公开(公告)号：US11532568B2

公开(公告)日：2022-12-20

申请号：US16931180

申请日：2020-07-16

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Wen-Jung Tsai ,  Yu-Wei Yeh ,  Tsung-Hsien Tsai ,  Chi-Liang Shih ,  Sheng-Ming Yang ,  Ping-Hung Liao

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.

公开(公告)号：US20210005524A1

公开(公告)日：2021-01-07

申请号：US16793667

申请日：2020-02-18

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Chiang He ,  Yu-Wei Yeh ,  Chia-Yang Chen ,  Chih-Yi Liao ,  Chih-Hsien Chiu ,  Chang-Chao Su

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L21/768 ,  H01L23/498 ,  H01L23/538

Abstract: An electronic structure and a method for fabricating the same are provided. An electronic component and conductive elements are disposed on a carrier. An encapsulation layer encapsulates the electronic component and the conductive elements. The encapsulation layer has concave portions corresponding in position to the conductive elements. Each of the conductive elements is in no contact with corresponding one of the concave portions.

公开(公告)号：US10818515B2

公开(公告)日：2020-10-27

申请号：US16196503

申请日：2018-11-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yu-Wei Yeh ,  Yen-Hung Lin ,  Chih-Yi Liao ,  Chih-Hsien Chiu

IPC: H01L21/48 ,  H01L23/538 ,  H01L23/31 ,  H01L21/56 ,  H01L25/065 ,  H01L23/00

Abstract: The present disclosure provides an electronic package and a method for fabricating the same. A protective layer is formed on a carrier of the electronic component. The electronic component and the protective layer are covered by a covering layer. A through hole is formed in the covering layer and extends through the protective layer, such that a portion of a surface of the carrier is exposed to the through hole. A conductive structure is disposed in the through hole and electrically connected with the carrier. Through the formation of the protective layer, the buffering effect of the protective layer can prevent the laser from directly burning through the covering layer and the protective layer to avoid damages to the carrier.

公开(公告)号：US10587037B2

公开(公告)日：2020-03-10

申请号：US14107446

申请日：2013-12-16

Applicant: Siliconware Precision Industries Co., Ltd

Inventor： Chih-Hsien Chiu ,  Heng-Cheng Chu ,  Chien-Cheng Lin ,  Tsung-Hsien Tsai ,  Chao-Ya Yang ,  Yude Chu

IPC: H01Q1/38 ,  H01Q1/22 ,  H01Q9/04 ,  H01Q1/24

Abstract: An electronic package structure is provided, including a substrate, a package encapsulant disposed on the substrate, and an antenna structure corresponding to a disposing area of the package encapsulant and having a first extension layer, a second extension layer disposed on the substrate, and a connection portion disposed between and electrically connected to the first extension layer and the second extension layer. Through the formation of the antenna structure on the disposing area of the package encapsulant, the substrate is not required to be widen, and, as such, the electronic package structure meets the miniaturization requirement.

公开(公告)号：US10410970B1

公开(公告)日：2019-09-10

申请号：US15993108

申请日：2018-05-30

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen

IPC: H01L23/552 ,  H01L23/538 ,  H01L23/00 ,  H01L25/10 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00 ,  H01L23/31

Abstract: An electronic package is provided. An electronic component and a plurality of conductive pillars are provided on a carrier structure. An encapsulation layer encapsulates the electronic component and the conductive pillars. Each of the conductive pillars has a peripheral surface narrower than two end surfaces of the conductive pillar. Therefore, the encapsulation layer is better bonded to the conductive pillars. A method for fabricating the electronic package is also provided.

公开(公告)号：US10199731B2

公开(公告)日：2019-02-05

申请号：US15455664

申请日：2017-03-10

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Heng-Cheng Chu ,  Cheng-Yu Chiang

IPC: H01Q1/38 ,  H01Q9/04 ,  H01Q1/40

Abstract: An electronic component is provided, which includes a substrate having opposite first and second surfaces and an antenna structure combined with the substrate. The antenna structure has at least a first extending portion disposed on the first surface of the substrate, at least a second extending portion disposed on the second surface of the substrate, and a plurality of connecting portions disposed in the substrate for electrically connecting the first extending portion and the second extending portion. Any adjacent ones of the connecting portions are connected through one of the first extending portion and the second extending portion. As such, the antenna structure becomes three-dimensional. The present invention does not need to provide an additional region on the substrate for disposing the antenna structure, thereby reducing the width of the substrate so as to meet the miniaturization requirement of the electronic component.

公开(公告)号：US10074621B2

公开(公告)日：2018-09-11

申请号：US15181489

申请日：2016-06-14

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chi-Pin Tsai ,  Chi-Liang Shih ,  Ming-Fan Tsai ,  Chia-Yang Chen

IPC: H01L23/48 ,  H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/66 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48106 ,  H01L2224/48195 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48265 ,  H01L2224/49171 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: Provided is an electronic package, including: a carrier, an electronic component disposed on the carrier, and an antenna structure, wherein the antenna structure has a plurality of spacing members and at least one wire connected among the spacing members. No additional layout area is required to be formed on a surface of the carrier, such that the objective of miniaturization can be achieved.

公开(公告)号：US20180247886A1

公开(公告)日：2018-08-30

申请号：US15590174

申请日：2017-05-09

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Tsung-Hsien Tsai ,  Hsin-Lung Chung ,  Chen-Wen Huang ,  Fang-Hsien Shen

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/56

Abstract: The disclosure provides a method for manufacturing an electronic package structure, including disposing on a carrier an electronic component and a conductive frame including a plurality of conductive pads and supporting parts; and covering the electronic component and the supporting parts of the conductive frame with an encapsulating layer while allowing the conductive pads to be exposed from the encapsulating layer, thereby increasing the efficiency and reducing the cost of manufacturing processes with the design of the conductive frame. The disclosure further provides the electronic package structure as described above.

公开(公告)号：US20180047711A1

公开(公告)日：2018-02-15

申请号：US15352942

申请日：2016-11-16

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chi-Liang Shih ,  Jia-Huei Hung ,  Chia-Yang Chen ,  Yueh-Chiung Chang

IPC: H01L25/10 ,  H01L23/538 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L25/105 ,  H01L23/49833 ,  H01L23/5385 ,  H01L24/16 ,  H01L24/48 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electronic stack structure is provided, including a first substrate, a second substrate stacked on the first substrate through a plurality of passive elements, and an electronic element disposed on at least one of the first substrate and the second substrate. As such, the distance between the first substrate and the second substrate is defined by the height and size of the passive elements. The present disclosure further provides a method for fabricating the electronic stack structure.

公开(公告)号：US20170236787A1

公开(公告)日：2017-08-17

申请号：US15584281

申请日：2017-05-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Hao-Ju Fang ,  Hsin-Lung Chung ,  Cho-Hsin Chang ,  Tsung-Hsien Tsai ,  Chia-Yang Chen ,  Chun-Chi Ke

IPC: H01L23/552 ,  H01L23/00 ,  H01L21/48 ,  H01L25/065 ,  H01L21/78 ,  H01L23/16 ,  H01L23/31 ,  H01L21/56 ,  H01L21/54

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/54 ,  H01L21/561 ,  H01L21/563 ,  H01L21/78 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into a plurality of package units, each of which has at least one of the semiconductor components; and a metal layer formed on the substrate and the encapsulant and encapsulating a periphery of the package units, with the second surface exposed from the metal layer, wherein the metal layer is formed along a wall surface of the first groove, to form a second groove corresponding in position to the first groove and having a metal surface. Therefore, the package units are isolated and form a multilayer isolated structure, including metal layers and air layers, and are electromagnetically shielded from one another.