公开(公告)号：US20130087915A1

公开(公告)日：2013-04-11

申请号：US13270012

申请日：2011-10-10

Applicant: Robert W. Warren ,  Nic Rossi ,  Hyun Jung Lee

Inventor： Robert W. Warren ,  Nic Rossi ,  Hyun Jung Lee

IPC: H01L23/498 ,  H01L21/66 ,  H01L21/56

CPC classification number: H01L24/13 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/3185 ,  H01L23/538 ,  H01L23/544 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/14 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L24/96 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54433 ,  H01L2224/033 ,  H01L2224/03334 ,  H01L2224/03828 ,  H01L2224/0384 ,  H01L2224/039 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05124 ,  H01L2224/05647 ,  H01L2224/06136 ,  H01L2224/06155 ,  H01L2224/06177 ,  H01L2224/11002 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/14136 ,  H01L2224/16225 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48229 ,  H01L2224/48465 ,  H01L2224/48847 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/9211 ,  H01L2224/92163 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L22/14 ,  H01L2223/544 ,  H01L21/78 ,  H01L2924/00014 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: There is provided a system and method for a copper stud bump wafer level package. There is provided a semiconductor package comprising a semiconductor die having a plurality of bond pads on an top surface thereof, a plurality of metallic stud bumps mechanically and electrically coupled to said plurality of bond pads, and a plurality of solder balls mechanically and electrically coupled to said plurality of metallic stud bumps. Advantageously, the metallic stud bumps may be provided using standard wirebonding equipment, avoiding the conventional wafer level package requirement for photolithography and deposition steps to provide a multi-layer metallic routing structure. As a result, reduced cycle times, lower cost, and reduced complexity may be provided. Alternative fabrication processes utilizing metallic stud bumps may also support multi-die packages with dies from different wafers and packages with die perimeter pads wirebonded to substrates.

Abstract translation: 提供了一种用于铜柱凸起晶片级封装的系统和方法。 提供一种半导体封装，其包括在其顶表面上具有多个接合焊盘的半导体管芯，多个金属突起，其机械和电耦合到所述多个接合焊盘，以及多个焊球，机械地和电耦合到 所述多个金属柱凸起。 有利地，可以使用标准引线键合设备来提供金属柱凸块，避免用于光刻和沉积步骤的常规晶片级封装要求以提供多层金属布线结构。 因此，可以提供缩短的循环时间，降低成本和降低的复杂性。 使用金属柱凸块的替代制造工艺也可以支持具有来自不同晶片和封装的多管芯封装，其中芯片周边焊盘与衬底引线键合。

公开(公告)号：US20130018052A1

公开(公告)日：2013-01-17

申请号：US13548785

申请日：2012-07-13

Applicant: Ju Young LEE ,  Keun-Ho RYU ,  Jae-Sun KIM ,  Yong-Hyuk KIM ,  Dong Chul SHIN ,  Bong-yong LEE ,  Sang-hwan KANG ,  Hyun-Jung LEE ,  Hoechul JUNG ,  Young Ah SHIN ,  Euisun PARK ,  Jaeseung AHN

Inventor： Ju Young LEE ,  Keun-Ho RYU ,  Jae-Sun KIM ,  Yong-Hyuk KIM ,  Dong Chul SHIN ,  Bong-yong LEE ,  Sang-hwan KANG ,  Hyun-Jung LEE ,  Hoechul JUNG ,  Young Ah SHIN ,  Euisun PARK ,  Jaeseung AHN

IPC: A61K31/444 ,  A61K31/498 ,  A61K31/519 ,  A61K31/4709 ,  C07D495/04 ,  A61K31/4439 ,  C07D498/04 ,  A61P13/12 ,  A61P1/16 ,  A61P11/00 ,  A61P9/04 ,  A61P9/00 ,  A61P27/02 ,  A61P9/10 ,  A61P17/02 ,  A61P19/02 ,  A61P19/10 ,  A61P25/00 ,  A61P15/00 ,  A61P17/00 ,  A61P25/28 ,  A61P7/02 ,  A61P35/00 ,  A61P35/04 ,  C07D487/04

CPC classification number: C07D487/04 ,  C07D519/00

Abstract: The present invention provides a novel 2-pyridyl substituted imidazole derivative, or a pharmaceutically acceptable salt or solvate thereof, which selectively inhibits the transforming growth factor-β (TGF-β) type I receptor (ALK5) and/or the activin type I receptor (ALK4); a pharmaceutical composition comprising same as an active ingredient; and a use of the 2-pyridyl substituted imidazole derivative for the manufacture of a medicament for preventing or treating a disease mediated by ALK5 and/or ALK4 receptors in a mammal.

Abstract translation: 本发明提供了选择性抑制转化生长因子-β1的新型2-吡啶基取代咪唑衍生物或其药学上可接受的盐或溶剂合物。 （TGF-β）I型受体（ALK5）和/或激活素I型受体（ALK4）; 包含其作为活性成分的药物组合物; 以及2-吡啶基取代的咪唑衍生物在制备用于预防或治疗由哺乳动物中ALK5和/或ALK4受体介导的疾病的药物中的用途。

公开(公告)号：US20120217493A1

公开(公告)日：2012-08-30

申请号：US13365704

申请日：2012-02-03

Applicant: Jin-Won LEE ,  Woo Geun LEE ,  Kap Soo YOON ,  Ki-Won KIM ,  Hyun-Jung LEE ,  Hee-Jun BYEON ,  Ji-Soo OH

Inventor： Jin-Won LEE ,  Woo Geun LEE ,  Kap Soo YOON ,  Ki-Won KIM ,  Hyun-Jung LEE ,  Hee-Jun BYEON ,  Ji-Soo OH

IPC: H01L29/786 ,  H01L33/02 ,  H01L29/24

CPC classification number: H01L27/1225 ,  H01L29/41733

Abstract: A thin film transistor array panel includes: a gate electrode disposed on an insulation substrate; a gate insulating layer disposed on the gate electrode; a first electrode and an oxide semiconductor disposed directly on the gate insulating layer; a source electrode and a drain electrode formed on the oxide semiconductor; a passivation layer disposed on the first electrode, the source electrode, and the drain electrode; and a second electrode disposed on the passivation layer.

Abstract translation: 薄膜晶体管阵列面板包括：设置在绝缘基板上的栅电极; 设置在栅电极上的栅极绝缘层; 直接设置在栅极绝缘层上的第一电极和氧化物半导体; 形成在所述氧化物半导体上的源电极和漏电极; 设置在所述第一电极，所述源电极和所述漏电极上的钝化层; 以及设置在钝化层上的第二电极。

公开(公告)号：US20120108023A1

公开(公告)日：2012-05-03

申请号：US13240470

申请日：2011-09-22

Applicant: Kwan-Yong Lim ,  Chung-Geun Koh ,  Sang-Bom Kang ,  Ui-Hui Kwon ,  Hyun-Jung Lee ,  Tae-Ouk Kwon ,  Seok-Hoon Kim

Inventor： Kwan-Yong Lim ,  Chung-Geun Koh ,  Sang-Bom Kang ,  Ui-Hui Kwon ,  Hyun-Jung Lee ,  Tae-Ouk Kwon ,  Seok-Hoon Kim

IPC: H01L21/336

CPC classification number: H01L29/66659 ,  H01L21/26506 ,  H01L21/26586 ,  H01L29/6659 ,  H01L29/7835 ,  H01L29/7847

Abstract: A semiconductor device is formed with a gate pattern formed on a substrate, and a recrystallized region having a stacking fault defect in the substrate at one side of the gate pattern. The semiconductor device can have a reduced leakage current and improved channel conductivity.

Abstract translation: 半导体器件形成有形成在衬底上的栅极图案，以及在栅极图案一侧的衬底中具有层叠缺陷缺陷的再结晶区域。 半导体器件可以具有减小的漏电流和改善的沟道导电性。

公开(公告)号：US08057596B2

公开(公告)日：2011-11-15

申请号：US11955330

申请日：2007-12-12

Applicant: Tae-Ill Yoon ,  Jong-Woon Moon ,  Sung-Hee Cho ,  Sung-Kee Kang ,  Hun-Young Kim ,  Hyun-Jung Lee

Inventor： Tae-Ill Yoon ,  Jong-Woon Moon ,  Sung-Hee Cho ,  Sung-Kee Kang ,  Hun-Young Kim ,  Hyun-Jung Lee

IPC: C30B29/08

CPC classification number: B82Y30/00 ,  B22F1/0007 ,  B22F1/025 ,  B22F9/24 ,  B82Y10/00 ,  H01J1/304 ,  H01J9/025 ,  H01J2201/30446

Abstract: Disclosed is a carbon-based composite particle for an electron emission source comprising: a particle of a material selected from the group consisting of metals, oxides, and ceramic materials; and a carbon-based material such as a carbon nanotube which is partially buried inside of the particle and which partially protrudes from the surface of the particle.

Abstract translation: 公开了一种用于电子发射源的碳基复合颗粒，包括：选自金属，氧化物和陶瓷材料的材料的颗粒; 以及碳粒子等碳系材料，其部分地埋设在粒子的内部，并从粒子的表面部分地突出。

公开(公告)号：US20100213590A1

公开(公告)日：2010-08-26

申请号：US12713141

申请日：2010-02-25

Applicant: Robert W. Warren ,  Hyun Jung Lee ,  Nic Rossi

Inventor： Robert W. Warren ,  Hyun Jung Lee ,  Nic Rossi

IPC: H01L23/58 ,  H01L21/50

CPC classification number: H01L24/33 ,  H01L23/576 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A barrier layer can be attached in a semiconductor package to one or more sensitive devices. The barrier layer can be used to obstruct tampering by a malicious agent attempting to access sensitive information on the sensitive device. The barrier layer can cause the sensitive device to become inoperable if physically tampered. Additional other aspects of the protective packaging provide protection against x-ray and thermal probing as well as chemical and electrical tampering attempts.

Abstract translation: 阻挡层可以在半导体封装中附接到一个或多个敏感器件。 阻挡层可用于阻止恶意代理人尝试访问敏感设备上的敏感信息的篡改。 如果物理篡改，屏障层可能导致敏感设备变得不可操作。 保护性包装的其他方面提供了对X射线和热探测以及化学和电气篡改尝试的保护。

公开(公告)号：US07534373B2

公开(公告)日：2009-05-19

申请号：US11213893

申请日：2005-08-30

Applicant: Sung-Hee Cho ,  Jong-Woon Moon ,  Hyun-Jung Lee ,  Jong-Hwan Park

Inventor： Sung-Hee Cho ,  Jong-Woon Moon ,  Hyun-Jung Lee ,  Jong-Hwan Park

IPC: H01B1/24 ,  H01J1/00

CPC classification number: H01J1/304 ,  Y10S977/783

Abstract: The present invention provides a composition for forming an electron emission source comprising a carbon-based material and a vehicle comprising a resin component and a solvent component. The resin component is a material that has less than 0.5 wt % of carbon deposits after undergoing a heat treatment at 450° C. under nitrogen atmosphere. The present invention also provides a method of preparing an electron emission source using the composition for forming an electron emission source, and an electron emission source that is prepared using the electron emission source. The electron emission source prepared using the composition has a small amount of the carbon deposits which improves its electric current density and lengthens its lifespan.

Abstract translation: 本发明提供一种用于形成电子发射源的组合物，其包含碳基材料和包含树脂组分和溶剂组分的载体。 树脂成分是在氮气气氛下在450℃进行热处理后，碳沉积量小于0.5重量％的材料。 本发明还提供一种使用该电子发射源形成用组合物和使用电子发射源制备的电子发射源制备电子发射源的方法。 使用该组合物制备的电子发射源具有少量的碳沉积物，其改善其电流密度并延长其寿命。

公开(公告)号：US07531206B2

公开(公告)日：2009-05-12

申请号：US11139677

申请日：2005-05-31

Applicant: Hyun-Jung Lee ,  Jong-Woon Moon ,  Sang-Hyun Lee

Inventor： Hyun-Jung Lee ,  Jong-Woon Moon ,  Sang-Hyun Lee

IPC: B05D5/12

CPC classification number: C09K11/65 ,  B82Y30/00 ,  H01J1/304 ,  H01J9/025

Abstract: A method of fabricating a flexible emitter using a high molecular compound, including forming an electro-luminescent carbon material on a glass substrate in a predetermined pattern in order to form an emitter pattern thereon, forming an electrode layer of a predetermined height on the emitter pattern and the glass substrate, applying a polymer gel material on the electrode layer, curing the polymer gel material, and separating the flexible emitter from the glass substrate.

Abstract translation: 一种使用高分子化合物制造柔性发射体的方法，包括以预定图案在玻璃基板上形成电致发光碳材料，以在其上形成发射极图案，在发射极图案上形成预定高度的电极层 和玻璃基板，将聚合物凝胶材料涂覆在电极层上，固化聚合物凝胶材料，并将柔性发射体与玻璃基板分离。

公开(公告)号：US20080003504A1

公开(公告)日：2008-01-03

申请号：US11763750

申请日：2007-06-15

Applicant: Jaephil Cho ,  Youn-Han Chang ,  Sang-Hoon Jeon ,  Hyun-Jung Lee

Inventor： Jaephil Cho ,  Youn-Han Chang ,  Sang-Hoon Jeon ,  Hyun-Jung Lee

IPC: H01M4/58 ,  H01M4/50 ,  H01M4/52

CPC classification number: H01M4/5825 ,  H01M4/366 ,  H01M4/505 ,  H01M4/525 ,  H01M10/0525

Abstract: The present invention relates to a positive active material for a rechargeable lithium battery, a method of preparing the same, and a rechargeable lithium battery including the same. More particularly, the present invention relates to a positive active material for a rechargeable lithium battery including a compound that can reversibly intercalate/deintercalate lithium and a lithium metal phosphate produced through binding with lithium of the compound, the lithium metal phosphate existing from the surface of the compound to a predetermined depth, a method of preparing the positive active material, and a rechargeable lithium battery having the positive active material. The positive active material can accomplish excellent cycle-life characteristic and also, suppress battery swelling at a high temperature.

Abstract translation: 本发明涉及一种用于可再充电锂电池的正极活性材料及其制备方法，以及包含该锂二次电池的可再充电锂电池。 更具体地说，本发明涉及一种用于可再充电锂电池的正极活性材料，其包括可逆地插入/脱嵌锂的化合物和通过与该化合物的锂结合产生的锂金属磷酸盐，从表面上存在的锂金属磷酸盐 化合物至预定深度，制备正极活性物质的方法，以及具有正极活性物质的可再充电锂电池。 正极活性物质可以实现优异的循环寿命特性，并且还抑制高温下的电池膨胀。

公开(公告)号：US20220067763A1

公开(公告)日：2022-03-03

申请号：US17462730

申请日：2021-08-31

Applicant: Hyun Jung LEE

Inventor： Hyun Jung LEE

IPC: G06Q30/02 ,  G06N3/08

Abstract: The present disclosure relates to a method for predicting demand using a visual schema of a product, a device therefor, and a computer program therefor. The demand predicting method includes the operations of: creating visual schemas in which attributes of a product are digitized; analyzing the visual schemas and creating visual schema analysis data which are data relating to the attributes of the product; creating prediction data which are data obtained as a result of demand prediction analysis by attributes of the product using the visual schema analysis data; and creating visual narrative data expressing the prediction data into correlation between products or customers, and describing demand prediction.