公开(公告)号：US20060289607A1

公开(公告)日：2006-12-28

申请号：US11168182

申请日：2005-06-28

Applicant: Stephen Buchwalter ,  David Danovitch ,  Frank Egitto ,  Peter Gruber ,  Eric Perfecto ,  Da-Yuan Shih

Inventor： Stephen Buchwalter ,  David Danovitch ,  Frank Egitto ,  Peter Gruber ,  Eric Perfecto ,  Da-Yuan Shih

IPC: B23K35/12

CPC classification number: B23K35/3613

Abstract: A method for constructing a composite solder transfer moldplate for flip chip wafer bumping of a substrate, comprising the steps of coating at least one polymer layer onto a first side of a transparent plate, the plate having a thermal expansion coefficient similar to that of the substrate; and forming a multiplicity of cavities in a polymer layer on one side of the plate, each cavity being for receiving solder. A moldplate made by the method. The structure has required behavior through temperature excursions between room temperature and various solder molten temperatures.

Abstract translation: 一种用于构造用于衬底的倒装芯片晶片凸起的复合焊料传递模板的方法，包括以下步骤：将至少一个聚合物层涂覆到透明板的第一侧上，该板具有与衬底的热膨胀系数相似的热膨胀系数 ; 并且在该板的一侧上的聚合物层中形成多个空腔，每个空腔用于接收焊料。 通过该方法制成的模板。 该结构通过室温和各种焊料熔融温度之间的温度偏移需要行为。

公开(公告)号：US20060118604A1

公开(公告)日：2006-06-08

申请号：US11005557

申请日：2004-12-05

Applicant: Stephen Buchwalter ,  Claudius Feger ,  Peter Gruber ,  Sung Kang ,  Paul Lauro ,  Da-Yuan Shih

Inventor： Stephen Buchwalter ,  Claudius Feger ,  Peter Gruber ,  Sung Kang ,  Paul Lauro ,  Da-Yuan Shih

IPC: B23K35/12

CPC classification number: H05K3/3436 ,  B23K35/26 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13176 ,  H01L2224/13181 ,  H01L2224/13184 ,  H01L2224/1357 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3426 ,  H05K3/3468 ,  H05K2201/10287 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/0415 ,  H05K2203/128 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: Improved interconnects are produced by injection molded solder which fills mold arrays with molten solder so that columns that have much greater height to width aspect ratios greater than one are formed, rather than conventional flip chip bumps. The columns may have filler particles or reinforcing conductors therein. In the interconnect structures produced, the cost and time of a subsequent underfill step is reduced or avoided. The problem of incompatibility with optical interconnects between chips because underfills require high loading of silica fillers which scatter light, is solved, thus allowing flip chips to incorporate optical interconnects.

公开(公告)号：US20060035454A1

公开(公告)日：2006-02-16

申请号：US11048578

申请日：2005-02-01

Applicant: Luc Belanger ,  Peter Gruber ,  Valerie Oberson ,  Christopher Tessler

Inventor： Luc Belanger ,  Peter Gruber ,  Valerie Oberson ,  Christopher Tessler

IPC: B23K35/12 ,  H01L21/44

CPC classification number: H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K3/3468 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K2203/087 ,  H05K2203/1157 ,  H05K2203/128 ,  H01L2924/0105 ,  H01L2224/11 ,  H01L2224/05099

Abstract: Disclosed is a new process that permits the transfer and reflow of solder features produced by Injection Molded Solder (IMS) from a mold plate to a solder receiving substrate without the use of flux. Several embodiments produce solder transfer and reflow separately or together and use either formic acid vapor or partial concentration of hydrogen, both in nitrogen, as the oxide reducing atmosphere. A final embodiment produces fluxless transfer and reflow in only nitrogen through the use of ultrasonic vibration between the solder filled mold plate and solder receiving substrate.

Abstract translation: 公开了一种允许从注射成型焊料（IMS）产生的焊料特征从模板向焊料接收衬底的转移和回流而不使用焊剂的新方法。 几种实施方式分别产生焊料转移和回流，或者在一起并且在氮气中使用甲酸蒸气或部分浓度的氢作为氧化物还原气氛。 最终实施例通过在焊料填充的模具板和焊料接收衬底之间使用超声波振动，仅在氮气中产生无磁通转移和回流。

公开(公告)号：US20050263571A1

公开(公告)日：2005-12-01

申请号：US10857988

申请日：2004-05-30

Applicant: Luc Belanger ,  Guy Brouillette ,  Stephen Buchwalter ,  Peter Gruber ,  Hideo Kimura ,  Jean-Luc Landreville ,  Frederic Manurer ,  Marc Montminy ,  Valerie Oberson ,  Da-Yuan Shih ,  Stephane St-Onge ,  Michel Turgeon ,  Takeshi Yamada

Inventor： Luc Belanger ,  Guy Brouillette ,  Stephen Buchwalter ,  Peter Gruber ,  Hideo Kimura ,  Jean-Luc Landreville ,  Frederic Manurer ,  Marc Montminy ,  Valerie Oberson ,  Da-Yuan Shih ,  Stephane St-Onge ,  Michel Turgeon ,  Takeshi Yamada

IPC: B23K3/06 ,  B23K31/02 ,  H05K3/34

CPC classification number: B23K3/0623 ,  H05K3/3457 ,  H05K2203/0113 ,  H05K2203/0126 ,  H05K2203/0338 ,  H05K2203/1121

Abstract: A method and apparatus for forming solder bumps by molten solder deposition into cavity arrays in a substrate immediately followed by solidification of molten solder such that precise replication of cavity volumes is consistently achieved in formed solder bump arrays. Various solder filling problems, such as those caused by surface tension and oxidation effects, are overcome by a combination of narrow molten Solder dispense slots and solidification of dispensed molten solder.

Abstract translation: 一种用于通过熔融焊料沉积形成焊料凸块的方法和装置，紧接在熔融焊料的固化之后，立即在形成的焊料凸块阵列中实现空腔体积的精确复制。 各种焊料填充问题，例如由表面张力和氧化作用引起的焊料填充问题，都是通过组合窄熔融焊料分配槽和分散的熔融焊料的固化来克服的。

公开(公告)号：US06709678B2

公开(公告)日：2004-03-23

申请号：US09242167

申请日：1999-02-10

Applicant: Peter Gruber

Inventor： Peter Gruber

IPC: A61K928

CPC classification number: A61K9/0095 ,  A61K9/0056 ,  A61K9/5073

Abstract: An oral composition which is adapted to be dispersed in an aqueous carrier substantially immediately prior to administration comprises a multiplicity of particles comprising an active substance, the particles being combined with one or more gelling or swelling agents capable of forming a viscous medium around the particles in an aqueous carrier as well as being provided with a masking surface layer when dispersed in the aqueous carrier. This serves to mask uneven surfaces on the particles and prevent them from adhering to oral mucosa when the composition is ingested and thus makes it easier to administer large dosages of an active substance. The masking surface layer is preferably provided by an increased viscosity of the viscous medium in the immediate vicinity of the particles relative to the viscosity of the surrounding aqueous carrier. A ready-to-use composition is prepared by mixing the composition with an aqueous carrier substantially immediately prior to administration of the composition.

Abstract translation: 适于在施用前基本上立即分散在含水载体中的口服组合物包含多个包含活性物质的颗粒，所述颗粒与一种或多种能够在颗粒周围形成粘性介质的胶凝剂或溶胀剂组合 水性载体，并且当分散在水性载体中时具有掩蔽表面层。 这用于掩盖颗粒上的不均匀表面，并且当组合物摄取时防止它们粘附到口腔粘膜上，因此使得更容易施用大剂量的活性物质。 掩蔽表面层优选通过粘附介质在颗粒附近相对于周围水性载体粘度的粘度增加而提供。 通过在施用组合物之前立即将组合物与水性载体混合来制备即用型组合物。

公开(公告)号：US5939994A

公开(公告)日：1999-08-17

申请号：US744596

申请日：1996-11-06

Applicant: Otto Meier ,  Peter Gruber ,  Bernhard Durrer

Inventor： Otto Meier ,  Peter Gruber ,  Bernhard Durrer

IPC: G08B17/113 ,  G08B23/00

CPC classification number: G08B17/113

Abstract: A surveillance device, e.g. a fire alarm or an intrusion detector, includes a mount having a connector block, and an insert having a sensor assembly, a printed circuit board with evaluation electronics, and an electrical contact to the connector block. The printed circuit board is a plug-in card with a contact strip. For insertion, with the mount disposed at a horizontal surface, for example, the insert is first moved vertically and then displaced horizontally. In the horizontal displacement, an electrical connection is established between the contact strip and the connector block.

Abstract translation: 监视装置，例如 火灾警报器或入侵检测器包括具有连接器块的安装件和具有传感器组件的插入件，具有评估电路的印刷电路板和与连接器块的电接触。 印刷电路板是带有接触片的插卡。 为了插入，例如，当安装件设置在水平表面时，插入件首先垂直移动，然后水平位移。 在水平位移中，在接触片和连接器块之间建立电连接。

公开(公告)号：US5249150A

公开(公告)日：1993-09-28

申请号：US693531

申请日：1991-04-30

Applicant: Peter Gruber ,  Jurg Todtli

Inventor： Peter Gruber ,  Jurg Todtli

IPC: G01R21/00 ,  G01R19/00 ,  G01R19/25

CPC classification number: G01R19/25 ,  G01R19/0007 ,  G01R19/2506

Abstract: A circuit and method for iteratively estimating Fourier coefficients of one or more Fourier components of a measuring signal utilizes a filter to determine the Fourier coefficients for sampling time k-1. The coefficients are utilized to obtain an estimate of the measuring signal at sampling time k. A subtractor circuit subtracts an actual sample of the measuring signal at sampling time k from the estimate of the measuring signal at sampling time k to obtain a difference signal. The difference signal is inputted back into the filter to determine an estimate of the Fourier coefficients at sampling time k.

Abstract translation: 用于迭代地估计测量信号的一个或多个傅立叶分量的傅立叶系数的电路和方法利用滤波器​​来确定采样时间k-1的傅里叶系数。 利用系数来获取采样时间k的测量信号的估计。 减法器电路在采样时间k从测量信号的估计中抽取时间k处的测量信号的实际样本，以获得差分信号。 差分信号被输入到滤波器中以确定采样时间k处的傅里叶系数的估计。

公开(公告)号：US4755385A

公开(公告)日：1988-07-05

申请号：US882999

申请日：1986-07-08

Applicant: Alain Etienne ,  Peter Gruber ,  Ulrich Busch

Inventor： Alain Etienne ,  Peter Gruber ,  Ulrich Busch

IPC: A61K9/30 ,  A61K9/16 ,  A61K9/20 ,  A61K9/22 ,  A61K9/28 ,  A61K9/50 ,  A61K31/70 ,  A61K31/7042 ,  A61K31/7048 ,  A61K47/02 ,  A61P31/04 ,  C07H17/08 ,  A61K9/26

CPC classification number: A61K31/70 ,  A61K9/1611 ,  A61K9/1617 ,  A61K9/2009 ,  A61K9/2846 ,  A61K9/2866 ,  A61K9/5026 ,  A61K9/5042

Abstract: There is described a solid pharmaceutical preparation for oral administration which produces high and long-lasting blood and tissue levels, containing 9-deoxo-11-deoxy-9,11-[imino[2-(2-methoxyethoxy)-ethylidene]oxy]-(9S)-erythromycin as active substance, in which the active substance must be intimately mixed with a basic excipient in a ratio of 1 mol of active substance to at least 2 gram-equivalents of basic excipient, and the preparations are coated with a gastric juice-resistant lacquer which is soluble in a pH range of between 5.5 and 6.8, and processes for preparing them. The solid pharmaceutical preparations include tablets, pellets or granules and a syrup can be produced from the latter.

Abstract translation: 描述了用于口服给药的固体药物制剂，其产生含有9-脱氧-11-脱氧-9,11- [亚氨基[2-（2-甲氧基乙氧基） - 亚乙基]氧基]亚胺的高且持久的血液和组织水平， - （9S） - 红霉素作为活性物质，其中活性物质必须与碱性赋形剂以1mol活性物质与至少2g当量碱性赋形剂的比例充分混合，并且制备物用 可溶于5.5至6.8的pH范围的耐胃酸漆及其制备方法。 固体药物制剂包括片剂，丸剂或颗粒剂，并且可以从后者制备糖浆。

公开(公告)号：US4709152A

公开(公告)日：1987-11-24

申请号：US818491

申请日：1986-01-13

Applicant: Kurt Muller ,  Peter Gruber ,  Alfred Wuthrich

Inventor： Kurt Muller ,  Peter Gruber ,  Alfred Wuthrich

IPC: G01J1/02 ,  G01V8/14 ,  G08B13/18 ,  G08B13/193 ,  G01J5/08

CPC classification number: G08B13/193 ,  Y10S250/01

Abstract: An infrared intrusion detector having a predetermined number of rows of radiation reception zones comprises a primary reflector and a secondary reflector for each row of radiation reception zones. The primary reflectors and their associated secondary reflectors form a folded radiation path. The folded radiation path allows for compact construction and simple manufacturing of the infrared intrusion detector. One reflector of each radiation reception zone forms together with the infrared sensor a compact structural unit. The other reflectors of each radiation reception zone are combined to form a further structural unit which is arranged in a predetermined spaced relationship to the first compact structural unit. In order to achieve uniform detection sensitivity in radiation reception zones having different angles of inclination to the horizontal plane, a larger focal length is chosen for radiation reception zones with smaller angles of inclination and longer range. Likewise, to achieve uniform detection sensitivity even with oblique infrared radiation impingement, the surface area of the primary reflectors increases within each horizontal row from the middle to the sides.

Abstract translation: 具有预定数量的辐射接收区行的红外入侵检测器包括用于每排辐射接收区的主反射器和次反射器。 主反射器及其相关的次级反射器形成折叠的辐射路径。 折叠的辐射路径允许紧凑的结构和简单的红外入侵检测器的制造。 每个辐射接收区的一个反射器与红外传感器一起形成紧凑的结构单元。 每个辐射接收区的其他反射器被组合以形成另外的结构单元，该结构单元以与第一紧凑结构单元预定间隔的关系布置。 为了在具有与水平面不同的倾斜角的辐射接收区域中实现均匀的检测灵敏度，对于具有较小倾角和较大范围的辐射接收区域选择较大的焦距。 同样地，为了即使在倾斜的红外辐射冲击下也能实现均匀的检测灵敏度，主反射器的表面积从中间到侧面在每个水平排中增加。

公开(公告)号：USRE31764E

公开(公告)日：1984-12-11

申请号：US433848

申请日：1982-10-12

Applicant: Gunther Voss ,  Peter Gruber

Inventor： Gunther Voss ,  Peter Gruber

IPC: A61K9/16 ,  A61J3/00 ,  A61J3/10 ,  A61K9/20 ,  A61K9/50 ,  B41J3/407

CPC classification number: A61K9/2095 ,  A61J3/00 ,  B41J3/4073 ,  A61J2205/20

Abstract: A method for the preparation of pharmaceuticals which comprises using a piezoelectric dosing system to dot liquid, dissolved or suspended active substance onto a pharmaceutical carrier.