公开(公告)号：US20120190217A1

公开(公告)日：2012-07-26

申请号：US13244644

申请日：2011-09-25

Applicant: Ting-Cheng Tseng

Inventor： Ting-Cheng Tseng

IPC: H01R9/03 ,  H01R12/00 ,  H01R4/28 ,  H01R13/64

CPC classification number: H01R9/034 ,  H01R12/724 ,  H01R12/88 ,  H01R13/639 ,  H01R13/6471 ,  H01R13/6592 ,  H01R13/6658 ,  H05K1/117 ,  H05K3/32 ,  H05K2201/10356

Abstract: A connector and a connector assembly are provided by the invention. The connector includes a main body formed by a printed circuit board and a plurality of cables. The printed circuit board has a surface conductive trace layer, an inner insulation layer, a ground layer and a surface insulation layer. The surface conductive trace layer has a conductive trace pattern comprising a plurality of contacting-end pattern portions and a plurality of bonding pad portions. The inner insulation layer is located on the surface conductive trace layer. The ground layer is located on the inner insulation layer. The surface insulation layer overlays the ground layer and exposes out a part of the ground layer. The cables are electrically connected to the bonding pad portions of the conductive trace patterns.

Abstract translation: 本发明提供连接器和连接器组件。 连接器包括由印刷电路板和多根电缆形成的主体。 印刷电路板具有表面导电迹线层，内部绝缘层，接地层和表面绝缘层。 表面导电迹线层具有包括多个接触端图案部分和多个接合焊盘部分的导电迹线图案。 内绝缘层位于表面导电迹线层上。 接地层位于内绝缘层上。 表面绝缘层覆盖接地层并露出一部分接地层。 电缆电连接到导电迹线图案的接合焊盘部分。

公开(公告)号：US08115107B2

公开(公告)日：2012-02-14

申请号：US12195928

申请日：2008-08-21

Applicant: Arash Behziz

Inventor： Arash Behziz

IPC: H01R9/05 ,  H01R12/53

CPC classification number: H05K1/0243 ,  H01R9/0515 ,  H01R43/0221 ,  H01R43/205 ,  H05K3/301 ,  H05K3/328 ,  H05K3/3421 ,  H05K2201/09809 ,  H05K2201/1031 ,  H05K2201/10356 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Methods and apparatus are provided for securely and cost effectively attaching one or more shielded cables to a planar substrate. A cable assembly includes a printed circuit board (PCB) coupled to a distal end of the one or more shielded cables. Perpendicular alignment of the distal cable ends promotes a dense array that is achieved using angular mounting brackets for coupling cable shields to electrical contacts on an engagement surface of the PCB. Mounting brackets are attached between the cable shield and shield contacts using electrically conductive attachment techniques including soldering and laser welding. The PCB also includes one or more signal contacts for each cable. Distal ends of the internal conductors are each bent about 90 degrees from the vertical cable axis to align with the horizontal engagement surface. Internal conductors are surface mounted to their respective signal contact using one or more of soldering and laser welding.

Abstract translation: 提供了方法和装置，用于将一个或多个屏蔽电缆安全且成本有效地连接到平面基板。 电缆组件包括耦合到一个或多个屏蔽电缆的远端的印刷电路板（PCB）。 远端电缆端部的垂直对准促进了使用角度安装支架实现的密集阵列，用于将电缆屏蔽件耦合到PCB接合表面上的电触点。 使用导电附件技术（包括焊接和激光焊接）将安装支架连接在电缆屏蔽和屏蔽触点之间。 PCB还包括每个电缆的一个或多个信号触点。 内部导体的末端各自从垂直电缆轴线弯曲约90度，以与水平接合表面对准。 使用焊接和激光焊接中的一个或多个将内部导体表面安装到它们各自的信号触点。

公开(公告)号：US20110247195A1

公开(公告)日：2011-10-13

申请号：US13167902

申请日：2011-06-24

Applicant: Henning Braunisch ,  Kemal Aygun

Inventor： Henning Braunisch ,  Kemal Aygun

IPC: H01S4/00

CPC classification number: H05K1/0243 ,  H01L23/367 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0657 ,  H01L25/16 ,  H01L2223/6622 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K1/182 ,  H05K3/222 ,  H05K2201/10356 ,  H05K2201/10492 ,  H05K2201/10704 ,  Y10T29/49002 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A multimode system with at least two end points may include a multimode signaling path that, in some embodiments, is a multimode cable or a multimode board and is pluggably connectable to packages at each end point. Each end point may include a processor die package coupled to a socket. The socket may also receive a connector that couples the cable to the package. Power supply signals and input/output signals may be decoupled at each end point.

Abstract translation: 具有至少两个端点的多模系统可以包括在一些实施例中是多模电缆或多模板并且可插​​拔地连接到每个端点处的封装的多模信令路径。 每个端点可以包括耦合到插座的处理器管芯封装。 插座还可以接收将电缆耦合到封装的连接器。 电源信号和输入/输出信号可以在每个端点去耦。

公开(公告)号：US07948762B2

公开(公告)日：2011-05-24

申请号：US12027751

申请日：2008-02-07

Applicant: Marta Castillo Garcia ,  Miguel Angel Herrero Perez

Inventor： Marta Castillo Garcia ,  Miguel Angel Herrero Perez

IPC: H05K1/00

CPC classification number: H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/053 ,  H05K2201/058 ,  H05K2201/1028 ,  H05K2201/10356

Abstract: Wiring system which comprises: a flexible printed circuit board (1) with a surface (2) in turn comprising one or more electrical circuits formed by conductive strips (4) and a plurality of electronic components (5) connected to said conductive strips (4) and with at least one extension or branch (6) extending directly from said surface (2) and also comprising conductive strips (7); characterized in that it further comprised: at least one flexible flat cable (8) joined to said at least one extension or branch (6), such that an electrical connection is formed between said flexible flat cable (8) and said extension or branch (6). A vehicle door which internally comprises this wiring system.

Abstract translation: 一种布线系统，包括：具有表面（2）的柔性印刷电路板（1），其又包括由导电条（4）形成的一个或多个电路和连接到所述导电条（4）的多个电子元件（5） ）和至少一个从所述表面（2）直接延伸并且还包括导电条（7）的延伸部分（6）; 其特征在于，还包括：连接到所述至少一个延伸部或分支（6）的至少一个柔性扁平电缆（8），使得在所述柔性扁平电缆（8）和所述延伸部或分支（6）之间形成电连接 6）。 内部包括该接线系统的车门。

公开(公告)号：US20110108427A1

公开(公告)日：2011-05-12

申请号：US13008849

申请日：2011-01-18

Applicant: Charan Gurumurthy ,  Sanka Ganesan ,  Chandrashekar Ramaswamy ,  Mark Hlad

Inventor： Charan Gurumurthy ,  Sanka Ganesan ,  Chandrashekar Ramaswamy ,  Mark Hlad

IPC: C25D5/02

CPC classification number: H01L23/48 ,  H01L23/49827 ,  H01L24/16 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K1/113 ,  H05K3/00 ,  H05K3/108 ,  H05K3/222 ,  H05K3/426 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2201/1053 ,  H05K2201/10734 ,  H05K2203/167 ,  Y10T29/49124 ,  H01L2224/0401

Abstract: An assembly of substrate packages interconnected with flex cables and a method of fabrication of the substrate package. The assembly allows input/output (I/O) signals to be speedily transmitted between substrate packages via flex cable and without being routed through the motherboard. Embodiments relate to a substrate package providing separable inter-package flex cable connection. Hermetically-sealed guiding through holes are provided on the substrate package as a mechanical alignment feature to guide connection between flex cables and high speed I/O contact pads on the substrate package. Embodiments of the method of fabrication relate to simultaneously forming hermetically-sealed guiding through holes and I/O contact pads.

Abstract translation: 与柔性电缆互连的衬底封装的组件和衬底封装的制造方法。 该组件允许通过柔性电缆快速地在衬底封装之间传输输入/输出（I / O）信号，而不通过主板。 实施例涉及提供可分离的包装间柔性电缆连接的衬底封装。 在基板封装上提供密封导向孔，作为机械对准特征，以引导柔性电缆与基板封装上的高速I / O接触焊盘之间的连接。 制造方法的实施例涉及同时形成密封的引导通孔和I / O接触垫。

公开(公告)号：US20110080719A1

公开(公告)日：2011-04-07

申请号：US12965530

申请日：2010-12-10

Applicant: Gongxian JIA

Inventor： Gongxian JIA

IPC: H05K1/14 ,  H01R13/02

CPC classification number: H05K1/14 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01R12/52 ,  H05K1/0237 ,  H05K3/222 ,  H05K3/366 ,  H05K3/4046 ,  H05K3/429 ,  H05K2201/044 ,  H05K2201/09809 ,  H05K2201/10189 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2203/1572 ,  Y10T29/49139 ,  H01L2224/0401

Abstract: A circuit board interconnection system is disclosed according to the embodiments of the present invention. The system includes a first circuit board, a second circuit board, a third circuit board, a first connector and a second connector. The first connector and the second connector are mounted at two sides of the first circuit board respectively so that the second circuit board mounted on the first connector is perpendicular to the third circuit board on the second connector. The first connector and the second connector mounted respectively at two sides of the first circuit board are coupled to each other via an impedance controlled mechanism on the first circuit board. Another circuit board interconnection system, a circuit board, a connector assembly and a method for manufacturing a circuit board are disclosed according to the present invention. The circuit board adopts the impedance controlled mechanism which has a shielding function and an impedance controlled function to replace a via hole on the existing circuit board where the via hole has an uncontrollable resistance.

Abstract translation: 根据本发明的实施例公开了一种电路板互连系统。 该系统包括第一电路板，第二电路板，第三电路板，第一连接器和第二连接器。 第一连接器和第二连接器分别安装在第一电路板的两侧，使得安装在第一连接器上的第二电路板垂直于第二连接器上的第三电路板。 分别安装在第一电路板两侧的第一连接器和第二连接器通过第一电路板上的阻抗控制机构相互耦合。 根据本发明公开了另一电路板互连系统，电路板，连接器组件和用于制造电路板的方法。 电路板采用具有屏蔽功能和阻抗控制功能的阻抗控制机构来代替现有电路板上通孔具有不可控电阻的通孔。

公开(公告)号：US07813708B2

公开(公告)日：2010-10-12

申请号：US11829294

申请日：2007-07-27

Applicant: Toshihiko Inaba ,  Takumi Suzuki ,  Shozo Miyamoto

Inventor： Toshihiko Inaba ,  Takumi Suzuki ,  Shozo Miyamoto

IPC: H04B1/18 ,  H04K3/00

CPC classification number: H04B1/18 ,  H03J1/0008 ,  H03J5/26 ,  H05K1/0243 ,  H05K3/3405 ,  H05K3/3447 ,  H05K2201/09809 ,  H05K2201/09954 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2201/10446

Abstract: An RF input portion is formed on a printed circuit board and is operable to input a high-frequency signal received by an antenna device. An electronic component is mounted on the printed circuit and is operable to process the input high-frequency signal. The RF input portion has a specific pattern adapted to be electrically interchangeably connectable with a plurality of types of connections.

Abstract translation: RF输入部分形成在印刷电路板上，并可操作以输入由天线装置接收的高频信号。 电子元件安装在印刷电路上，可操作以处理输入的高频信号。 RF输入部分具有适于与多种类型的连接电可互换地连接的特定模式。

公开(公告)号：US07752788B1

公开(公告)日：2010-07-13

申请号：US12479865

申请日：2009-06-08

Applicant: Zheng-Heng Sun

Inventor： Zheng-Heng Sun

IPC: H01R3/00

CPC classification number: H01R13/465 ,  H01R12/716 ,  H05K1/0266 ,  H05K2201/09936 ,  H05K2201/10189 ,  H05K2201/10356

Abstract: A cable connector includes a base formed on a circuit board, a plurality of pins extending from the base and electrically connected to the circuit board, and a signal type indicator. A plurality of through holes is defined in the signal type indicator to receive the pins, and an emblem is arranged on the signal type indicator to indicate the signal type of the cable connector. The diameter of each through hole is greater than the diameter of each pin so that the pins can pass through the through holes of the signal type indicator for mounting the signal type indicator on the base.

Abstract translation: 电缆连接器包括形成在电路板上的基座，从基座延伸并电连接到电路板的多个引脚和信号型指示器。 在信号型指示器中限定多个通孔以接收引脚，并且在信号类型指示器上布置标志以指示电缆连接器的信号类型。 每个通孔的直径大于每个销的直径，使得销可以穿过信号类型指示器的通孔，以将信号类型指示器安装在基座上。

公开(公告)号：US07690930B2

公开(公告)日：2010-04-06

申请号：US12253623

申请日：2008-10-17

Applicant: Hubert Chen ,  Ascanio Orlandini

Inventor： Hubert Chen ,  Ascanio Orlandini

IPC: H01R12/00

CPC classification number: H01R9/038 ,  H01R12/62 ,  H01R43/0256 ,  H05K1/0243 ,  H05K1/141 ,  H05K3/3405 ,  H05K3/341 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09809 ,  H05K2201/10356 ,  H05K2203/0455

Abstract: A direct galvanic connection between a cable, having a preferred flat cross-section, and an electronic Printed Circuit Board (“Target PCB”) (228) by means of an intermediate PCB (“Interconnection PCB”) (200) allowing an impedance matched and length balanced electrical connection is described, thus offering ideal conditions for high speed and high frequency data connections. At the same time, the connection allows to keep the flexibility of a modular production and assembly workflow, typical of the use of well known connectors.

Abstract translation: 具有优选平坦横截面的电缆与电子印刷电路板（“目标PCB”）（228）之间的直接电连接通过中间PCB（“互连PCB”）（200）允许阻抗匹配 并描述了长度平衡的电气连接，从而为高速和高频数据连接提供了理想的条件。 同时，连接允许保持模块化生产和组装工作流程的灵活性，这通常是使用众所周知的连接器。

公开(公告)号：US07670147B1

公开(公告)日：2010-03-02

申请号：US12252421

申请日：2008-10-16

Applicant: Leo Lee

Inventor： Leo Lee

IPC: H01R12/00

CPC classification number: H01R13/6658 ,  H01R13/6625 ,  H05K1/0231 ,  H05K1/0234 ,  H05K1/117 ,  H05K1/162 ,  H05K2201/09236 ,  H05K2201/10022 ,  H05K2201/10356

Abstract: A capacitance circuit board signal-adjusting device, and more particularly, a signal adjusting device capable of increasing the clarity of a high frequency signal; the signal adjusting device includes a circuit board disposed in a connector, a plurality of transmission circuits disposed on the circuit board, one side of the transmission circuit is a signal input terminal and another side thereof is a signal out terminal; it is characterized in that a copper foil in the middle section of transmission circuit is planned in advance to generate a capacitor naturally by breaking off a slit; the capacitor including two parallel sections arranged distantly side by side, a medium disposed between the two parallel sections and two breaches disposed in two directions opposite to each other at two diagonal ends. Whereby, the capacitor naturally generated in the circuit board plus a resistor connected thereto in parallel can constitute a signal filter; it can reduce components, shorten the manufacturing process, reduce the cost and achieve the good signal adjustment effect while being put into practice.

Abstract translation: 一种电容电路板信号调节装置，特别是能够提高高频信号清晰度的信号调整装置。 信号调节装置包括设置在连接器中的电路板，设置在电路板上的多个发送电路，发送电路的一侧是信号输入端子，另一侧是信号输出端子; 其特征在于，预先计划传输电路中间部分的铜箔，通过切断狭缝自然产生电容器; 电容器包括彼此远离并排设置的两个平行部分，设置在两个平行部分之间的介质和在两个对角端部彼此相对设置的两个突出部分。 由此，电路板中自然产生的电容加上并联的电阻器可以构成信号滤波器; 可以减少组件，缩短生产过程，降低成本，实现良好的信号调节效果。