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71.发明授权Method of producing a land grid array (LGA) interposer utilizing metal-on-elastomer 有权利用金属弹性体制造平面栅格阵列（LGA）插入器的方法公开(公告)号：US08752284B2
公开(公告)日：2014-06-17
申请号：US12047552
申请日：2008-03-13
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.
摘要翻译： 一种制造包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入件的方法。 插入件在横截面中具有半环形结构，并由介电弹性体材料构成。 多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触 飞机
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公开(公告)号：US08505200B2
公开(公告)日：2013-08-13
申请号：US12208581
申请日：2008-09-11
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R43/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A method of producing a module arrangement which includes a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.
摘要翻译： 一种制造模块装置的方法，其包括包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入器。 插入件在横截面中具有半环形结构，并由介电弹性体材料构成。 多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触 飞机
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公开(公告)号：US08493746B2
公开(公告)日：2013-07-23
申请号：US12704592
申请日：2010-02-12
申请人： Charles L. Arvin , Alexandre Blander , Peter J. Brofman , Donald W. Henderson , Gareth G. Hougham , Hsichang Liu , Eric D. Perfecto , Srinivasa S. N. Reddy , Krystyna W. Semkow , Kamalesh K. Srivastava , Brian R. Sundlof , Julien Sylvestre , Renee L. Weisman
发明人： Charles L. Arvin , Alexandre Blander , Peter J. Brofman , Donald W. Henderson , Gareth G. Hougham , Hsichang Liu , Eric D. Perfecto , Srinivasa S. N. Reddy , Krystyna W. Semkow , Kamalesh K. Srivastava , Brian R. Sundlof , Julien Sylvestre , Renee L. Weisman
CPC分类号： H01B1/02 , B23K35/0244 , B23K35/262 , B23K35/36 , B23K35/3602 , B82Y30/00 , C22C13/00 , H01B13/00 , H01L23/49866 , H01L2924/0002 , H05K3/3436 , H05K3/3463 , H05K2201/0209 , H05K2201/0257 , Y10T29/49117 , H01L2924/00
摘要： In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.
摘要翻译： 在本发明的一个实施方案中，将尺寸为1nm至1000nm的惰性纳米尺寸颗粒加入到焊球中。 惰性纳米尺寸颗粒可以包括金属氧化物，金属氮化物，金属碳化物，金属硼化物等。惰性纳米尺寸颗粒可以是单一化合物，或者可以是具有不同材料的涂层的金属材料。 在本发明的另一个实施方案中，将少量与锡形成稳定的高熔点金属间化合物的元素金属添加到焊料球中。 添加的至少一种元素金属与锡形成金属间化合物的沉淀物，其作为细颗粒分散在焊料中。
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公开(公告)号：US08341834B2
公开(公告)日：2013-01-01
申请号：US12275563
申请日：2008-11-21
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H05K3/36
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. A plurality of slots are formed in the sidewall of said interposer for the venting of gases and pressure therethrough.
摘要翻译： 一种制造包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入件的方法。 插入件在横截面中具有半环形结构，并由介电弹性体材料构成。 多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触 飞机 在所述插入器的侧壁中形成多个槽，用于排出气体和通过其中的压力。
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公开(公告)号：US20120259072A1
公开(公告)日：2012-10-11
申请号：US13083803
申请日：2011-04-11
申请人： Gareth G. Hougham , Xiao H. Liu
发明人： Gareth G. Hougham , Xiao H. Liu
IPC分类号： C08L63/00
CPC分类号： C08L63/00 , B32B7/02 , B32B7/12 , B32B9/005 , B32B9/04 , B32B15/043 , B32B27/281 , B32B2250/02 , B32B2250/24 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08K7/00 , C08K2201/002 , Y10T428/249953 , Y10T428/249967 , Y10T428/249969 , Y10T428/24997 , Y10T428/249975 , Y10T428/249981 , Y10T428/249987 , Y10T428/249991
摘要： Bilayer platelet fillers are employed to compensate for a positive coefficient of thermal expansion (CTE) of an embedding polymeric material, or even to provide a composite structure having a negative CTE to eliminate or alleviate thermomechanical stress and/or delamination during thermal cycling. A bilayer platelet includes two joined layers having different CTEs. The CTE mismatch induces bending of the bilayer platelets, thereby causing cavities at temperatures lower than the joining temperature at which the bilayers are joined. The decrease in the volume of the polymeric material and the bilayer platelets at low temperatures is compensated by an accompanying increase in the volume of the cavities so that the composite structure has a temperature independent volume, a low net CTE, or even a negative CTE.
摘要翻译： 双层血小板填料用于补偿嵌入聚合材料的正热膨胀系数（CTE），或甚至提供具有负CTE的复合结构以消除或减轻热机械应力和/或热循环期间的分层。 双层血小板包括具有不同CTE的两个接合层。 CTE不匹配引起双层片晶的弯曲，从而在低于双层结合的接合温度的温度下引起空腔。 聚合物材料和双层血小板在低温下体积的减少通过伴随空腔体积的增加来补偿，使得复合结构具有不依赖于温度的体积，低净CTE或甚至负的CTE。
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76.发明授权公开(公告)号：US08138448B2
公开(公告)日：2012-03-20
申请号：US11967459
申请日：2007-12-31
CPC分类号： B32B37/144 , B32B38/1866 , B32B2311/24 , Y10T428/249971 , Y10T428/2982
摘要： Methods for the fabrication of negative coefficient thermal expansion engineered elements, and particularly, wherein such elements provide for fillers possessing a low or even potentially zero coefficient thermal expansion and which are employable as fillers for polymers possessing high coefficients of thermal expansion. Further, disclosed are novel structures, which are obtained by the inventive methods.
摘要翻译： 用于制造负系数热膨胀工程元件的方法，特别地，其中这些元件提供具有低或甚至潜在的零系数热膨胀的填料，并且其可用作具有高热膨胀系数的聚合物的填料。 此外，公开了通过本发明方法获得的新颖结构。
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公开(公告)号：US07975379B2
公开(公告)日：2011-07-12
申请号：US12462985
申请日：2009-08-11
申请人： Gareth G. Hougham , Brian S. Beaman , John S. Corbin , Paul Coteus , Shawn A. Hall , Kathleen C. Hinge , Theron L. Lewis , Frank R. Libsch , Amanda E. E. Mikhail
发明人： Gareth G. Hougham , Brian S. Beaman , John S. Corbin , Paul Coteus , Shawn A. Hall , Kathleen C. Hinge , Theron L. Lewis , Frank R. Libsch , Amanda E. E. Mikhail
IPC分类号： H01R9/00
CPC分类号： H05K3/368 , H01R12/52 , H01R12/714 , H05K1/0269 , H05K3/325 , H05K2201/10378 , Y10T29/49117 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149
摘要： LGA connectors are fabricated with buttons or spring contacts preformed to different heights to accommodate the initial topography of a typical module or PCB of a particular product type. This is accomplished during fabrication by measuring topographies of mating surfaces of a first electronic device and of a second electronic device; fabricating interposer contacts to form opposing non-planar sides having respective inverse topographies for contacting the mating surfaces; and sandwiching the interposer between the first and second electronic devices with the opposing sides in contact with respective mating surfaces.
摘要翻译： LGA连接器采用预制到不同高度的按钮或弹簧触点制成，以适应特定产品类型的典型模块或PCB的初始形貌。 这是通过测量第一电子装置和第二电子装置的配合表面的形貌来制造的; 制造内插器触点以形成具有用于接触配合表面的相应反向形状的相对非平面侧; 并且将所述插入件夹在所述第一和第二电子设备之间，所述相对侧与相应的配合表面相接触。
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78.发明授权Method of forming a land grid array (LGA) interposer arrangement utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries 有权使用金属弹性体半环和其他多点接触几何形成地面栅格阵列（LGA）插入器布置的方法公开(公告)号：US07832095B2
公开(公告)日：2010-11-16
申请号：US12127432
申请日：2008-05-27
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.
摘要翻译： 一种制造包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入件的方法。 插入件在横截面中具有半环形结构，并由介电弹性体材料构成。 多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触 飞机
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79.发明申请LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-TORUS AND OTHER MULTIPLE POINTS OF CONTACT GEOMETRIES 有权土地网阵列（LGA）利用金属激光器热电偶和其他多点接触几何公开(公告)号：US20100000085A1
公开(公告)日：2010-01-07
申请号：US12047694
申请日：2008-03-13
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H05K3/10
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A method of producing a module arrangement which includes a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.
摘要翻译： 一种制造模块装置的方法，其包括包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入器。 插入件在横截面中具有半环形结构，并由介电弹性体材料构成。 多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触 飞机
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80.发明授权Land grid array interposer (LGA) utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries that is constituted of a moldable dielectric elastometric material 失效利用金属弹性体半环和其他多点接触几何构成的Land Grid阵列插入器（LGA），其由可模制的介电弹性材料构成公开(公告)号：US07641479B2
公开(公告)日：2010-01-05
申请号：US12047664
申请日：2008-03-13
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R12/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.
摘要翻译： 一种制造包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入件的方法。 插入件在横截面中具有半环形结构，并由介电弹性体材料构成。 多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触 飞机
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