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    EARPHONE
    63.
    发明公开
    EARPHONE 审中-公开

    公开(公告)号：US20230254967A1

    公开(公告)日：2023-08-10

    申请号：US18300011

    申请日：2023-04-13

    Applicant: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.

    Inventor： Guozhen SUN

    IPC: H05K1/02 ,  H05K1/11 ,  H04R1/10

    CPC classification number: H05K1/0243 ,  H04R1/1016 ,  H04R1/1041 ,  H04R1/1058 ,  H05K1/111 ,  H04R2420/07 ,  H05K2201/1006 ,  H05K2201/10098

    Abstract: The earphone includes a first circuit board, a radio frequency (RF) transceiver, and an antenna. The first circuit board is provided with a first RF circuit. The RF transceiver is on the first circuit board. The RF transceiver is electrically connected with the first RF circuit. The first RF circuit is electrically connected with the antenna. The first circuit board has a reserved region. A surface acoustic wave (SAW) filter or a replacement resistor is disposed in the reserved region. The first RF circuit is electrically connected with the SAW filter or the replacement resistor which is disposed in the reserved region.

    HIGH-FREQUENCY ELECTRONIC COMPONENT
    64.
    发明公开
    HIGH-FREQUENCY ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20230225049A1

    公开(公告)日：2023-07-13

    申请号：US18174166

    申请日：2023-02-24

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Hirofumi OIE ,  Ikuo DEGUCHI

    IPC: H05K1/03 ,  H05K3/46 ,  H05K3/34

    CPC classification number: H05K1/0306 ,  H05K3/4652 ,  H05K3/3442 ,  H05K2201/1006

    Abstract: A high-frequency electronic component includes a ceramic multilayer substrate, ground electrodes provided at different layers of the ceramic multilayer substrate, and a shielding film covering at least a side surface among surfaces of the ceramic multilayer substrate. Two or more of the ground electrodes are exposed to the side surface of the ceramic multilayer substrate but do not protrude from this side surface, and are electrically connected to the shielding film. On the side surface of the ceramic multilayer substrate, the two or more of the ground electrodes at least partially overlap each other in a thickness direction of the ceramic multilayer substrate, with a distance in the thickness direction between the overlapping ground electrodes being 5 μm or greater.

    Dual-spiral common-mode filter
    66.
    发明授权
    Dual-spiral common-mode filter 有权

    公开(公告)号：US11659650B2

    公开(公告)日：2023-05-23

    申请号：US17180779

    申请日：2021-02-20

    Applicant: Western Digital Technologies, Inc.

    Inventor： Antonio Ciccomancini Scogna ,  Xinzhi Xing

    IPC: H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H01P3/02 ,  H01P1/203

    CPC classification number: H05K1/0245 ,  H01P1/20381 ,  H01P3/026 ,  H05K1/111 ,  H05K3/4644 ,  H05K2201/09236 ,  H05K2201/1006

    Abstract: Disclosed herein are dual-spiral common-mode filters, printed circuit boards (PCBs) comprising such dual-spiral common-mode filters, and devices comprising such dual-spiral common-mode filters and PCBs. A dual-spiral common-mode filter is patterned into the reference plane of a PCB. The dual-spiral common-mode filter comprises a first spiral portion connected to a second spiral portion. The spiral portions may be substantially identical, or mirror images of each other, or different from each other. One or more signal traces in a signal trace layer of the PCB pass over the dual-spiral common-mode filter. The disclosed dual-spiral common-mode filters can replace both conventional patterned ground structure (PGS) filters used for radio-frequency interference mitigation and the cutouts often used in the reference plane of a PCB to mitigate impedance mismatches due to DC blocking capacitors. Also disclosed herein are methods of making PCBs that include dual-spiral common-mode filters.

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