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    Ball grid array package
    71.
    发明授权
    Ball grid array package 有权
    球栅阵列封装

    公开(公告)号：US06396707B1

    公开(公告)日：2002-05-28

    申请号：US09454006

    申请日：1999-12-03

    申请人： Chien-Ping Huang ,  Grace Yang

    发明人： Chien-Ping Huang ,  Grace Yang

    IPC分类号： H05K702

    CPC分类号： H01L23/49816 ,  H01L2924/0002 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/0989 ,  H01L2924/00

    摘要： A ball grid array package comprises a substrate having a first surface and a second surface, a chip, an insulating material, and a solder ball. The surface of the substrate comprises ball pads, conducting traces, and solder masks wherein the conducting traces are disposed in between the adjacent ball pads, and are covered by the solder mask, in addition, a portion of each of the ball pads is also covered by the solder mask. The solder mask includes an opening positioned in the area corresponding to the ball pads wherein the opening exposes a portion of the surface the ball pad and a portion of the side wall of the ball pad. The chip is disposed on the second surface of the substrate, and is sealed and encapsulated by the insulated material. The solder balls are disposed on the first surface of the substrate, and are positioned at the openings of the ball pads. Additionally, the solder balls are electrically connected to a portion of the surface of the ball pads and a portion of the side wall of the ball pads disposed at the ball pad openings.

    摘要翻译： 球栅阵列封装包括具有第一表面和第二表面的衬底，芯片，绝缘材料和焊球。 衬底的表面包括球垫，导电迹线和焊接掩模，其中导电迹线设置在相邻的球垫之间，并被焊接掩模覆盖，此外，每个球垫的一部分也被覆盖 通过焊接面罩。 焊接掩模包括位于对应于球垫的区域中的开口，其中开口暴露表面的一部分球垫和球垫的侧壁的一部分。 芯片设置在基板的第二表面上，并被绝缘材料密封和封装。 焊球设置在基板的第一表面上，并且位于球垫的开口处。 此外，焊球与电极焊盘表面的一部分电连接，球垫侧壁的一部分设置在球垫开口处。

    Method of bonding ball grid array package to circuit board without causing package collapse
    72.
    发明授权
    Method of bonding ball grid array package to circuit board without causing package collapse 有权
    将球栅阵列封装焊接到电路板而不会导致封装崩溃的方法

    公开(公告)号：US06350669B1

    公开(公告)日：2002-02-26

    申请号：US09699888

    申请日：2000-10-30

    申请人： Han-Ping Pu ,  Chien-Ping Huang

    发明人： Han-Ping Pu ,  Chien-Ping Huang

    IPC分类号： H01L2144

    CPC分类号： H01L24/11 ,  H01L21/4846 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/14505 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K2203/041 ,  Y02P70/613 ,  H01L2224/05599

    摘要： A method is proposed for bonding a BGA (Ball Grid Array) package to a circuit board without causing the collapsing of the BGA package against the circuit board. The proposed method is characterized in the use of two groups of solder balls of different reflow collapse degrees, which are arranged in an interspersed manner among each other in the ball grid array. In one embodiment, the first group of solder balls are homogenously made of a solder material of a specific melting point; and the second group of solder balls each include an outer portion and a core portion, with the outer portion having substantially the same melting point as the first group of solder balls, and the core portion being greater in melting point than the outer portion. In another embodiment, the second group of solder balls are greater in melting point than the first group of solder balls. During the solder-reflow process, when the first group of solder balls are entirely melted, the second group of solder balls are only partly melted or entirely unmelted and thus are capable of providing a solid support to the BGA package to prevent the collapsing of BGA package against circuit board.

    摘要翻译： 提出了一种用于将BGA（球栅阵列）封装结合到电路板而不引起BGA封装相对于电路板折叠的方法。 所提出的方法的特征在于使用不同回流塌陷度的两组焊球，其在球栅阵列中以散布的方式相互排列。 在一个实施例中，第一组焊球由具有特定熔点的焊料均质地制成; 并且第二组焊球各自包括外部部分和芯部分，外部部分具有与第一组焊球基本相同的熔点，并且芯部分的熔点大于外部部分。 在另一个实施例中，第二组焊球的熔点高于第一组焊球。 在焊料回流工艺期间，当第一组焊球完全熔化时，第二组焊球仅部分熔化或完全未熔化，因此能够为BGA封装提供固体支撑以防止BGA的塌陷 封装电路板。

    Method of fabricating a ball grid array integrated circuit package having an encapsulating body
    73.
    发明授权
    Method of fabricating a ball grid array integrated circuit package having an encapsulating body 有权
    制造具有封装体的球栅阵列集成电路封装的方法

    公开(公告)号：US06306682B1

    公开(公告)日：2001-10-23

    申请号：US09547157

    申请日：2000-04-11

    申请人： Chien-Ping Huang ,  Randy H. Y. Lo ,  Tzong-Da Ho ,  Eric Ko ,  Jui-Meng Jao

    发明人： Chien-Ping Huang ,  Randy H. Y. Lo ,  Tzong-Da Ho ,  Eric Ko ,  Jui-Meng Jao

    IPC分类号： H01L2144

    CPC分类号： H01L21/56 ,  H01L23/3128 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

    摘要： A method of fabricating a BGA (Ball Grid Array) IC package of the type having an encapsulating body is proposed, which allows the BGA IC package to be manufactured without having to use conventional organic substrate and encapsulating-body mold having cavity, so that the manufacture process can be more cost-effective to carry out than the prior art. The proposed method is characterized in the use of a copper piece which is selectively removed to form an encapsulating-body cavity for the forming of an encapsulating body therein. The proposed method requires no use of mold with cavity for the forming of the encapsulating body, allowing the same mold to be used for the fabrication of various BGA IC packages of different sizes. Moreover, the proposed method allows fan-in design as well as fan-out design, thus allowing the number of I/O ports to be increased while making the overall package configuration compact in size, and also allows the implantation of the electrically-conductive balls to be easier to carry out and more precisely controlled than the prior art, making the ball implantation more assured in quality than the prior art. Therefore, the proposed method is more advantageous and cost-effective to use than the prior art.

    摘要翻译： 提出了一种制造具有封装体的BGA（球栅阵列）IC封装的方法，其允许制造BGA IC封装，而不必使用传统的有机衬底和具有空腔的封装体模具， 制造工艺比现有技术更具成本效益。 所提出的方法的特征在于使用铜片，其被选择性地去除以形成用于在其中形成封装体的封装体腔体。 所提出的方法不需要使用具有空腔的模具来形成封装体，允许相同的模具用于制造不同尺寸的各种BGA IC封装。 此外，所提出的方法允许风扇设计以及扇出式设计，从而允许增加I / O端口的数量，同时使整个封装结构的尺寸紧凑，并且还允许将导电 球比现有技术更容易实施和更精确地控制，使得球注入在质量上比现有技术更加确保。 因此，所提出的方法比现有技术更有利且成本有效。

    Flash-free mold structure for integrated circuit package
    74.
    发明授权
    Flash-free mold structure for integrated circuit package 失效
    无闪存模块结构用于集成电路封装

    公开(公告)号：US06290481B1

    公开(公告)日：2001-09-18

    申请号：US09574878

    申请日：2000-05-19

    申请人： Chien-Ping Huang

    发明人： Chien-Ping Huang

    IPC分类号： B29C4514

    CPC分类号： B29C45/2701 ,  H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A flash-free mold structure is designed for use in the molding of an encapsulant for encapsulating a semiconductor die. The flash-free mold structure includes a first molding piece and a second molding piece. The second molding piece is formed with a resin passage for an encapsulating material to flow therethrough during molding process. It is a characteristic feature of this flash-free mold structure that a cutaway portion, which can be either an one-step cutaway portion or a multi-step cutaway portion, is formed at the rim of the resin passage. The cutaway portion is dimensioned significantly smaller than the resin passage for the retarding the flow speed of the encapsulating material from the resin passage into the cutaway portion during the molding process, thereby preventing the encapsulating material from entering the fissure in the junction between the first and second molding pieces. The resin passage can be either a cull, a runner, or a subrunner defined by the first and second molding pieces. With this flash-free mold structure, the IC packaging quality can be assured and fabrication tools can be prevented from contamination.

    摘要翻译： 无闪光模具结构被设计用于模制用于封装半导体管芯的密封剂。 无闪光模具结构包括第一成型件和第二成型件。 第二成型件在模制过程中由用于密封材料的树脂通道形成为流过其中。 这种无闪光模具结构的特征在于，在树脂通道的边缘处形成有可以是一步切口部分或多段切口部分的切口部分。 切割部分的尺寸明显小于树脂通道，用于在模制过程中阻止封装材料从树脂通道进入切除部分的流动速度，从而防止封装材料在第一和第二部分之间的接合处进入裂缝 第二个成型件。 树脂通道可以是由第一和第二成型件限定的剔除，流道或辅助材料。 利用这种无闪光模具结构，可以确保IC封装质量，并可防止制造工具的污染。

    DRIVER HAVING DEAD-TIME COMPENSATION FUNCTION
    79.
    发明申请
    DRIVER HAVING DEAD-TIME COMPENSATION FUNCTION 有权
    具有死亡补偿功能的驾驶员

    公开(公告)号：US20130063059A1

    公开(公告)日：2013-03-14

    申请号：US13589936

    申请日：2012-08-20

    申请人： Chien-Yu Chi ,  Chien-Ping Huang

    发明人： Chien-Yu Chi ,  Chien-Ping Huang

    IPC分类号： H02P6/14

    CPC分类号： H02P27/08 ,  H02M2001/385

    摘要： Proposed is a driver having dead-time compensation function. The driver having dead-time compensation function generates an output voltage according to a voltage command and a frequency command. The driver includes an inverter, an output current detector and a control unit. The inverter receives a DC voltage and operates with a pulse width modulation mode so that the driver outputs the output voltage and an output current. The output current detector detects the current value of the output current to generate a output current detecting signal. The control unit outputs a switching control signal to inverter according to the voltage command and the frequency command. The control unit corrects a reference command according to dead-time and the output current detecting signal related to the output current so that amplitude and waveform smoothness of the output voltage and the output current are compensated.

    摘要翻译： 建议是具有死区补偿功能的驾驶员。 具有死区补偿功能的驱动器根据电压指令和频率指令产生输出电压。 驱动器包括逆变器，输出电流检测器和控制单元。 逆变器接收直流电压并以脉冲宽度调制模式工作，以便驱动器输出输出电压和输出电流。 输出电流检测器检测输出电流的当前值以产生输出电流检测信号。 控制单元根据电压指令和频率指令向逆变器输出切换控制信号。 控制单元根据死区时间和与输出电流相关的输出电流检测信号来校正参考命令，从而补偿输出电压和输出电流的振幅和波形平滑度。

    PACKAGE STRUCTURE HAVING MICRO-ELECTROMECHANICAL ELEMENT
    80.
    发明申请
    PACKAGE STRUCTURE HAVING MICRO-ELECTROMECHANICAL ELEMENT 有权
    具有微电子元件的包装结构

    公开(公告)号：US20120241937A1

    公开(公告)日：2012-09-27

    申请号：US13492220

    申请日：2012-06-08

    申请人： Chang-Yueh Chan ,  Chien-Ping Huang ,  Chun-Chi Ke ,  Chun-An Huang ,  Chih-Ming Huang

    发明人： Chang-Yueh Chan ,  Chien-Ping Huang ,  Chun-Chi Ke ,  Chun-An Huang ,  Chih-Ming Huang

    IPC分类号： H01L23/498

    CPC分类号： H01L21/02 ,  B81B7/007 ,  B81B2207/07 ,  H01L23/52 ,  H01L29/84 ,  H01L2224/02166 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Proposed is a package structure having a micro-electromechanical (MEMS) element, including a chip having a plurality of electrical connecting pads and a MEMS element formed thereon; a lid disposed on the chip for covering the MEMS element; a stud bump disposed on each of the electrical connecting pads; an encapsulant formed on the chip with part of the stud bumps being exposed from the encapsulant; and a metal conductive layer formed on the encapsulant and connected to the stud bumps. The invention is characterized by completing the packaging process on the wafer directly to enable thinner and cheaper package structures to be fabricated within less time. This invention further provides a method for fabricating the package structure as described above.

    摘要翻译： 提出具有微机电（MEMS）元件的封装结构，其包括具有多个电连接焊盘和形成在其上的MEMS元件的芯片; 设置在所述芯片上用于覆盖所述MEMS元件的盖; 设置在每个电连接焊盘上的螺柱凸块; 形成在芯片上的密封剂，其中一部分柱状凸块从密封剂暴露出来; 以及金属导电层，形成在密封剂上并连接到凸块上。 本发明的特征在于直接完成晶片上的封装工艺，以便在更短的时间内制造更薄和更便宜的封装结构。 本发明还提供如上所述的用于制造封装结构的方法。