公开(公告)号：US4715892A

公开(公告)日：1987-12-29

申请号：US922271

申请日：1986-10-30

Applicant: Deepak Mahulikar

Inventor： Deepak Mahulikar

IPC: C22C1/05 ,  C22C32/00 ,  H01L21/48 ,  H01L23/15 ,  C22C29/12

CPC classification number: H01L23/15 ,  C22C1/05 ,  C22C32/0089 ,  H01L21/4807 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/3025 ,  Y10T428/12056 ,  Y10T428/12097 ,  Y10T428/12139 ,  Y10T428/12181

Abstract: The present invention is directed to a cermet material comprising a matrix of metal or alloy with ceramic particles distributed therein. The cermet includes a glass binder for bonding between the metal or alloy and the ceramic particles.

Abstract translation: 本发明涉及一种金属陶瓷材料，其包含金属或合金的基体，其中分布有陶瓷颗粒。 金属陶瓷包括用于在金属或合金与陶瓷颗粒之间接合的玻璃粘合剂。

公开(公告)号：US20130067998A1

公开(公告)日：2013-03-21

申请号：US13618088

申请日：2012-09-14

Applicant: Saeed H. Mohseni ,  Elizabeth K. Gramm ,  Deepak Mahulikar

Inventor： Saeed H. Mohseni ,  Elizabeth K. Gramm ,  Deepak Mahulikar

IPC: C09K13/00 ,  G01N1/44 ,  G01N1/10 ,  C09K13/02 ,  C09G1/02

CPC classification number: C09K3/1463 ,  C09G1/02

Abstract: A method of forming a colloidal dispersion includes providing a first continuous material flow, providing a second continuous material flow, combining the first and second continuous material flows, and moving a continuous flow of a colloidal dispersion in a direction downstream of the first and second continuous flows. The first continuous material flow includes one or more of a diluent (e.g., deionized water), a base, and an acid, and the second continuous material flow includes an abrasive particle solution. The first and second material flows are combined with a Reynolds number greater than about 4400 and less than about 25000 (e.g., about 7400 to about 25000). The colloidal dispersion includes the diluent, the base, the acid, and abrasive particles from the abrasive particle solution.

Abstract translation: 形成胶态分散体的方法包括提供第一连续材料流，提供第二连续材料流，组合第一和第二连续材料流，以及在第一和第二连续材料的下游方向上移动胶体分散体的连续流动 流动。 第一连续材料流包括稀释剂（例如去离子水），碱和酸中的一种或多种，​​并且第二连续材料流包括研磨颗粒溶液。 第一和第二材料流与大于约4400且小于约25000（例如约7400至约25000）的雷诺数组合。 胶体分散体包括来自磨料颗粒溶液的稀释剂，碱，酸和磨料颗粒。

公开(公告)号：US20120145950A1

公开(公告)日：2012-06-14

申请号：US13405027

申请日：2012-02-24

Applicant: Deepak Mahulikar ,  Yuhu Wang ,  Ken A. Delbridge ,  Gert R.M. Moyaerts ,  Saeed H. Mohseni ,  Nichole R. Koontz ,  Bin Hu ,  Liqing Wen

Inventor： Deepak Mahulikar ,  Yuhu Wang ,  Ken A. Delbridge ,  Gert R.M. Moyaerts ,  Saeed H. Mohseni ,  Nichole R. Koontz ,  Bin Hu ,  Liqing Wen

IPC: C09K13/00 ,  B82Y30/00

CPC classification number: C23F3/04 ,  C01B33/1435 ,  C01B33/1485 ,  C01P2004/62 ,  C01P2004/64 ,  C01P2006/80 ,  C09G1/02 ,  C09K3/1463 ,  C09K3/1472 ,  H01L21/31053 ,  H01L21/3212

Abstract: An ultrapure colloidal silica dispersion comprising colloidal silica particles having a mean or aggregate particle size from about 10 to about 200 nm, wherein the colloidal silica dispersion has less than 200 ppb, of each trace metal impurity disposed therein, excluding potassium and sodium, and have less than 2 ppm residual alcohol. A method for producing and using the same is also disclosed.

Abstract translation: 一种超纯胶态二氧化硅分散体，其包含平均或聚集体粒径为约10至约200nm的胶体二氧化硅颗粒，其中胶态二氧化硅分散体中除了钾和钠之外的每种痕量金属杂质少于200ppb，并且具有 小于2ppm的残余酒精。 还公开了其制造和使用方法。

公开(公告)号：US20090053896A1

公开(公告)日：2009-02-26

申请号：US12221864

申请日：2008-08-07

Applicant: Bin Hu ,  Richard Wen ,  Deepak Mahulikar

Inventor： Bin Hu ,  Richard Wen ,  Deepak Mahulikar

IPC: H01L21/304 ,  C09K13/00

CPC classification number: C09G1/02 ,  C09G1/16 ,  H01L21/3212

Abstract: A water-soluble polymer is effective as a removal rate enhancer in a chemical mechanical polishing slurry to polish copper on semiconductor wafers or other copper laid structures, while keeping the etching rate low. The slurry may also include soft particles and certain metal chelating agents, or combinations thereof. The slurry can also comprise an abrasive particle, an organic acid, and an oxidizer.

Abstract translation: 水溶性聚合物在化学机械抛光浆料中作为去除速率增强剂是有效的，以在半导体晶片或其它铜敷设结构上抛光铜，同时保持蚀刻速率较低。 浆料还可以包括软颗粒和某些金属螯合剂，或其组合。 浆料还可以包含磨料颗粒，有机酸和氧化剂。

公开(公告)号：US06776696B2

公开(公告)日：2004-08-17

申请号：US10281905

申请日：2002-10-28

Applicant: Deepak Mahulikar ,  Richard J. Jenkins

Inventor： Deepak Mahulikar ,  Richard J. Jenkins

IPC: B24B100

CPC classification number: C09G1/02 ,  B24B37/044 ,  H01L21/3212

Abstract: A continuous CMP process for polishing multiple conductive and non-conductive layers on a semiconductor substrate. The continuous process comprises the steps of: (a) disposing a substrate on a platen; (b) polishing a first layer using both a mechanical means and a chemical means; and (c) polishing a second layer upon adjusting at least one parameter in either the mechanical means, chemical means, or both.

公开(公告)号：US6158351A

公开(公告)日：2000-12-12

申请号：US681138

申请日：1996-07-22

Applicant: Brian Mravic ,  Henry J. Halverson ,  Deepak Mahulikar

Inventor： Brian Mravic ,  Henry J. Halverson ,  Deepak Mahulikar

IPC: B22F1/00 ,  F42B12/74 ,  F42B1/00 ,  F42B8/14

CPC classification number: F42B12/745 ,  B22F1/0003 ,  F42B12/74

Abstract: A lead free ferromagnetic article is disclosed. The article is a compacted composite having a heavy more dense constituent that is preferably ferrotungsten and a less dense second constituent that is either a metal alloy or a polymer. The ferromagnetic constituent is present in an amount sufficient to impart the article with ferromagnetism. The ferromagnetic property allows fragments of the article, such as a projectile, bullet or shaped charge liner to be separated from dirt or other environments.

Abstract translation: 公开了一种无铅铁磁制品。 该制品是具有重的更致密的组分的压实复合材料，其优选是铁钨和不太致密的第二组分，其是金属合金或聚合物。 铁磁组分以足以赋予制品铁磁性的量存在。 铁磁性能允许制品的碎片，例如抛射物，子弹或成形的电荷衬垫与污垢或其它环境分离。

公开(公告)号：US5814759A

公开(公告)日：1998-09-29

申请号：US794286

申请日：1997-02-03

Applicant: Brian Mravic ,  Deepak Mahulikar ,  Gerald Noel Violette ,  Eugene Shapiro ,  Henry J. Halverson

Inventor： Brian Mravic ,  Deepak Mahulikar ,  Gerald Noel Violette ,  Eugene Shapiro ,  Henry J. Halverson

IPC: F42B7/00 ,  B22F1/00 ,  C22C1/05 ,  C22C27/04 ,  C22C29/08 ,  C22C32/00 ,  C22C38/00 ,  C22C38/12 ,  F42B7/04 ,  F42B12/72 ,  F42B12/74 ,  F42B30/02 ,  C22C33/02

CPC classification number: F42B7/046 ,  B22F1/0003 ,  C22C32/0094 ,  F42B12/74 ,  F42B12/745

Abstract: A composite lead-free bullet is disclosed comprising a heavy constituents selected from the group of tungsten, tungsten carbide, carballoy, and ferro-tungsten and a second binder constituent consisting of either a metal alloy or a plastic blend.

Abstract translation: 公开了一种复合无铅子弹，其包括选自钨，碳化钨，碳合金和铁 - 钨的重质组分和由金属合金或塑性共混物组成的第二粘合剂成分。

公开(公告)号：US5741544A

公开(公告)日：1998-04-21

申请号：US521858

申请日：1995-08-31

Applicant: Deepak Mahulikar

Inventor： Deepak Mahulikar

IPC: C23C16/04 ,  C23C16/44 ,  C23C16/455 ,  F28F19/06 ,  B05D7/22

CPC classification number: C23C16/4551 ,  C23C16/045 ,  C23C16/45589 ,  F28F19/06

Abstract: Various types of articles having various deposition coatings applied using a gas vapor deposition process are provided. A system evacuates gases from the article or a deposition chamber prior to depositing a coating. The coating may be applied throughout the inside of an article or may be selectively applied to a portion of the article. The article may be moved relative to the gas jet or the gas may be moved jet relative to the article. Stencils may be used to pattern the coating on the surface of the article. The articles are coated in a pressure of approximately 5 millitorr. Articles may be cylindrically shaped, leadframes on a reel, substrates, or printed circuit boards.

Abstract translation: 提供了使用气相沉积工艺应用各种沉积涂层的各种类型的制品。 在沉积涂层之前，系统从制品或沉积室排出气体。 涂层可以施用在制品的整个内部，或者可以选择性地施加到制品的一部分。 物品可以相对于气体射流移动，或者气体可以相对于物品移动。 模板可用于对制品表面上的涂层进行图案化。 制品以约5毫托的压力涂覆。 制品可以是圆柱形的，卷轴上的引线框架，基板或印刷电路板。

公开(公告)号：US5688606A

公开(公告)日：1997-11-18

申请号：US633256

申请日：1996-04-18

Applicant: Deepak Mahulikar ,  Efraim Sagiv ,  Arvind Parthasarathi ,  Satish Jalota ,  Andrew J. Brock ,  Michael A. Holmes ,  Jeffrey M. Schlater ,  German J. Ramirez ,  Dexin Liang

Inventor： Deepak Mahulikar ,  Efraim Sagiv ,  Arvind Parthasarathi ,  Satish Jalota ,  Andrew J. Brock ,  Michael A. Holmes ,  Jeffrey M. Schlater ,  German J. Ramirez ,  Dexin Liang

IPC: C25D11/04 ,  H01L23/02 ,  H01L23/04 ,  H01L23/06 ,  H01L23/14 ,  H05K1/05 ,  B32B15/00 ,  B21D39/00 ,  B32B3/00 ,  C25D5/18

CPC classification number: H05K1/056 ,  H01L23/142 ,  H05K1/053 ,  H01L2224/16225 ,  H01L2924/01327 ,  Y10T428/12493 ,  Y10T428/12556 ,  Y10T428/12736 ,  Y10T428/24917

Abstract: There is provided an anodizable aluminum substrate having an increased breakdown voltage. The increase in breakdown voltage is achieved by selecting an appropriate aluminum alloy and appropriate processing parameters. Sealing the anodic film increases the breakdown voltage by decreasing corrosion. A preferred sealant is an epoxy cresol novolac having a low room temperature viscosity that cures to a highly cross-linked polymer.

Abstract translation: 提供了具有增加的击穿电压的阳极氧化铝基板。 通过选择适当的铝合金和适当的加工参数来实现击穿电压的增加。 密封阳极膜通过减少腐蚀来增加击穿电压。 优选的密封剂是具有低固化至高度交联的聚合物的低室温粘度的环氧甲酚酚醛清漆。

公开(公告)号：US5608267A

公开(公告)日：1997-03-04

申请号：US276381

申请日：1994-07-18

Applicant: Deepak Mahulikar ,  Derek E. Tyler ,  Jeffrey S. Braden ,  James M. Popplewell

Inventor： Deepak Mahulikar ,  Derek E. Tyler ,  Jeffrey S. Braden ,  James M. Popplewell

IPC: H01L23/28 ,  H01L23/12 ,  H01L23/29 ,  H01L23/31 ,  H01L23/373 ,  H01L23/433

CPC classification number: H01L24/32 ,  H01L23/315 ,  H01L23/4334 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/83856 ,  H01L2224/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/86 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/3025

Abstract: There is provided a molded plastic electronic package having improved thermal dissipation. A thermal dissipator, such as a heat spreader or a heat slug is partially encapsulated in the molding resin. The thermal dissipator has a density less than that of copper and a coefficient of thermal conductivity that is constant or increases as the package periphery is approached.

Abstract translation: 提供了具有改进的热耗散的模制塑料电子封装。 散热器，例如散热器或散热片部分地封装在模制树脂中。 散热器的密度小于铜的密度，并且导热系数恒定或随着封装周边接近而增加。