公开(公告)号：US08053852B2

公开(公告)日：2011-11-08

申请号：US11483185

申请日：2006-07-10

申请人： Takashi Noma

发明人： Takashi Noma

IPC分类号： H01L27/14

CPC分类号： H01L27/14634 ,  H01L27/1464 ,  H01L27/1469 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention is directed to enhancement of performance of a back surface incident type semiconductor device having a light receiving element and a manufacturing method thereof without increasing a manufacturing cost. A supporting body is attached to a front surface of a semiconductor substrate formed with a light receiving element and its pad electrode. Then, the supporting body is etched to form a via hole penetrating the supporting body and exposing the pad electrode. Then, a wiring connected to the pad electrode and extending onto a front surface of the supporting body through the via hole is formed. Lastly, the semiconductor substrate is separated into a plurality of semiconductor dies by dicing. The semiconductor device is mounted so that the supporting body faces a circuit board.

摘要翻译： 本发明旨在提高具有光接收元件的背面入射型半导体器件及其制造方法的性能，而不增加制造成本。 支撑体附接到形成有光接收元件和其焊盘电极的半导体衬底的前表面。 然后，对支撑体进行蚀刻，形成贯通支撑体的通孔，露出焊盘电极。 然后，形成与焊盘电极连接并通过通孔延伸到支撑体的前表面的配线。 最后，通过切割将半导体衬底分离成多个半导体管芯。 半导体器件被安装成使得支撑体面向电路板。

公开(公告)号：US07973633B2

公开(公告)日：2011-07-05

申请号：US12846151

申请日：2010-07-29

申请人： Takashi Noma ,  Nobuo Ikemoto ,  Yoshihiko Nishizawa

发明人： Takashi Noma ,  Nobuo Ikemoto ,  Yoshihiko Nishizawa

IPC分类号： H01F5/00

CPC分类号： H02M7/003 ,  H01F17/0013 ,  H01F27/34 ,  H01F27/40 ,  H01F2027/2809 ,  H02M1/44 ,  H02M3/155 ,  H02M3/335

摘要： Lower surface terminals are disposed at the lower surface of a magnetic substrate. An upper surface electrode is disposed at the upper surface of the magnetic substrate. A control circuit, an input capacitor, and an output capacitor are mounted on the upper surface electrode. The control circuit contains a switching element. A smoothing choke is disposed inside the magnetic substrate. The connection wiring of connecting the upper surface electrode and at least one of the input terminal, the output terminal, and the ground terminal is constructed using an inner conductor passing through the inside of the magnetic substrate, and the connection wiring forms an inductor.

摘要翻译： 下表面端子设置在磁性基板的下表面。 上表面电极设置在磁性基板的上表面。 控制电路，输入电容器和输出电容器安装在上表面电极上。 控制电路包含开关元件。 平滑扼流圈设置在磁性基板的内部。 连接上表面电极和输入端子，输出端子和接地端子中的至少一个的连接布线使用穿过磁性基板内部的内部导体构成，并且连接布线形成电感器。

公开(公告)号：US07969007B2

公开(公告)日：2011-06-28

申请号：US12111383

申请日：2008-04-29

申请人： Takashi Noma ,  Hiroyuki Shinogi ,  Noboru Okubo

发明人： Takashi Noma ,  Hiroyuki Shinogi ,  Noboru Okubo

IPC分类号： H01L23/485

CPC分类号： H01L23/3114 ,  H01L21/6835 ,  H01L23/3185 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0401 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06586 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/00

摘要： A semiconductor device with improved moisture resistance and its manufacturing method as well as a manufacturing method of a semiconductor device which simplifies a manufacturing process and improves productivity are offered. This invention offers a CSP type semiconductor device and its manufacturing method that can prevent moisture and the like from infiltrating into it to attain high reliability by covering a side surface of a semiconductor chip with a thick protection layer. This invention also offers a highly productive manufacturing method of semiconductor devices by which a supporter bonded to semiconductor dice is etched from a back surface-side of the supporter so that the semiconductor devices can be separated without dicing.

摘要翻译： 提供了一种具有改善的耐湿性的半导体器件及其制造方法以及简化制造工艺并提高生产率的半导体器件的制造方法。 本发明提供一种CSP型半导体器件及其制造方法，其可以通过用厚保护层覆盖半导体芯片的侧表面来防止水分等渗入其中以获得高可靠性。 本发明还提供了一种高效率的半导体器件的制造方法，通过该半导体器件，从支撑体的背面侧蚀刻与半导体晶片接合的支撑体，使得可以在不切割的情况下分离半导体器件。

公开(公告)号：US20100328010A1

公开(公告)日：2010-12-30

申请号：US12846151

申请日：2010-07-29

申请人： Takashi Noma ,  Nobuo Ikemoto ,  Yoshihiko Nishizawa

发明人： Takashi Noma ,  Nobuo Ikemoto ,  Yoshihiko Nishizawa

IPC分类号： H01F5/00

CPC分类号： H02M7/003 ,  H01F17/0013 ,  H01F27/34 ,  H01F27/40 ,  H01F2027/2809 ,  H02M1/44 ,  H02M3/155 ,  H02M3/335

摘要： Lower surface terminals are disposed at the lower surface of a magnetic substrate. An upper surface electrode is disposed at the upper surface of the magnetic substrate. A control circuit, an input capacitor, and an output capacitor are mounted on the upper surface electrode. The control circuit contains a switching element. A smoothing choke is disposed inside the magnetic substrate. The connection wiring of connecting the upper surface electrode and at least one of the input terminal, the output terminal, and the ground terminal is constructed using an inner conductor passing through the inside of the magnetic substrate, and the connection wiring forms an inductor.

摘要翻译： 下表面端子设置在磁性基板的下表面。 上表面电极设置在磁性基板的上表面。 控制电路，输入电容器和输出电容器安装在上表面电极上。 控制电路包含开关元件。 平滑扼流圈设置在磁性基板的内部。 连接上表面电极和输入端子，输出端子和接地端子中的至少一个的连接布线使用穿过磁性基板内部的内部导体构成，并且连接布线形成电感器。

公开(公告)号：US07791906B2

公开(公告)日：2010-09-07

申请号：US12426352

申请日：2009-04-20

申请人： Takashi Noma ,  Nobuo Ikemoto ,  Yoshihiko Nishizawa

发明人： Takashi Noma ,  Nobuo Ikemoto ,  Yoshihiko Nishizawa

IPC分类号： H02M3/335 ,  G05F1/10

CPC分类号： H02M7/003 ,  H01F17/0013 ,  H01F27/34 ,  H01F27/40 ,  H01F2027/2809 ,  H02M1/44 ,  H02M3/155 ,  H02M3/335

摘要： Lower surface terminals are disposed at the lower surface of a magnetic substrate. An upper surface electrode is disposed at the upper surface of the magnetic substrate. A control circuit, an input capacitor, and an output capacitor are mounted on the upper surface electrode. The control circuit contains a switching element. A smoothing choke is disposed inside the magnetic substrate. The connection wiring of connecting the upper surface electrode and at least one of the input terminal, the output terminal, and the ground terminal is constructed using an inner conductor passing through the inside of the magnetic substrate, and the connection wiring forms an inductor.

摘要翻译： 下表面端子设置在磁性基板的下表面。 上表面电极设置在磁性基板的上表面。 控制电路，输入电容器和输出电容器安装在上表面电极上。 控制电路包含开关元件。 平滑扼流圈设置在磁性基板的内部。 连接上表面电极和输入端子，输出端子和接地端子中的至少一个的连接布线使用穿过磁性基板内部的内部导体构成，并且连接布线形成电感器。

公开(公告)号：US07782024B2

公开(公告)日：2010-08-24

申请号：US12064622

申请日：2007-04-04

申请人： Iwao Fukushi ,  Masahiro Maruki ,  Takashi Noma

发明人： Iwao Fukushi ,  Masahiro Maruki ,  Takashi Noma

IPC分类号： G05F1/613

CPC分类号： H02M3/1588 ,  H02M1/088 ,  H02M2001/0025 ,  Y02B70/1466 ,  Y10S323/901

摘要： A switching control circuit comprises: an error amplifying circuit configured to output an error voltage obtained by amplifying an error between a feedback voltage corresponding to an output voltage and a lower voltage selected out of a first reference voltage increasing with time passage and a second reference voltage used as a reference for a target level; a comparison circuit configured to output a comparison signal obtained by comparing the feedback voltage with the error voltage output from the error amplifying circuit; and a drive circuit configured to output first and second control signals for controlling first and second transistors, respectively, in order to turn the output voltage to the target level by complementarily turning on and off the first and second transistors, after the error voltage exceeds the feedback voltage, based on the comparison signal output from the comparison circuit.

摘要翻译： 一种开关控制电路，包括：误差放大电路，被配置为输出通过放大对应于输出电压的反馈电压与从时间通过而增加的第一参考电压中选择的较低电压之间的误差而获得的误差电压，以及第二参考电压 用作目标水平的参考; 比较电路，被配置为输出通过将反馈电压与从误差放大电路输出的误差电压进行比较而获得的比较信号; 以及驱动电路，被配置为输出用于分别控制第一和第二晶体管的第一和第二控制信号，以便在误差电压超过第一和第二晶体管之后通过互补地导通和关断第一和第二晶体管将输出电压转换到目标电平 反馈电压，基于比较电路输出的比较信号。

公开(公告)号：US20100044821A1

公开(公告)日：2010-02-25

申请号：US12538304

申请日：2009-08-10

申请人： Takashi Noma ,  Yoshimasa Amatatsu ,  Yoshinori Seki ,  Hiroyuki Shinogi

发明人： Takashi Noma ,  Yoshimasa Amatatsu ,  Yoshinori Seki ,  Hiroyuki Shinogi

IPC分类号： H01L31/0216 ,  H01L31/18

CPC分类号： H01L31/02162 ,  H01L27/14621 ,  H01L27/14645

摘要： This invention offers a semiconductor device to measure a luminance for the visible wavelength range of light components and its manufacturing method which reduce its manufacturing cost. A first light-receiving element and a second light-receiving element are formed in a semiconductor substrate. Then, there is formed an arithmetic circuit that calculates a difference between a value of an electric current corresponding to an amount of light detected by the first light-receiving element (that is, a value of an electric current representing a relative sensitivity against the light) and a value of an electric current corresponding to an amount of light detected by the second light-receiving element (that is, a value of an electric current representing a relative sensitivity against the light). Next, a first green pass filter permeable only to light in a green wavelength range and an infrared wavelength range is formed to cover the first light-receiving element, while a second green pass filter similar to the first green filter is formed to cover the second light-receiving element. In addition, a red pass filter permeable only to light in a red wavelength range and the infrared wavelength range is formed to cover the second light-receiving element.

摘要翻译： 本发明提供一种用于测量光分量的可见光波长范围的亮度的半导体器件及其制造方法，其制造成本降低。 第一光接收元件和第二光接收元件形成在半导体衬底中。 然后，形成运算电路，其计算与由第一受光元件检测出的光量相对应的电流值（即，表示相对于光的相对灵敏度的电流值） ）和与由第二受光元件检测到的光量相对应的电流值（即，相对于光的相对灵敏度的电流值）。 接下来，形成可以仅透过绿色波长范围和红外线波长范围的光的第一绿色通过滤光片，以覆盖第一光接收元件，同时形成与第一绿色滤光片相似的第二绿色通过滤光片以覆盖第二光接收元件 光接收元件。 此外，形成仅透过红色波长范围的光和红外线波长范围的红色滤光片，以覆盖第二光接收元件。

公开(公告)号：US07575994B2

公开(公告)日：2009-08-18

申请号：US11451633

申请日：2006-06-13

申请人： Yuichi Morita ,  Shinzo Ishibe ,  Takashi Noma ,  Hisao Otsuka ,  Yukihiro Takao ,  Hiroshi Kanamori

发明人： Yuichi Morita ,  Shinzo Ishibe ,  Takashi Noma ,  Hisao Otsuka ,  Yukihiro Takao ,  Hiroshi Kanamori

IPC分类号： H01L21/44

CPC分类号： H01L23/3192 ,  H01L23/3114 ,  H01L23/3171 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05644 ,  H01L2224/1132 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2924/00014

摘要： The invention provides a CSP type semiconductor device with high reliability. The semiconductor device includes a pad electrode formed on a semiconductor substrate, a first passivation film covering an end portion of the pad electrode and having a first opening on the pad electrode, a plating layer formed on the pad electrode in the first opening, a second passivation film covering an exposed portion of the pad electrode between an end portion of the first passivation film and the plating layer, covering an end portion of the plating layer, and having a second opening on the plating layer, and a conductive terminal formed on the plating layer in the second opening.

摘要翻译： 本发明提供了一种具有高可靠性的CSP型半导体器件。 半导体器件包括形成在半导体衬底上的焊盘电极，覆盖焊盘电极的端部并且在焊盘电极上具有第一开口的第一钝化膜，形成在第一开口中的焊盘电极上的镀层，第二钝化膜 钝化膜，覆盖第一钝化膜的端部与镀覆层之间的焊盘电极的露出部分，覆盖镀层的端部，并且在镀层上具有第二开口;以及导电端子， 第二开口中的镀层。

公开(公告)号：US07456083B2

公开(公告)日：2008-11-25

申请号：US11069061

申请日：2005-03-02

申请人： Takashi Noma ,  Yoshinori Seki ,  Motoaki Wakui

发明人： Takashi Noma ,  Yoshinori Seki ,  Motoaki Wakui

IPC分类号： H01L21/301

CPC分类号： H01L21/78 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/544 ,  H01L24/10 ,  H01L24/13 ,  H01L24/97 ,  H01L2223/54453 ,  H01L2223/5448 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/051 ,  H01L2224/05548 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00014

摘要： The invention is directed to an improvement of cutting accuracy in a cutting process when a semiconductor device attached with a supporting member is manufactured. The invention provides a manufacturing method of a semiconductor device where a semiconductor wafer attached with a glass substrate is cut with moving a rotation blade along a dicing region and has following features. A pair of alignment marks is formed facing each other over the dicing region on the semiconductor wafer. Then, when the rotation blade is to be aligned on a center of the dicing region, that is, on a centerline thereof in the cutting process, positions of the alignment marks are detected by a recognition camera, the centerline is calculated based on the detection result, and the rotation blade is aligned on the centerline to perform cutting.

摘要翻译： 本发明涉及当制造附着有支撑构件的半导体器件时，在切割过程中提高切割精度。 本发明提供一种半导体器件的制造方法，其中通过沿着切割区域移动旋转刀片来切割附着有玻璃基板的半导体晶片，并且具有以下特征。 在半导体晶片上的切割区域上形成一对对准标记。 然后，当切割区域的中心，即在切割过程中的中心线处，旋转刀片对准时，通过识别照相机检测对准标记的位置，基于检测计算中心线 结果，旋转叶片在中心线上对齐，以进行切割。

公开(公告)号：US07397134B2

公开(公告)日：2008-07-08

申请号：US11145176

申请日：2005-06-06

申请人： Takashi Noma

发明人： Takashi Noma

IPC分类号： H01L23/498

CPC分类号： H04N5/2253 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/013

摘要： The invention provides a package type semiconductor device and a manufacturing method thereof where reliability is improved without increasing a manufacturing cost. A resin layer and a supporting member are formed on a top surface of a semiconductor substrate formed with pad electrodes. Then, openings are formed penetrating the resin layer and the supporting member so as to expose the pad electrodes. Metal layers are then formed on the pad electrodes exposed in the openings, and conductive terminals are formed thereon. Finally, the semiconductor substrate is separated into semiconductor dice by dicing. When this semiconductor device is mounted on a circuit board (not shown), the conductive terminals of the semiconductor die and external electrodes of the circuit board are electrically connected with each other.

摘要翻译： 本发明提供一种封装型半导体器件及其制造方法，其中提高可靠性而不增加制造成本。 树脂层和支撑构件形成在形成有焊盘电极的半导体衬底的顶表面上。 然后，形成穿透树脂层和支撑部件的开口，以露出焊盘电极。 然后在暴露在开口中的焊盘电极上形成金属层，并在其上形成导电端子。 最后，通过切割将半导体衬底分成半导体芯片。 当该半导体器件安装在电路板（未示出）上时，半导体管芯的导电端子和电路板的外部电极彼此电连接。