公开(公告)号：US09748611B2

公开(公告)日：2017-08-29

申请号：US14311489

申请日：2014-06-23

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Jochen Dangelmaier ,  Manfred Fries ,  Juergen Hoegerl ,  Georg Meyer-Berg ,  Thomas Mueller ,  Guenther Ruhl ,  Horst Theuss ,  Mathias Vaupel

IPC: H01M10/48 ,  G01R31/36 ,  H01M6/50

CPC classification number: H01M10/48 ,  G01R31/3689 ,  H01M6/505 ,  H01M10/488

Abstract: An apparatus for determining a state of a rechargeable battery or of a battery has a sensor device and an evaluation device. The sensor device brings about an interaction between an optical signal and a part of the rechargeable battery or of the battery, which part indicates optically acquirable information about a state of the rechargeable battery or of the battery, and detects an optical signal caused by the interaction. The sensor device furthermore provides a detection signal having information about the detected optical signal. The evaluation device determines information about a state of the rechargeable battery or of the battery on the basis of the information of the detection signal. Furthermore, the evaluation device provides a state signal having the information about the determined state.

公开(公告)号：US09678170B2

公开(公告)日：2017-06-13

申请号：US15056284

申请日：2016-02-29

Applicant: Infineon Technologies AG

Inventor： Tobias Werth ,  Klaus Elian ,  James Sterling

IPC: G01R33/02 ,  G01R33/00 ,  B82Y25/00 ,  G01R33/07 ,  G01R33/09 ,  H01L43/08 ,  G01D5/12 ,  G01R3/00 ,  G01D5/16 ,  G01B7/30

CPC classification number: G01R33/0023 ,  B82Y25/00 ,  G01D5/12 ,  G01D5/16 ,  G01R3/00 ,  G01R33/0052 ,  G01R33/072 ,  G01R33/09 ,  G01R33/091 ,  G01R33/093 ,  G01R33/098 ,  G11B2005/0008 ,  H01L43/08 ,  Y10T29/49002

Abstract: Embodiments related to the generation of magnetic bias fields for magnetic sensing are described and depicted. In one embodiment, a sensor includes at least one magnetosensitive element, and a magnetic body with an opening, the magnetic body comprising magnetic material magnetized mainly in a vertical direction, the magnetic body having inclined surface sections shaped by the opening, wherein the sensor is arranged atop the opening.

公开(公告)号：US20170108583A1

公开(公告)日：2017-04-20

申请号：US15390060

申请日：2016-12-23

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Horst Theuss

IPC: G01S7/521 ,  H01L41/053 ,  H01L41/09

Abstract: Embodiments relate to integrated sonic sensors having a transmitter, a receiver and driver electronics integrated in a single, functional package. In one embodiment, a piezoelectric signal transmitter, a silicon microphone receiver and a controller/amplifier chip are concomitantly integrated in a semiconductor housing. The semiconductor housing, in embodiments, is functional in that at least a portion of the housing can comprise the piezoelectric element of the transmitter, with an inlet aperture opposite the silicon microphone receiver.

公开(公告)号：US20170101308A1

公开(公告)日：2017-04-13

申请号：US15388557

申请日：2016-12-22

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Horst Theuss

IPC: B81B7/00 ,  B81C1/00

CPC classification number: H01L21/563 ,  B81B7/0038 ,  B81B7/0058 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C1/00285 ,  B81C2203/0118 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A packaged includes a flip-chip assembly. The flip-chip assembly includes a first semiconductor substrate having at least one integrated semiconductor device, and a second substrate connected to the first substrate. A main surface of the first semiconductor substrate faces and is spaced apart from the second substrate. The packaged semiconductor device further includes a parylene coating covering outer surfaces of the first semiconductor substrate and the second substrate. A first section of the main surface is exposed from the parylene coating.

公开(公告)号：US09561953B1

公开(公告)日：2017-02-07

申请号：US14833871

申请日：2015-08-24

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Horst Theuss

IPC: H01L21/00 ,  B81C1/00 ,  H01L21/56 ,  B81B7/00

CPC classification number: H01L21/563 ,  B81B7/0038 ,  B81B7/0058 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C1/00285 ,  B81C2203/0118 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A first semiconductor substrate having at least one integrated semiconductor device is provided. A lift-off layer is formed on a main surface of the first semiconductor substrate. The lift-off layer is patterned so as to form openings in the lift-off layer that are arranged on either side of a first portion of the lift-off layer. The first substrate is connected together with a second substrate by an interconnect structure to form an assembly with the main surface of the first semiconductor substrate being exposed. Exposed surfaces of the assembly are coated with a parylene coating, with a first portion of the parylene coating being supported by the first portion of the lift-off layer. The first portion of the parylene coating is selectively removed using a lift-off technique that removes the first portion of the lift-off layer. The lift-off technique is performed after connecting the first substrate and second substrates together.

Abstract translation: 提供具有至少一个集成半导体器件的第一半导体衬底。 在第一半导体衬底的主表面上形成剥离层。 剥离层被图案化以在剥离层中形成布置在剥离层的第一部分的任一侧上的开口。 第一衬底通过互连结构与第二衬底连接在一起，以形成暴露第一半导体衬底的主表面的组件。 组件的暴露表面涂覆有聚对二甲苯涂层，聚对二甲苯涂层的第一部分由剥离层的第一部分支撑。 使用去除剥离层的第一部分的剥离技术选择性地除去聚对二甲苯涂层的第一部分。 在将第一基板和第二基板连接在一起之后进行剥离技术。

公开(公告)号：US09557417B2

公开(公告)日：2017-01-31

申请号：US14969848

申请日：2015-12-15

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Horst Theuss

IPC: G01S15/10 ,  G01S15/08 ,  G01S7/521 ,  B81B7/00 ,  G10K11/00 ,  H01L41/09

CPC classification number: G01S7/521 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2207/012 ,  G01S15/08 ,  G01S15/10 ,  G10K11/004 ,  H01L41/053 ,  H01L41/0973 ,  H04R2201/003

Abstract: Embodiments relate to integrated sonic sensors having a transmitter, a receiver and driver electronics integrated in a single, functional package. In one embodiment, a piezoelectric signal transmitter, a silicon microphone receiver and a controller/amplifier chip are concomitantly integrated in a semiconductor housing. The semiconductor housing, in embodiments, is functional in that at least a portion of the housing can comprise the piezoelectric element of the transmitter, with an inlet aperture opposite the silicon microphone receiver.

Abstract translation: 实施例涉及具有集成在单个功能封装中的发射器，接收器和驱动器电子器件的集成声波传感器。 在一个实施例中，压电信号发射器，硅麦克风接收器和控制器/放大器芯片同时集成在半导体外壳中。 在实施例中，半导体外壳的功能在于，壳体的至少一部分可以包括发射器的压电元件，具有与硅麦克风接收器相对的入口孔。

公开(公告)号：US09432759B2

公开(公告)日：2016-08-30

申请号：US14065067

申请日：2013-10-28

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Horst Theuss ,  Thomas Mueller

IPC: H04R1/08 ,  B81B7/00 ,  H04R19/00

CPC classification number: H04R1/083 ,  B81B7/0061 ,  B81B2201/0257 ,  H01L2224/95 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15 ,  H01L2924/181 ,  H01L2924/19106 ,  H04R1/04 ,  H04R1/406 ,  H04R19/005 ,  H04R2201/003 ,  H04R2410/05 ,  H04R2499/11

Abstract: A surface mountable microphone package comprises a first microphone and a second microphone. Furthermore, the surface mountable microphone package comprises a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.

Abstract translation: 表面可安装麦克风包包括第一麦克风和第二麦克风。 此外，表面可安装麦克风封装包括用于第一麦克风的第一开口和用于第二麦克风的第二开口。 第一开口和第二开口布置在可表面安装的麦克风封装的相对侧上。

公开(公告)号：US20160018476A1

公开(公告)日：2016-01-21

申请号：US14336305

申请日：2014-07-21

Applicant: Infineon Technologies AG

Inventor： Choo Tian Ooi ,  Chew Theng Tai ,  Klaus Elian ,  Mohd Hirzarul Hafiz Mohd Tahir

IPC: G01R33/00

CPC classification number: G01R33/0047 ,  G01R33/0052 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A molded sensor package includes a leadframe having a sensor die attached to the leadframe, a magnet aligned with the sensor die and a single molding compound encasing the sensor die and attaching the magnet to the leadframe. A method of manufacturing the molded sensor package includes loading the magnet and the leadframe into a molding tool so that the magnet is aligned with the sensor die in the molding tool, molding the magnet and the sensor die with the same molding compound while loaded in the molding tool and curing the molding compound so that the magnet is attached to the leadframe by the same molding compound that encases the sensor die.

Abstract translation: 模制传感器封装包括具有附接到引线框的传感器芯片的引线框架，与传感器管芯对准的磁体和封装传感器管芯的单个模制化合物并将磁体附接到引线框架。 制造模制的传感器封装的方法包括将磁体和引线框架加载到模制工具中，使得磁体与模制工具中的传感器模具对准，并将模具与模具组合在一起，同时装载在模具中 模制工具并固化模塑料，使得磁体通过封装传感器模具的相同模塑料附接到引线框架上。

公开(公告)号：US20150287788A1

公开(公告)日：2015-10-08

申请号：US14745428

申请日：2015-06-20

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Guenther Ruhl ,  Horst Theuss ,  Irmgard Escher-Poeppel

IPC: H01L29/16 ,  H01L23/00 ,  H01L23/495 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L29/1606 ,  G01N27/127 ,  G01N33/0059 ,  H01L21/561 ,  H01L21/568 ,  H01L23/28 ,  H01L23/293 ,  H01L23/3135 ,  H01L23/315 ,  H01L23/49562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/48 ,  H01L24/49 ,  H01L24/94 ,  H01L24/96 ,  H01L2224/02379 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24011 ,  H01L2224/24105 ,  H01L2224/24226 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/11 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A graphene layer is generated on a substrate. A plastic material is deposited on the graphene layer to at least partially cover the graphene layer. The substrate is separated into at least two substrate pieces.

Abstract translation: 在基板上产生石​​墨烯层。 在石墨烯层上沉积塑料材料以至少部分地覆盖石墨烯层。 将基板分成至少两个基片。

公开(公告)号：US09153706B2

公开(公告)日：2015-10-06

申请号：US13900949

申请日：2013-05-23

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Helmut Wietschorke

IPC: H01L21/70 ,  H01L21/56 ,  H01L29/84 ,  H01L23/00

CPC classification number: H01L29/84 ,  G01L5/0004 ,  G01L19/147 ,  H01L23/04 ,  H01L23/24 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L27/14618 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/13099 ,  H01L2924/00

Abstract: Techniques for covering open-cavity integrated-circuit packages in a batch process are disclosed. In an example method, a plurality of open-cavity packages are molded on a single batch leadframe or substrate, each open-cavity package comprising a floor and a plurality of walls arranged around the floor to form a cavity, each of said the walls having a bottom end adjoining said floor and having a top side opposite the bottom end. At least one semiconductor device is attached to the floor and within the cavity of each of the open-cavity packages, and a single flexible membrane is affixed to the top sides of the walls of the plurality of open-cavity packages, so as to substantially cover all of the cavities. The flexible membrane is then severed, between the packages.

Abstract translation: 公开了一种用于在间歇过程中覆盖开放式集成电路封装的技术。 在一个示例性方法中，多个开放式空腔包装被模制在单个批量引线框架或基板上，每个开放式空腔封装包括地板和布置在地板周围的多个壁，以形成空腔，每个所述壁具有 底端邻接所述底板并且具有与底端相对的顶侧。 至少一个半导体器件附接到每个开口腔封装的地板和空腔内，并且单个柔性膜固定到多个开放式腔封装的壁的顶侧，从而基本上 覆盖所有的空腔。 然后在包装之间切断柔性膜。