公开(公告)号：US07477128B2

公开(公告)日：2009-01-13

申请号：US11233824

申请日：2005-09-22

申请人： James E. Quilici

发明人： James E. Quilici

IPC分类号： H01F5/00

CPC分类号： H01F17/0033 ,  H01F17/062 ,  H01F27/027 ,  H01F41/02 ,  H01F41/0206 ,  H01F41/041 ,  H01F41/042 ,  H01F41/064 ,  H01F2027/2814 ,  H05K1/0284 ,  H05K1/144 ,  H05K1/165 ,  H05K3/0014 ,  H05K3/20 ,  H05K3/4611 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/086 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/0139 ,  H05K2203/0143 ,  H05K2203/0292 ,  Y10T29/4902 ,  Y10T29/49073 ,  Y10T29/49075 ,  Y10T156/10

摘要： Disclosed is an apparatus and method for a magnetic component. The magnetic component includes a substrate having a feature and a first conductive pattern disposed on the feature. The magnetic component also includes a permeability material disposed within the feature. A substrate material is disposed on the substrate to facilitate substantial enclosure of the permeability material between the substrate and the substrate material, where the substrate material has a second conductive pattern. The first conductive pattern and the second conductive pattern cooperate to be capable of facilitating magnetic properties of the permeability material.

摘要翻译： 公开了一种用于磁性部件的装置和方法。 磁性部件包括具有特征的基板和设置在特征上的第一导电图案。 磁性部件还包括设置在特征内的渗透性材料。 衬底材料设置在衬底上，以便于在衬底和衬底材料之间实质上封装渗透性材料，其中衬底材料具有第二导电图案。 第一导电图案和第二导电图案配合以便于促进导磁材料的磁性能。

公开(公告)号：US07463154B2

公开(公告)日：2008-12-09

申请号：US10485863

申请日：2002-04-30

申请人： Francisco Martinez De Velasco Cortina ,  Manfred Rietzler

发明人： Francisco Martinez De Velasco Cortina ,  Manfred Rietzler

IPC分类号： G08B13/14 ,  G06K19/06 ,  H01L23/02 ,  H01Q7/04

CPC分类号： G06K19/0723 ,  G06K19/07 ,  G06K19/07718 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07758 ,  G06K19/0776 ,  G06K19/07771 ,  G06K19/07779 ,  G06K19/07783 ,  G06K2019/0629 ,  H01L2924/0002 ,  H05K1/0269 ,  H05K1/0274 ,  H05K1/0393 ,  H05K3/067 ,  H05K2201/0133 ,  H05K2201/09781 ,  H05K2201/09936 ,  H05K2201/2054 ,  H05K2203/0143 ,  H05K2203/1545 ,  H01L2924/00

摘要： A method for selectively removing metal from a metallized substrate (e.g., a metallized polymer film) and the formation of devices thereby are provided. Th method involves selectively exposing the metallized surface to a demetallizing (i.e., an oxidizing) chemical solution. The metallized layer can be selectively exposed to the demetallizing solution using a flexographic printing process wherein printing rollers are used to transfer the demetallizing solution to the metallized surface. An identification device including, for example, a holographic, retro-reflective, or other metallized material and a radio-frequency transponder are also provided. The radio-frequency transponder includes an RF chip and an antenna in electrical communication with the chip. The identification device including the holographic image allows both electronic identification through the reading or identification data stored in the chip and optical identification via the holographic image.

摘要翻译： 提供了从金属化基板（例如，金属化聚合物膜）选择性地去除金属并由此形成器件的方法。 Th方法包括将金属化表面选择性地暴露于脱金属（即氧化）化学溶液。 金属化层可以使用柔性版印刷方法选择性地暴露于脱金属溶液，其中使用印刷辊将去金属化溶液转移到金属化表面。 还提供了包括例如全息，回射或其它金属化材料和射频转发器的识别装置。 射频转发器包括RF芯片和与芯片电连通的天线。 包括全息图像的识别装置允许通过存储在芯片中的读取或识别数据进行电子识别，并通过全息图像进行光学识别。

公开(公告)号：US20080173390A1

公开(公告)日：2008-07-24

申请号：US12018114

申请日：2008-01-22

申请人： Mukundan Narasimhan ,  Todd Johnson ,  Bulent M. Basol

发明人： Mukundan Narasimhan ,  Todd Johnson ,  Bulent M. Basol

IPC分类号： B32B38/06

CPC分类号： B32B38/10 ,  B32B38/06 ,  B32B2457/12 ,  H01L31/18 ,  H05K3/041 ,  H05K3/244 ,  H05K2201/0326 ,  H05K2203/0108 ,  H05K2203/0143 ,  Y10T156/1041 ,  Y10T156/1054 ,  Y10T156/107

摘要： A method of forming metallic connector patterns for solar cells, whereby an embosser having raised features shaped in the form of a metallic connector pattern is used to attach a portion of a metallic foil to a transparent conductive layer formed on a top transparent surface of a solar cell structure. The raised surfaces of the embosser press the metallic foil portion against the transparent conductive layer. Heat and pressure directed to the metallic foil portion attach the metallic foil portion to the underlying transparent conductive layer, and then the rest of the metallic foil, which is not attached to the transparent conductive layer, is removed.

摘要翻译： 一种用于形成用于太阳能电池的金属连接器图案的方法，由此使用具有以金属连接器图案形式形成的凸起特征的压花器将金属箔的一部分附接到形成在太阳能的顶部透明表面上的透明导电层 细胞结构。 压花机的凸起表面将金属箔部分压靠在透明导电层上。 引导到金属箔部分的热和压力将金属箔部分附着到下面的透明导电层上，然后除去未附着到透明导电层的金属箔的其余部分。

公开(公告)号：US20070215376A1

公开(公告)日：2007-09-20

申请号：US11578912

申请日：2005-04-16

申请人： Thomas Walther

发明人： Thomas Walther

IPC分类号： H05K3/12 ,  H05K1/00

CPC分类号： H05K3/046 ,  H05K3/1275 ,  H05K2203/0143 ,  H05K2203/0522 ,  H05K2203/0528 ,  H05K2203/0534 ,  H05K2203/105 ,  Y10T29/49155

摘要： The invention relates to a method for printing electrical and/or electronic structures, especially electrical conductors and/or electronic circuits onto a printing material, whereby the printing material is transported through a plurality of printing units of a printing machine that are disposed one after the other. A design of the electrical and/or electronic structure to be printed is applied to the printing material in one or more first printing units by means of an adhesive. The printing material, which is partially imprinted with the adhesive is then fed to one or more second printing units in which a conductive material is applied to the areas of the printing material that are imprinted with the adhesive.

摘要翻译： 本发明涉及一种将电气和/或电子结构，特别是电导体和/或电子电路印刷到印刷材料上的方法，由此将印刷材料输送通过印刷机的多个印刷单元 其他。 要印刷的电气和/或电子结构的设计通过粘合剂施加到一个或多个第一印刷单元中的印刷材料上。 部分印刷有粘合剂的印刷材料然后被供给到一个或多个第二印刷单元，其中将导电材料施加到印刷有粘合剂的印刷材料的区域上。

公开(公告)号：US20070144913A1

公开(公告)日：2007-06-28

申请号：US10568629

申请日：2003-08-21

申请人： Kouji Muraoka

发明人： Kouji Muraoka

IPC分类号： C23C28/00

CPC分类号： B41M7/0027 ,  B41M7/0036 ,  C25D5/54 ,  C25D5/56 ,  C25D7/00 ,  C25D7/12 ,  H05K3/12 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2203/0143 ,  H05K2203/025 ,  H05K2203/0278

摘要： A method for creating a print or coating image, characterized by including a first step of printing or coating a surface of a to-be-printed or to-be-coated product with a predetermined print or coating image using a mixture fluid in which predetermined powder has been mixed into printing ink or paint, a second step of pressure-treating and/or polishing at least the printed or coated print or coating image surface in predetermined conditions, and a third step of further plating the pressure-treated and/or polished print or coating image surface, or including a first step of printing or coating a surface of a to-be-printed or to-be-coated product with a predetermined print or coating using printing ink or paint, a second step of spraying the printed or coated surface with predetermined powder before the printed or coated surface is hardened, a third step of further pressure/compression-treating the print or coating image surface, a fourth step of drying and fixing the print or coating image surface, a fifth step of polishing the print or coating image surface in predetermined conditions, and a sixth step of further plating the polished print or coating image surface; and a product with an image created by the method.

摘要翻译： 一种用于产生印刷或涂覆图像的方法，其特征在于包括用预定的印刷或涂布图像打印或涂布待印刷或被涂覆产品的表面的第一步骤，其中使用预定的 粉末已经混合到印刷油墨或涂料中，第二步是在预定条件下至少对印刷或涂布的印刷或涂布图像表面进行压力处理和/或抛光，以及第三步骤，进一步电镀经压力处理和/ 抛光印刷或涂布图像表面，或包括使用印刷油墨或涂料用预定的印刷或涂层印刷或涂布待印刷或待涂覆产品的表面的第一步骤，第二步骤， 在印刷或涂布表面硬化之前的预定粉末的印刷或涂布表面，进一步对印刷或涂布图像表面进行压力/压缩处理的第三步骤，干燥和固定印刷或涂布的第四步骤 老化表面，在预定条件下抛光印刷或涂布图像表面的第五步骤;以及进一步电镀抛光的印刷或涂布图像表面的第六步骤; 以及通过该方法创建的图像的产品。

公开(公告)号：US07205483B2

公开(公告)日：2007-04-17

申请号：US11079371

申请日：2005-03-15

申请人： Yoshihisa Yamashita ,  Hiroki Yabe ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Satoru Tomekawa ,  Toshio Fujii ,  Seiji Karashima

发明人： Yoshihisa Yamashita ,  Hiroki Yabe ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Satoru Tomekawa ,  Toshio Fujii ,  Seiji Karashima

IPC分类号： H05K1/11

CPC分类号： H05K3/4084 ,  G03G15/225 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K1/0393 ,  H05K3/102 ,  H05K3/1266 ,  H05K3/20 ,  H05K3/207 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0376 ,  H05K2203/0143 ,  H05K2203/0195 ,  H05K2203/0517 ,  H05K2203/1189 ,  H05K2203/1572 ,  H01L2924/00

摘要： A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded in the first insulating resin layer, and a rear-sided wiring pattern embedded in the second insulating resin layer. A surface of the front-sided wiring pattern is flush with a surface of the first insulating resin layer, and a surface of the rear-sided wiring pattern is flush with a surface of the second insulating resin layer. A part of at least one of the front-sided wiring pattern and the rear-sided wiring pattern is dented toward a part of the other of the at least one of the front-sided wiring pattern and the rear-sided wiring pattern such that a portion of the front-sided wiring pattern and a portion of the rear-sided wiring pattern are jointed to each other to form a junction.

摘要翻译： 柔性基板包括膜，膜的正面上的第一绝缘树脂层，膜背面的第二绝缘树脂层，嵌入第一绝缘树脂层中的前侧布线图案，以及后部 嵌入在第二绝缘树脂层中的布线图案。 前侧布线图案的表面与第一绝缘树脂层的表面齐平，并且背面布线图案的表面与第二绝缘树脂层的表面齐平。 前侧布线图案和背面布线图案中的至少一个的一部分朝向前侧布线图案和背面布线图案中的至少一个中的另一个的一部分凹陷，使得 前侧布线图案的一部分和背面布线图案的一部分彼此接合以形成结。

公开(公告)号：US20070059917A1

公开(公告)日：2007-03-15

申请号：US11520729

申请日：2006-09-14

申请人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Ki-Hwan Kim ,  Sung-Yong Kim

发明人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Ki-Hwan Kim ,  Sung-Yong Kim

IPC分类号： H01L21/44 ,  H01L21/4763

CPC分类号： H05K3/4664 ,  H05K3/0023 ,  H05K3/1216 ,  H05K3/1258 ,  H05K3/207 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/465 ,  H05K2201/09536 ,  H05K2203/0143 ,  H05K2203/0568

摘要： A manufacturing method for a printed circuit board having a fine pattern is disclosed, comprising: providing a carrier plate; coating the carrier plate with a photosensitive material; forming a first circuit pattern on the photosensitive material; forming a first circuit layer by drying a conductive paste printed into a space between the photosensitive materials where the first circuit pattern is formed; depositing an insulation layer on the first circuit layer; processing via holes penetrating the insulation layer; coating the insulation layer with the photosensitive material and then forming a second circuit pattern in the photosensitive material; forming a second circuit layer and filling the via holes by drying the conductive paste printed into a space between the photosensitive materials, where the second circuit pattern is formed, and the via holes; and removing the carrier plate.

摘要翻译： 公开了一种具有精细图案的印刷电路板的制造方法，包括：提供载板; 用感光材料涂覆载体板; 在感光材料上形成第一电路图案; 通过干燥印刷在形成有第一电路图案的感光材料之间的空间中的导电浆料形成第一电路层; 在第一电路层上沉积绝缘层; 通过贯穿绝缘层的孔加工; 用感光材料涂覆绝缘层，然后在感光材料中形成第二电路图案; 形成第二电路层，并通过干燥印刷在其中形成第二电路图案的感光材料之间的空间中的导电浆料和通孔来填充通孔; 并移除载体板。

公开(公告)号：US20070022602A1

公开(公告)日：2007-02-01

申请号：US11495045

申请日：2006-07-28

申请人： Howard Kingsford ,  William Clune ,  Kristel Ferry

发明人： Howard Kingsford ,  William Clune ,  Kristel Ferry

IPC分类号： H01K3/22

CPC分类号： B29C43/222 ,  A44B18/0049 ,  B29C43/46 ,  B29C2043/461 ,  B29C2043/465 ,  B29L2031/729 ,  H05K1/0284 ,  H05K1/0393 ,  H05K3/0014 ,  H05K3/0058 ,  H05K3/0091 ,  H05K3/107 ,  H05K3/125 ,  H05K3/1258 ,  H05K3/28 ,  H05K2201/0129 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/209 ,  H05K2203/0108 ,  H05K2203/013 ,  H05K2203/0143 ,  H05K2203/1366 ,  H05K2203/1545 ,  Y10T29/49128 ,  Y10T29/49158

摘要： A method of forming a flexible conductive strip includes: molding a continuous, flexible base of an electrically insulating thermoplastic resin, while forming channels in a surface of the base; at least partially filling the formed channels with a flowable, electrically conductive composition; and then stabilizing the flowable composition in the channels to form a pattern of stable, electrically conductive traces within the channels. A method of forming a flexible circuit board having loop-engageable touch fastener elements includes: molding a continuous, flexible base from an electrically insulating thermoplastic resin, while forming a field of stems integrally molded with and extending from a first side of the base; applying a conductive material to the base to form a pattern of electrically conductive traces in accordance with a circuit design; and forming loop-engageable heads on the stems.

摘要翻译： 一种形成柔性导电带的方法包括：在电绝缘热塑性树脂的模制中模制连续的柔性基底，同时在基底表面形成通道; 至少部分地用可流动的导电组合物填充所形成的通道; 然后稳定通道中的可流动组合物，以在通道内形成稳定的导电迹线图案。 一种形成具有可环路接触的紧固件元件的柔性电路板的方法包括：从电绝缘热塑性树脂模制连续的柔性基座，同时形成与基座的第一侧整体模制并从基座的第一侧延伸的杆的场; 将导电材料施加到基底以根据电路设计形成导电迹线图案; 并在茎上形成可圈套的头部。

公开(公告)号：US20070006752A1

公开(公告)日：2007-01-11

申请号：US11481781

申请日：2006-07-07

申请人： Katsuyuki Hunahata

发明人： Katsuyuki Hunahata

IPC分类号： B41F7/02

CPC分类号： B41M1/00 ,  B41M1/10 ,  H05K3/1275 ,  H05K3/245 ,  H05K2203/0108 ,  H05K2203/0143 ,  H05K2203/0528 ,  H05K2203/1476

摘要： A printing method comprising a process of forming an ink pattern on a silicone rubber blanket having a plate function, or a process of forming an ink pattern from a uniform ink on a silicone rubber blanket having no plate function, a process of transferring the pattern to a substrate, and a process of forming a uniform ink on a silicone rubber blanket having no plate function, pressing the uniform ink against on the ink pattern formed on the substrate, and laminating a uniform ink on a portion thus pressed, only on the ink pattern.

摘要翻译： 一种印刷方法，包括在具有平板功能的硅橡胶橡皮布上形成油墨图案的过程，或者在不具有平板功能的硅橡胶橡胶上由均匀油墨形成油墨图案的过程，将图案转印到 基板和在不具有板功能的硅橡胶橡皮布上形成均匀油墨的方法，将均匀的油墨压在形成在基板上的油墨图案上，并将均匀的油墨层压在如此压制的部分上，仅在油墨上 模式。

公开(公告)号：US20060283539A1

公开(公告)日：2006-12-21

申请号：US11471223

申请日：2006-06-20

申请人： W. Slafer

发明人： W. Slafer

IPC分类号： B44C1/165 ,  B44C1/17 ,  D06N7/00 ,  B65C9/18

CPC分类号： B05D1/28 ,  B05D1/286 ,  B05D1/32 ,  B05D1/322 ,  B05D1/40 ,  B05D3/0263 ,  B05D3/067 ,  B05D3/068 ,  B05D3/141 ,  B05D2252/02 ,  B29C59/046 ,  B29C2035/0827 ,  C23C18/1603 ,  C25D5/022 ,  H01L27/1292 ,  H05K1/0393 ,  H05K3/0079 ,  H05K3/061 ,  H05K3/108 ,  H05K3/143 ,  H05K2203/0113 ,  H05K2203/0143 ,  H05K2203/0264 ,  H05K2203/1545 ,  Y10T156/1023 ,  Y10T156/1039

摘要： Systems and methods are disclosed by which patterns of various materials can be formed on flexible substrates by a continuous roll-to-roll manufacturing process. The patterns may include metallic, transparent conductive, or non-metallic elements with lateral dimensions including in the range from below 100 nanometers to millimeters and with thickness dimensions including the range from tens of Angstroms to greater than 10,000 Angstroms. The substrate may be any material capable of sufficient flexibility for compatibility with roll-based processing equipment, including polymeric films, metallic foils, and thin glass, with polymeric films representing a particularly broad field of application. Methods may include the continuous roll-to-roll formation of a temporary polymeric structure with selected areas open to the underlying substrate, the continuous addition or subtraction of constituent materials, and the continuous removal, where necessary, of the polymeric structure and any excess material.