Dispersion-compensated optical fiber amplifier
    54.
    发明授权
    Dispersion-compensated optical fiber amplifier 有权
    色散补偿光纤放大器

    公开(公告)号:US06785043B2

    公开(公告)日:2004-08-31

    申请号:US10236158

    申请日:2002-09-06

    Abstract: Disclosed is a dispersion-compensated optical-fiber amplifier including a circulator for outputting an optical signal received at a first terminal to a second terminal, while outputting an optical signal received at the second terminal to a third terminal; a first amplifier for amplifying the optical signal from the second terminal and an optical signal reapplied thereto; a dispersion-compensating fiber for compensating for a dispersion occurring in the optical signal received from the first amplifier and an optical signal reapplied thereto; a second amplifier for amplifying the optical signal from the dispersion-compensating fiber and an optical signal reapplied thereto; a splitter installed on the dispersion-compensating fiber and adapted to output to the dispersion-compensating fiber, an optical signal applied thereto and an optical signal reapplied thereto, while outputting a pumping light applied to one end thereof and adapted to pump both the first and second amplifiers to the other end thereof without allowing the pumping light to pass through the dispersion-compensating fiber; and, a reflector for reflecting back an optical signal from the second amplifier, so that the reflected optical signal is reapplied to the second amplifier, the splitter, the first amplifier, and the circulator, in this order.

    Abstract translation: 公开了一种色散补偿光纤放大器,包括:循环器,用于将在第一端子处接收的光信号输出到第二端子,同时将在第二端子接收的光信号输出到第三端子; 用于放大来自第二端子的光信号的第一放大器和重新施加到其上的光信号; 用于补偿从第一放大器接收的光信号中出现的色散的色散补偿光纤和重新施加于其上的光信号; 用于放大来自色散补偿光纤的光信号的第二放大器和重新应用于其的光信号; 分散器,其安装在色散补偿光纤上并且适于输出到色散补偿光纤,施加到色散补偿光纤的光信号和重新施加到其上的光信号,同时输出施加到色散补偿光纤的一端的泵浦光,并且适于泵浦第一和 第二放大器到另一端,而不允许泵浦光通过色散补偿光纤; 以及用于反射来自第二放大器的光信号的反射器,使得反射的光信号按照该顺序重新施加到第二放大器,分路器,第一放大器和循环器。

    Integrated circuit devices having pad contact plugs in the cell array and peripheral circuit regions of the integrated circuit substrate
    58.
    发明授权
    Integrated circuit devices having pad contact plugs in the cell array and peripheral circuit regions of the integrated circuit substrate 失效
    在电池阵列中具有垫接触插塞的集成电路器件和集成电路衬底的外围电路区域

    公开(公告)号:US07495292B2

    公开(公告)日:2009-02-24

    申请号:US11713160

    申请日:2007-03-02

    Abstract: Integrated circuit devices, for example, dynamic random access memory (DRAM) devices, are provided including an integrated circuit substrate having a cell array region and a peripheral circuit region. A buried contact plug is provided on the integrated circuit substrate in the cell array region and a resistor is provided on the integrated circuit substrate in the peripheral circuit region. A first pad contact plug is provided on the buried contact plug in the cell array region and a second pad contact plug is provided on the resistor in the peripheral circuit region. An ohmic layer is provided between the first pad contact plug and the buried contact plug and between the second pad contact plug and the resistor. Related methods of fabricating integrated circuit devices are also provided.

    Abstract translation: 提供集成电路器件,例如动态随机存取存储器(DRAM)器件,其包括具有单元阵列区域和外围电路区域的集成电路衬底。 在单元阵列区域中的集成电路基板上设置埋入式接触插塞,并且在外围电路区域中的集成电路基板上设置电阻器。 第一焊盘接触插头设置在电池阵列区域中的埋入式接触插塞上,并且在外围电路区域中的电阻器上设置第二焊盘接触插头。 在第一焊盘接触插塞和埋地接触插头之间以及第二焊盘接触插头和电阻器之间提供欧姆层。 还提供了制造集成电路器件的相关方法。

    Methods of forming storage capacitors for semiconductor devices
    60.
    发明授权
    Methods of forming storage capacitors for semiconductor devices 有权
    形成半导体器件的储存电容器的方法

    公开(公告)号:US07364967B2

    公开(公告)日:2008-04-29

    申请号:US11266520

    申请日:2005-11-03

    CPC classification number: H01L28/91 H01L27/10817 H01L27/10852 H01L28/75

    Abstract: Methods of forming a storage capacitor include forming an interlayer insulation layer having an opening therethrough on a semiconductor substrate, forming a contact plug in the opening, forming a molding oxide layer on the interlayer insulation layer and the contact plug, selectively removing portions of the molding oxide layer to form a recess above the contact plug, forming a titanium layer on a bottom surface and side surfaces of the recess, forming a titanium nitride layer on the titanium layer, and forming a titanium oxide nitride layer on the titanium nitride layer. A storage capacitor includes a semiconductor substrate, an interlayer insulation layer having a contact plug therein on the substrate, and a storage electrode on the contact plug including a titanium silicide layer, a titanium nitride layer on the titanium silicide layer, and a titanium oxide nitride layer on the titanium nitride layer.

    Abstract translation: 形成存储电容器的方法包括在半导体衬底上形成具有开口的层间绝缘层,在开口中形成接触插塞,在层间绝缘层和接触插塞上形成模压氧化层,选择性地去除模制件的部分 在接触塞上方形成凹部,在凹部的底面和侧面形成钛层,在钛层上形成氮化钛层,在氮化钛层上形成氮化钛层。 存储电容器包括半导体衬底,在衬底上具有接触插塞的层间绝缘层,以及包括钛硅化物层的接触插塞上的存储电极,硅化钛层上的氮化钛层和氧化钛氮化物 层在氮化钛层上。

Patent Agency Ranking