazuhiko Yanagawa

    IPC: G02F1/13 ,  H05K1/03

    CPC classification number: G02F1/13452 ,  G02F1/134363 ,  H01L2924/0002 ,  H05K1/117 ,  H05K3/244 ,  H05K3/28 ,  H05K3/323 ,  H05K3/3452 ,  H05K3/361 ,  H05K2201/09709 ,  H05K2201/10659 ,  H05K2201/10681 ,  H01L2924/00

    Abstract: A display device which provides reliable connection between a semiconductor device and a printed circuit board includes a display panel, a printed circuit board disposed close to the display panel, and a semiconductor device of a film carrier type which is disposed to lie between the display panel and the printed circuit board, and terminals of the semiconductor device are respectively connected by an anisotropic conductive film to terminals of the printed circuit board that are disposed in opposition to the respective terminals of the semiconductor device.

    Abstract translation: 提供半导体器件和印刷电路板之间的可靠连接的显示装置包括显示面板，靠近显示面板设置的印刷电路板，以及设置在显示面板之间的薄膜载体型半导体器件 并且印刷电路板和半导体器件的端子分别通过各向异性导电膜连接到与半导体器件的各个端子相对设置的印刷电路板的端子。

    Method for repair soldering of multi-pole miniature plug connectors
    49.
    发明授权
    Method for repair soldering of multi-pole miniature plug connectors 有权
    多极微型插头连接器修理焊接方法

    公开(公告)号：US07275315B2

    公开(公告)日：2007-10-02

    申请号：US11389198

    申请日：2006-03-24

    Applicant: Roland Mödinger

    Inventor： Roland Mödinger

    IPC: H05K3/00

    CPC classification number: H05K3/3415 ,  H01R43/0256 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10659 ,  H05K2201/10984 ,  H05K2203/0195 ,  H05K2203/0415 ,  H05K2203/1476 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49149 ,  Y10T29/49732 ,  Y10T29/49742

    Abstract: A method for repair soldering of multi-pole miniature plug connectors on printed circuit boards, having signal contact pins in the SMT design and shroud pins in the THR design. The plug connectors have shrouds whose shroud pins project out on the back of the printed circuit board. Preforms are glued onto the SMD signal contact pins, and the repair plug connectors are set into THR holes of the board with their shroud pins. The signal contact pins are soldered using SMT technology. Subsequently, the shroud pins are soldered from the back of the board. The solder connects with the solder eyes of the solder holes on the back of the board, as well as flows into the ring gap between the metallized inside walls of the solder holes and the shroud pins in the circuit board, and produces a material-lock connection. Finally, the shroud pins that project out are shortened.

    Abstract translation: 一种用于在印刷电路板上修复焊接多极微型插头连接器的方法，其具有SMT设计中的信号触针和THR设计中的护罩引脚。 插头连接器具有护罩，护罩引脚突出在印刷电路板的背面。 预制件粘贴到SMD信号触点引脚上，并将修补插头连接器置于板的THR孔中，并将其导线管插入。 信号触针使用SMT技术进行焊接。 随后，护罩引脚从电路板背面焊接。 焊料与焊盘背面的焊料焊点相连，并流入焊接孔的金属化内壁和电路板的护罩引脚之间的环形间隙，并产生材料锁 连接。 最后，伸出的护罩针脚缩短。

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