公开(公告)号：US06534345B1

公开(公告)日：2003-03-18

申请号：US09514265

申请日：2000-02-28

申请人： Simon Muff ,  Jens Pohl ,  Johann Winderl

发明人： Simon Muff ,  Jens Pohl ,  Johann Winderl

IPC分类号： H01L2144

CPC分类号： H01L24/75 ,  H01L21/563 ,  H01L24/743 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082

摘要： In order to mount a semiconductor chip on a carrier layer, consolidated filler material is applied between the semiconductor chip and the carrier layer. The filler material is sucked, under the application of a partial vacuum, from at least one edge section of the semiconductor chip to at least one other edge section of the semiconductor chip. As a result, a package is provided in which the filler material is essentially free of air inclusions.

摘要翻译： 为了将半导体芯片安装在载体层上，固化的填充材料被施加在半导体芯片和载体层之间。 填充材料在部分真空下被从半导体芯片的至少一个边缘部分吸收到半导体芯片的至少另一个边缘部分。 结果，提供了其中填充材料基本上不含空气夹杂物的包装。

公开(公告)号：US06364751B1

公开(公告)日：2002-04-02

申请号：US09546421

申请日：2000-04-10

申请人： Jens Pohl ,  Oliver Wutz ,  Johann Winderl

发明人： Jens Pohl ,  Oliver Wutz ,  Johann Winderl

IPC分类号： B28D104

CPC分类号： H01L21/78 ,  Y10T83/687

摘要： Semiconductor components, which each include at least one semiconductor chip mounted on a common carrier substrate, are singled. The separation is effected by severing of the carrier substrate. The carrier substrate is thereby bent at least in that area of the carrier substrate which is to be severed. The severing takes place beginning from the convexly curved surface of the carrier substrate. In addition, the invention describes a singling device for separating semiconductor components.

摘要翻译： 单独地包括安装在公共载体衬底上的至少一个半导体芯片的半导体元件。 分离通过切断载体基底来实现。 因此，载体基板至少在要被切断的载体基板的那个区域中弯曲。 切断从载体基板的凸曲面开始发生。 此外，本发明描述了用于分离半导体部件的单一设备。

公开(公告)号：US06312962B1

公开(公告)日：2001-11-06

申请号：US09566936

申请日：2000-05-08

申请人： Thomas Münch ,  Jens Pohl ,  Oliver Wutz

发明人： Thomas Münch ,  Jens Pohl ,  Oliver Wutz

IPC分类号： H01L2166

CPC分类号： H01L24/83 ,  H01L24/32 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/00

摘要： A method for COB mounting of electronic chips on a circuit board includes contact connection of connecting wires and substantially whole-area adhesive bonding of a housing. A chip is partially adhesively bonded on a circuit board in such a way that the chip can be contact-connected and can be removed again without damage to the circuit board. Electronic tests or a burn-in process is performed on the chip. The chip, with a given functionality in a manner that is required for application of the circuit board, is fully adhesively bonding.

摘要翻译： 用于将电子芯片COB安装在电路板上的方法包括连接线的接触连接和壳体的基本全面的粘结。 芯片被部分地粘合在电路板上，使得芯片可以被接触连接并且可以再次被去除而不损坏电路板。 在芯片上执行电子测试或老化过程。 具有以电路板的应用所需的方式具有给定功能的芯片完全粘合。

公开(公告)号：US06197550B1

公开(公告)日：2001-03-06

申请号：US09054526

申请日：1998-04-03

申请人： Gertrud Hötten ,  Helge Neidhardt ,  Rolf Bechtold ,  Jens Pohl

发明人： Gertrud Hötten ,  Helge Neidhardt ,  Rolf Bechtold ,  Jens Pohl

IPC分类号： C12N1519

CPC分类号： C07K14/51 ,  A61K38/00 ,  C07K14/495

摘要： The invention provides DNA sequences encoding novel members of the TGF-&bgr; family of proteins. The TGF-&bgr; family comprises proteins which function as growth and/or differentiation factors and which are useful in medical applications. Accordingly, the invention also describes the isolation of the above-mentioned DNA sequences, the expression of the encoded proteins, the production of said proteins and pharmaceutical compositions containing said proteins.

摘要翻译： 本发明提供编码TGF-β蛋白家族的新成员的DNA序列。 TGF-β家族包含用作生长和/或分化因子并且可用于医学应用的蛋白质。 因此，本发明还描述了上述DNA序列的分离，编码蛋白质的表达，所述蛋白质的产生和含有所述蛋白质的药物组合物。

公开(公告)号：US06171584B2

公开(公告)日：2001-01-09

申请号：US09218176

申请日：1998-12-22

申请人： Gertrud Hötten ,  Helge Neidhardt ,  Rolf Bechtold ,  Jens Pohl ,  Michael Paulista

发明人： Gertrud Hötten ,  Helge Neidhardt ,  Rolf Bechtold ,  Jens Pohl ,  Michael Paulista

IPC分类号： A61K3819

CPC分类号： C07K14/495 ,  A61K38/00 ,  C07K14/51 ,  Y10S514/885

摘要： The invention concerns a protein of the TGF-&bgr; family, the DNA coding therefor and a pharmaceutical composition containing such protein.

摘要翻译： 本发明涉及TGF-β家族的蛋白质，其编码的DNA和含有这种蛋白质的药物组合物。

公开(公告)号：US6144088A

公开(公告)日：2000-11-07

申请号：US898734

申请日：1997-07-23

申请人： Jens Pohl ,  Michael Blumenauer ,  Ulrich Vidal

发明人： Jens Pohl ,  Michael Blumenauer ,  Ulrich Vidal

IPC分类号： H01L23/495 ,  H01L23/50 ,  H01L23/28 ,  H01L23/48 ,  H01L29/44

CPC分类号： H01L23/4951 ,  H01L2924/0002

摘要： A leadframe for connection to a semiconductor chip, in particular a metal leadframe, includes a plurality of lead prongs and at least two raised lead surfaces. When a semiconductor module that includes the leadframe and a semiconductor chip is sheathed with plastic, the raised lead surfaces assure a uniform flow of a plastic composition in a mold cavity and thus prevent air from becoming trapped in a plastic package. The lead surfaces are preferably created by folding over tabs in the leadframe. The invention also relates to preliminary stages of the leadframe and to semiconductor components that contain the leadframe of the invention.

摘要翻译： 用于连接到半导体芯片，特别是金属引线框架的引线框架包括多个引线插脚和至少两个凸起引线表面。 当包括引线框和半导体芯片的半导体模块被塑料覆盖时，升高的引线表面确保塑料组合物在模腔中的均匀流动，从而防止空气被捕获在塑料封装中。 引线表面优选通过折叠引线框架中的突出部而形成。 本发明还涉及引线框架和包含本发明引线框架的半导体部件的初步阶段。

公开(公告)号：US6104615A

公开(公告)日：2000-08-15

申请号：US154484

申请日：1998-09-16

申请人： Jens Pohl ,  Simon Muff ,  Michael Schneider

发明人： Jens Pohl ,  Simon Muff ,  Michael Schneider

IPC分类号： H01L25/10 ,  H05K3/30 ,  H05K7/20

CPC分类号： H05K3/301 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2924/0002

摘要： A VSMP semiconductor component is mounted by inserting an auxiliary element into a slot in a receptacle. The auxiliary element projects laterally from a narrow side of the semiconductor component and, as the auxiliary element is inserted into the slot, the semiconductor component is properly positioning on the printed circuit board.

摘要翻译： 通过将辅助元件插入插座中的槽中来安装VSMP半导体部件。 辅助元件从半导体部件的窄边侧向突出，并且当辅助元件插入槽中时，半导体部件正确地定位在印刷电路板上。

公开(公告)号：US08309454B2

公开(公告)日：2012-11-13

申请号：US11746936

申请日：2007-05-10

申请人： Markus Brunnbauer ,  Thorsten Meyer ,  Stephan Bradl ,  Ralf Plieninger ,  Jens Pohl ,  Klaus Pressel ,  Recai Sezi

发明人： Markus Brunnbauer ,  Thorsten Meyer ,  Stephan Bradl ,  Ralf Plieninger ,  Jens Pohl ,  Klaus Pressel ,  Recai Sezi

IPC分类号： H01L21/4763

CPC分类号： H01L25/50 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/60 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1617 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00

摘要： A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also comprises an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically conducting layer being arranged at least on regions of the second main surface, and a molding compound, arranged on the electrically conducting layer.

摘要翻译： 工件具有至少两个半导体芯片，每个半导体芯片具有至少部分暴露的第一主表面和第二主表面。 所述工件还包括布置在所述至少两个半导体芯片上的导电层，所述导电层至少布置在所述第二主表面的区域上，所述模制化合物布置在所述导电层上。

公开(公告)号：US07919857B2

公开(公告)日：2011-04-05

申请号：US11867132

申请日：2007-10-04

申请人： Michael Bauer ,  Peter Strobel ,  Jens Pohl ,  Christian Stuempfl ,  Ludwig Heitzer

发明人： Michael Bauer ,  Peter Strobel ,  Jens Pohl ,  Christian Stuempfl ,  Ludwig Heitzer

IPC分类号： H01L23/06 ,  H01L23/552 ,  H01L21/00

CPC分类号： G01L19/0069 ,  G01L19/147 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00

摘要： A plastic housing includes plastic external faces and the underside of the plastic housing comprises external contact areas on which external contacts are arranged. The plastic external faces are covered by a closed metal layer apart from the underside, wherein the boundary layer between plastic external faces and the closed metal layer includes exposed electrically conductive inclusions of the plastic of the housing.

摘要翻译： 塑料外壳包括塑料外表面，并且塑料外壳的下侧包括外部接触区域，外部接触件布置在其上。 塑料外表面被与下侧隔开的封闭金属层覆盖，其中塑料外表面和封闭金属层之间的边界层包括外壳的塑料的露出的导电夹杂物。

公开(公告)号：US20100237506A1

公开(公告)日：2010-09-23

申请号：US12408110

申请日：2009-03-20

申请人： Markus Brunnbauer ,  Jens Pohl ,  Thorsten Meyer

发明人： Markus Brunnbauer ,  Jens Pohl ,  Thorsten Meyer

IPC分类号： H01L23/498 ,  H01L21/768 ,  H01L21/50

CPC分类号： H01L24/11 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49816 ,  H01L23/525 ,  H01L23/528 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/13 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/02375 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/1132 ,  H01L2224/12105 ,  H01L2224/13111 ,  H01L2224/19 ,  H01L2224/2105 ,  H01L2224/22 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/01028 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2924/00014 ,  H01L2224/29599 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/05552

摘要： A semiconductor device and manufacturing method. One embodiment provides a device including a semiconductor chip. A first conductor line is placed over the semiconductor chip. An external contact pad is placed over the first conductor line. At least a portion of the first conductor line lies within a projection of the external contact pad on the semiconductor chip.

摘要翻译： 半导体器件及其制造方法。 一个实施例提供了包括半导体芯片的装置。 第一导线被放置在半导体芯片上。 外部接触垫放置在第一导体线上。 第一导体线的至少一部分位于半导体芯片上的外部接触焊盘的突出部内。