公开(公告)号：US08909846B2

公开(公告)日：2014-12-09

申请号：US12320141

申请日：2009-01-21

申请人： Li-Pin Chang ,  Ming-Dar Chen ,  Chien-Ting Huang

发明人： Li-Pin Chang ,  Ming-Dar Chen ,  Chien-Ting Huang

IPC分类号： G06F12/02

CPC分类号： G06F12/0246 ,  G06F2212/7211

摘要： A control method of a memory storage device for writing an updated data from a host to the memory storage device is provided. The memory storage device provides storage space which is divided into a plurality of physical blocks to access the updated data. The control method includes the following steps: first, determining whether the updated data is a hot data or not; finally, storing the less updated data which is not the hot data into the physical block which has the higher erase counts according to the result of above determination.

摘要翻译： 提供了一种用于将更新的数据从主机写入存储器存储装置的存储器存储装置的控制方法。 存储器存储设备提供存储空间，其被划分为多个物理块以访问更新的数据。 该控制方法包括以下步骤：首先，确定更新的数据是否为热数据; 最后，根据上述确定的结果，将不是热数据的较少更新的数据存储到具有较高擦除次数的物理块中。

公开(公告)号：US08847388B2

公开(公告)日：2014-09-30

申请号：US13267200

申请日：2011-10-06

申请人： Chen-Hua Yu ,  Hung-Pin Chang ,  An-Jhih Su ,  Tsang-Jiuh Wu ,  Wen-Chih Chiou ,  Shin-Puu Jeng

发明人： Chen-Hua Yu ,  Hung-Pin Chang ,  An-Jhih Su ,  Tsang-Jiuh Wu ,  Wen-Chih Chiou ,  Shin-Puu Jeng

IPC分类号： H01L23/48 ,  H01L23/31 ,  H01L23/00 ,  H01L23/29

CPC分类号： H01L23/293 ,  H01L23/3192 ,  H01L24/01 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05582 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05686 ,  H01L2224/10126 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13006 ,  H01L2224/13007 ,  H01L2224/13018 ,  H01L2224/13022 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/15788 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/04941 ,  H01L2924/01047 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/00 ,  H01L2224/05552

摘要： A semiconductor device includes a bump structure formed on a post-passivation interconnect (PPI) line and surrounded by a protection structure. The protection structure includes a polymer layer and at least one dielectric layer. The dielectric layer may be formed on the top surface of the polymer layer, underlying the polymer layer, inserted between the bump structure and the polymer layer, inserted between the PPI line and the polymer layer, covering the exterior sidewalls of the polymer layer, or combinations thereof.

摘要翻译： 半导体器件包括形成在钝化后互连（PPI）线上并由保护结构包围的凸块结构。 保护结构包括聚合物层和至少一个电介质层。 电介质层可以形成在聚合物层的顶表面上，该聚合物层的下面，插入凸起结构和聚合物层之间，插入在PPI线和聚合物层之间，覆盖聚合物层的外侧壁，或 其组合。

公开(公告)号：US20140092628A1

公开(公告)日：2014-04-03

申请号：US14043855

申请日：2013-10-02

申请人： Zhi-Ting Ye ,  Chia-Hung Pan ,  Ming-Chuan Lin ,  Hung-Pin Chang ,  Wen-Chieh Wu

发明人： Zhi-Ting Ye ,  Chia-Hung Pan ,  Ming-Chuan Lin ,  Hung-Pin Chang ,  Wen-Chieh Wu

IPC分类号： F21V8/00

CPC分类号： G02B6/0045 ,  G02B6/0055 ,  G02B6/0068

摘要： An illumination device including a light guiding element, a light emitting element, and a reflective element is provided. The light guiding element has a light incident surface, a light emitting surface, a first surface and a second surface. The light incident surface surrounds the light guiding element and is connected between the light emitting surface and the first surface. The first surface is connected between the light incident surface and the second surface so that the second surface is substantially opposite to the light incident surface. The second surface constructs a depression structure having a diameter gradually changed from the first surface towards the light emitting surface. The light emitting element surrounds the light guiding element to emit a light towards the light incident surface. The reflective element is disposed at least on the first surface.

摘要翻译： 提供了包括导光元件，发光元件和反射元件的照明装置。 导光元件具有光入射表面，发光表面，第一表面和第二表面。 光入射表面围绕导光元件并且连接在发光表面和第一表面之间。 第一表面连接在光入射表面和第二表面之间，使得第二表面基本上与光入射表面相对。 第二表面构成具有从第一表面向发光表面逐渐变化的直径的凹陷结构。 发光元件围绕导光元件朝向光入射表面发射光。 反射元件至少设置在第一表面上。

公开(公告)号：US08538497B2

公开(公告)日：2013-09-17

申请号：US13239975

申请日：2011-09-22

申请人： Ming-Hui Chen ,  Chia-Chen Chen ,  Shih-Hsun Yang ,  Pin-Chang Chu ,  Chih-Chia Chang ,  Cheng-Tai Ho

发明人： Ming-Hui Chen ,  Chia-Chen Chen ,  Shih-Hsun Yang ,  Pin-Chang Chu ,  Chih-Chia Chang ,  Cheng-Tai Ho

IPC分类号： H04M1/00 ,  H04B7/00 ,  H01Q1/24 ,  H04W84/18

CPC分类号： H01Q1/243 ,  H01Q1/12 ,  H04W84/18

摘要： A fixing structure including a metal housing and a fixing base is disclosed. The housing has a carrying plane and the fixing base having a first contact end and, opposite, a second contact end is disposed on the housing. The perpendicular distance from the first contact end to the carrying plane is greater than that from the second contact end to the carrying plane. A wireless transmission device is disposed on the fixing base and in contact with the first contact end and the second contact end, so that a perpendicular distance from an antenna end of the wireless transmission device to the carrying plane is greater than a perpendicular distance from a fixed end of the wireless transmission device to the carrying plane. Therefore, a relatively great distance is kept between the antenna end and the housing for preventing the antenna end from being interfered by the metal housing.

摘要翻译： 公开了一种包括金属外壳和固定底座的固定结构。 壳体具有承载平面，并且固定底座具有第一接触端，并且相对于第二接触端设置在壳体上。 从第一接触端到承载平面的垂直距离大于从第二接触端到承载平面的垂直距离。 无线传输装置设置在固定基座上并与第一接触端和第二接触端接触，使得从无线传输装置的天线端到承载平面的垂直距离大于从一个 无线传输设备的固定端到承载平面。 因此，天线端和壳体之间保持相对较大的距离，以防止天线端被金属壳体干扰。

公开(公告)号：US08513119B2

公开(公告)日：2013-08-20

申请号：US12331900

申请日：2008-12-10

申请人： Hung-Pin Chang ,  Kuo-Ching Hsu ,  Chen-Shien Chen ,  Wen-Chih Chiou ,  Chen-Hua Yu

发明人： Hung-Pin Chang ,  Kuo-Ching Hsu ,  Chen-Shien Chen ,  Wen-Chih Chiou ,  Chen-Hua Yu

IPC分类号： H01L21/44

CPC分类号： H01L23/5384 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/481 ,  H01L24/11 ,  H01L24/12 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68372 ,  H01L2224/0231 ,  H01L2224/02311 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05027 ,  H01L2224/0557 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/1401 ,  H01L2224/1701 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2924/00

摘要： A bump structure that may be used for stacked die configurations is provided. Through-silicon vias are formed in a semiconductor substrate. A backside of the semiconductor substrate is thinned to expose the through-silicon vias. An isolation film is formed over the backside of the semiconductor substrate and the exposed portion of the through-silicon vias. The isolation film is thinned to re-expose the through-silicon vias. Bump pads and redistribution lines are formed on the backside of the semiconductor substrate providing an electrical connection to the through-silicon vias. Another isolation film is deposited and patterned, and a barrier layer is formed to provide contact pads for connecting to an external device, e.g., another die/wafer or circuit board.

摘要翻译： 提供了可用于堆叠管芯配置的凸块结构。 通孔形成在半导体衬底中。 半导体衬底的背面变薄以暴露通硅通孔。 在半导体衬底的背面和通过硅通孔的暴露部分之后形成隔离膜。 隔离膜被稀释以重新暴露通硅通孔。 在半导体衬底的背面上形成凸起焊盘和再分布线，提供与通孔硅通孔的电连接。 沉积和图案化另一个隔离膜，并且形成阻挡层以提供用于连接到外部装置（例如另一个芯片/晶片或电路板）的接触焊盘。

公开(公告)号：US08501574B2

公开(公告)日：2013-08-06

申请号：US12574938

申请日：2009-10-07

申请人： Kuo-Pin Chang ,  Hang-Ting Lue ,  Cheng-Hung Tsai

发明人： Kuo-Pin Chang ,  Hang-Ting Lue ,  Cheng-Hung Tsai

IPC分类号： H01L21/20

CPC分类号： G11C13/0009 ,  G11C13/0004 ,  G11C13/0011 ,  H01L27/24 ,  H01L45/04 ,  H01L45/06 ,  H01L45/085 ,  H01L45/1233 ,  H01L45/145 ,  H01L45/16

摘要： A method of manufacturing resistive memory includes the steps: forming a first implanted stacked structure having a first impurity diffusion layer, a second impurity diffusion layer, and a third impurity diffusion layer in a substrate; etching at least the first implanted stacked structure to form a plurality of second implanted stacked structures, wherein the first impurity diffusion layers are first signal lines; forming a plurality of first insulating layers between the second implanted stacked structures; etching the second implanted stacked structures to form a plurality of third implanted stacked structures, wherein the first signal lines are not etched; forming a plurality of second insulating layers between the third implanted stacked structures; forming a plurality of memory material layers electrically coupled to the third impurity diffusion layers; and forming a plurality of second signal lines perpendicular to the first signal lines and electrically coupled to the memory material layers.

摘要翻译： 制造电阻式存储器的方法包括以下步骤：在衬底中形成具有第一杂质扩散层，第二杂质扩散层和第三杂质扩散层的第一注入层叠结构; 蚀刻至少所述第一注入层叠结构以形成多个第二注入层叠结构，其中所述第一杂质扩散层为第一信号线; 在所述第二植入层叠结构之间形成多个第一绝缘层; 蚀刻所述第二注入层叠结构以形成多个第三注入层叠结构，其中所述第一信号线未被蚀刻; 在所述第三植入层叠结构之间形成多个第二绝缘层; 形成电耦合到所述第三杂质扩散层的多个存储材料层; 以及形成垂直于第一信号线的多个第二信号线，并电耦合到存储材料层。

公开(公告)号：US08390399B2

公开(公告)日：2013-03-05

申请号：US12781112

申请日：2010-05-17

申请人： Tsun-Che Huang ,  Pin Chang ,  Feng-Chia Hsu ,  Chin-Hung Wang

发明人： Tsun-Che Huang ,  Pin Chang ,  Feng-Chia Hsu ,  Chin-Hung Wang

IPC分类号： H03H9/05 ,  H03H9/24 ,  H03H9/46

CPC分类号： H03H9/2431 ,  H03H9/02338 ,  H03H9/2405 ,  H03H9/2463 ,  H03H2009/02354

摘要： A resonator includes a resonating body and at least one periodic structure having one end connected to the resonating body. The periodic structure includes at least two basic structure units with duplicated configuration. The periodic structure blocks wave propagation caused by the vibration of the resonating body. The resonating body has a resonance frequency f0. The periodic structure has a band gap characteristic or a deaf band characteristic within a particular frequency range, and the resonance frequency f0 falls within the particular frequency range of the periodic structure.

摘要翻译： 谐振器包括谐振体和至少一个周期性结构，其一端连接到谐振体。 周期性结构包括具有重复配置的至少两个基本结构单元。 周期性结构阻止由共振体的振动引起的波传播。 共振体具有共振频率f0。 周期性结构在特定频率范围内具有带隙特性或聋带特性，并且谐振频率f0落在周期性结构的特定频率范围内。

公开(公告)号：US08388208B2

公开(公告)日：2013-03-05

申请号：US12826687

申请日：2010-06-30

申请人： Ming Huang Wen ,  Chun Pin Chang ,  Chan Chang Ni ,  Tsung Yung Hung ,  Chung Lin Tsai

发明人： Ming Huang Wen ,  Chun Pin Chang ,  Chan Chang Ni ,  Tsung Yung Hung ,  Chung Lin Tsai

IPC分类号： F21V8/00 ,  F21V7/04 ,  F21V7/05

CPC分类号： G02B6/0061 ,  G02B6/0036 ,  G02B6/0068 ,  G02B6/0078

摘要： A method and a structure for improving the uniformity of light emitted from a backlight module are provided. In accordance with the present invention, a plurality of optical microstructures are intermittently distributed on an LGP of a backlight module. Each of the microstructures further includes a plurality of optical sub-microstructures. The optical microstructures and the optical sub-microstructures are distributed on the LGP with varied distribution intensities in three dimensions, such that at where the optical microstructures and the optical sub-microstructures are distributed with a larger distribution intensities the LGP refracts and reflects more light, and at where the optical microstructures and the optical sub-microstructures are distributed with a smaller distribution intensities the LGP refracts and reflects less light. In such a way, by designing particular distribution intensities of the optical microstructures and the optical sub-microstructures, the light emitted from the LGP can be uniformed.

摘要翻译： 提供了用于提高从背光模块发出的光的均匀性的方法和结构。 根据本发明，多个光学微结构被间歇地分布在背光模块的LGP上。 每个微结构还包括多个光学子微结构。 光学微结构和光学亚微观结构在三维分布强度分布在LGP上，使得在光学微结构和光学亚微观结构以更大的分布强度分布的地方，LGP折射和反射更多的光， 并且在光学微结构和光学亚微结构以更小的分布强度分布的地方，LGP折射并反射较少的光。 以这种方式，通过设计光学微结构和光学子微结构的特定分布强度，从LGP发射的光可以是均匀的。

公开(公告)号：US20130023065A1

公开(公告)日：2013-01-24

申请号：US13189287

申请日：2011-07-22

申请人： Chien Rhone Wang ,  Tzu-Cheng Lin ,  Yu-Jen Cheng ,  Chih-Wei Lai ,  Hung-Pin Chang ,  Tsang-Jiuh Wu

发明人： Chien Rhone Wang ,  Tzu-Cheng Lin ,  Yu-Jen Cheng ,  Chih-Wei Lai ,  Hung-Pin Chang ,  Tsang-Jiuh Wu

IPC分类号： H01L21/66

CPC分类号： H01J37/32963

摘要： Methods and apparatus for performing end point determination. A method includes receiving a wafer into an etch tool chamber for performing an RIE etch; beginning the RIE etch to form vias in the wafer; receiving in-situ measurements of one or more physical parameters of the etch tool chamber that are correlated to the RIE etch process; providing a virtual metrology model for the RIE etch in the chamber; inputting the received in-situ measurements to the virtual metrology model for the RIE etch in the chamber; executing the virtual metrology model to estimate the current via depth; comparing the estimated current via depth to a target depth; and when the comparing indicates the current via depth is within a predetermined threshold of the target depth; outputting a stop signal. An apparatus for use with the method embodiment is disclosed.

摘要翻译： 执行终点确定的方法和装置。 一种方法包括将晶片接收到用于进行RIE蚀刻的蚀刻工具室中; 开始RIE蚀刻以在晶片中形成通孔; 接收与RIE蚀刻工艺相关的蚀刻工具室的一个或多个物理参数的原位测量; 为腔室中的RIE蚀刻提供虚拟计量模型; 将接收到的原位测量值输入到腔室中的RIE蚀刻的虚拟测量模型; 执行虚拟计量模型以通过深度估计电流; 将经过深度的估计电流与目标深度进行比较; 并且当比较指示当前经过深度在目标深度的预定阈值内时; 输出停止信号。 公开了一种用于该方法实施例的装置。

公开(公告)号：US20130022236A1

公开(公告)日：2013-01-24

申请号：US13227119

申请日：2011-09-07

申请人： Yin-Pin Chang ,  Wen-Yan Chang ,  Hong-Long Chou

发明人： Yin-Pin Chang ,  Wen-Yan Chang ,  Hong-Long Chou

IPC分类号： G06K9/00

CPC分类号： G06T7/77 ,  G06T2207/10024

摘要： An apparatus capable of detecting location of object contained in image data and its detecting method are disclosed. The apparatus comprises an image capturing module, a weight assignment module, and a processing module. The image capturing module is for capturing an image. The weight assignment module performs the pixel weight/probability assignment according to the priori information and the image, and figures out the initial gravity center of the object according to the object location initialization. The processing module performs the statistical analysis according to the result of the pixel weight/probability assignment and the initial gravity center of the object so as to obtain the analysis result and update the object location. The processing module determines whether or not the analysis result meets the preset value, if it does, the processing module outputs an estimated result; if it doesn't, the processing module repeats the foregoing processes.

摘要翻译： 公开了能够检测图像数据中包含的对象的位置的装置及其检测方法。 该装置包括图像捕获模块，重量分配模块和处理模块。 图像捕获模块用于捕获图像。 权重分配模块根据先验信息和图像执行像素权重/概率分配，并根据对象位置初始化来计算对象的初始重心。 处理模块根据像素权重/概率分配的结果和对象的初始重心进行统计分析，以获得分析结果并更新对象位置。 处理模块确定分析结果是否满足预设值，如果是，则处理模块输出估计结果; 如果没有，则处理模块重复上述处理。