公开(公告)号：US20110316130A1

公开(公告)日：2011-12-29

申请号：US13092159

申请日：2011-04-22

申请人： Yeqing Su ,  Zhigang Bai ,  Weimin Chen ,  Wei Shen ,  Jianhong Wang ,  Baoguan Yin ,  Wanming Yu

发明人： Yeqing Su ,  Zhigang Bai ,  Weimin Chen ,  Wei Shen ,  Jianhong Wang ,  Baoguan Yin ,  Wanming Yu

IPC分类号： H01L23/495 ,  H01L21/28

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8501 ,  H01L2924/00014 ,  H01L2924/18165 ,  H01L2224/45099

摘要： A method for manufacturing a thin semiconductor package includes providing a lead frame with a removable substrate that has an attaching surface attached to a first surface of the lead frame. The lead frame is formed from an electrically conductive sheet and has leads that extend inwardly from a lead frame boundary towards a central region of the lead frame. A semiconductor die is mounted on the removable substrate at the central region. The semiconductor die has a connection pad surface with die pads on it, and the connection pad surface is attached to the attaching surface of the removable substrate. The lead frame and die are encapsulated with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate. The removable substrate is removed from the lead frame to expose the first surface of the lead frame and then the die pads are electrically connected to respective ones of the leads. The die and lead frame then are encapsulated with a second encapsulant so that the lead frame and die are sandwiched between the first and second encapsulants. Part of the first encapsulant is then removed to reduce the thickness of the package and expose the leads.

摘要翻译： 一种用于制造薄半导体封装的方法，包括：提供具有可移除基板的引线框架，该可移除基板具有附接到引线框架的第一表面的附接表面。 引线框架由导电片形成，并且具有从引线框架边界朝向引线框架的中心区域向内延伸的引线。 半导体管芯安装在中央区域的可拆卸基板上。 半导体管芯具有连接焊盘表面，其上具有焊盘，并且连接焊盘表面附接到可移除基板的附接表面。 引线框架和管芯用第一密封剂封装，使得引线框架夹在第一密封剂和可移除基板之间。 将可移除基板从引线框架移除以露出引线框架的第一表面，然后将管芯焊盘电连接到相应的引线。 然后，管芯和引线框架用第二密封剂封装，使得引线框架和管芯夹在第一和第二密封剂之间。 然后去除部分第一密封剂以减小包装的厚度并暴露引线。

公开(公告)号：US07888186B2

公开(公告)日：2011-02-15

申请号：US12499788

申请日：2009-07-08

申请人： Zhigang Bai ,  Weimin Chen ,  Zhijie Wang

发明人： Zhigang Bai ,  Weimin Chen ,  Zhijie Wang

IPC分类号： H01L21/00

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15331 ,  H01L2924/181 ,  Y10T29/41 ,  Y10T29/51 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A method for assembling a stackable semiconductor package includes providing a substrate having a first surface and a second surface. The first surface includes bond pads and one or more die pads. Conductive bumps are formed on the bond pads and one or more semiconductor dies are attached to the one or more die pads. The first surface of the substrate, the semiconductor dies and the conductive bumps are placed in a side-gate molding cast and a mold material is supplied to the first surface of the substrate to form a stackable semiconductor package. Similarly formed semiconductor packages may be stacked, one on another to form a stacked semiconductor package.

摘要翻译： 一种用于组装可堆叠半导体封装的方法包括提供具有第一表面和第二表面的衬底。 第一表面包括接合焊盘和一个或多个管芯焊盘。 导电凸块形成在接合焊盘上，并且一个或多个半导体管芯附接到一个或多个管芯焊盘。 将基板的第一表面，半导体管芯和导电凸块放置在侧浇口模铸件中，并将模具材料供应到基板的第一表面以形成可堆叠的半导体封装。 类似地形成的半导体封装可以彼此层叠以形成堆叠的半导体封装。

公开(公告)号：US09214447B2

公开(公告)日：2015-12-15

申请号：US14277061

申请日：2014-05-14

申请人： Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

发明人： Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48

CPC分类号： H01L24/85 ,  H01L21/4842 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/32245 ,  H01L2224/48245 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A no-lead type semiconductor package has a mold cap that forms a mold body. The corners of the mold body are reinforced with mold columns such that the corners have rounded protrusions and do not form 90° angles. The mold columns prevent the corner pads from peeling.

摘要翻译： 无引线型半导体封装具有形成模体的模盖。 模具体的角部用模具柱加强，使得拐角具有圆形的突起并且不形成90°的角度。 模具柱防止角垫脱落。

公开(公告)号：US20150294924A1

公开(公告)日：2015-10-15

申请号：US14552497

申请日：2014-11-25

申请人： Zhigang Bai ,  Jinzhong Yao ,  Lan Chu Tan

发明人： Zhigang Bai ,  Jinzhong Yao ,  Lan Chu Tan

IPC分类号： H01L23/495 ,  H01L21/56 ,  H01L23/58 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L24/85 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49861 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a first lead frame type having a first type of package leads and a pre-molded portion, and a second lead frame type having a second type of package leads that surround a die pad and are supported by the pre-molded portion. An integrated circuit is attached to the die pad and electrically connected to the first and second types of leads with bond wires. A mold compound, which forms a mold cap, covers the first and second lead frame types, the integrated circuit and the bond wires. The first lead frame type may be a QFP type and the second lead frame type may be a QFN type.

摘要翻译： 半导体封装包括具有第一类型的封装引线和预成型部分的第一引线框架型和具有围绕芯片焊盘并由预模制部分支撑的第二类型的封装引线的第二引线框架型 。 集成电路附接到管芯焊盘并且用接合线电连接到第一和第二类型的引线。 形成模具帽的模具复合体覆盖第一和第二引线框架类型，集成电路和接合线。 第一引线框类型可以是QFP型，第二引线框类型可以是QFN型。

公开(公告)号：US20150243586A1

公开(公告)日：2015-08-27

申请号：US14551069

申请日：2014-11-23

申请人： Zhijie Wang ,  Zhigang Bai ,  Aipeng Shu ,  Yanbo Xu ,  Huchang Zhang ,  Fei Zong

发明人： Zhijie Wang ,  Zhigang Bai ,  Aipeng Shu ,  Yanbo Xu ,  Huchang Zhang ,  Fei Zong

IPC分类号： H01L23/495 ,  H01L23/433 ,  H01L23/498 ,  H01L21/56

CPC分类号： H01L23/49503 ,  H01L21/56 ,  H01L21/561 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49568 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A semiconductor die is packaged by providing a die assembly that includes a semiconductor die with an active surface and an opposite mounting surface with an attached thermally conductive substrate. The die assembly is mounted on a first surface of a lead frame die flag so that the thermally conductive substrate is sandwiched between the die flag and the semiconductor die. Bonding pads of the die are electrically connected with bond wires to lead frame lead fingers. A mold compound then encapsulates the semiconductor die, bond wires, and thermally conductive substrate. A second surface of the die flag is exposed through the mold compound.

摘要翻译： 通过提供包括具有活性表面的半导体管芯和具有附接的导热衬底的相对安装表面的管芯组件来封装半导体管芯。 模具组件安装在引线框架模具标记的第一表面上，使得导热基板夹在模具标记和半导体管芯之间。 管芯的接合焊盘与接合线电连接以引导框架引线指。 然后，模制化合物封装半导体管芯，接合线和导热衬底。 模具标记的第二表面通过模具化合物暴露。

公开(公告)号：US08901721B1

公开(公告)日：2014-12-02

申请号：US13972885

申请日：2013-08-21

申请人： Zhigang Bai ,  Jinzhong Yao ,  Yuan Zang

发明人： Zhigang Bai ,  Jinzhong Yao ,  Yuan Zang

IPC分类号： H01L23/48 ,  H01L23/495 ,  H01L23/00

CPC分类号： H01L23/49517 ,  H01L23/3107 ,  H01L23/49555 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A lead frame based semiconductor die package includes a lead frame having a die pad that supports a semiconductor die and lead fingers that surround the die and die pad. The die is electrically connected to the lead fingers with bond wires. The die and bond wires are covered with an encapsulant with ends of the lead fingers projecting out from the encapsulant. One set of the lead fingers are bent and project down and another set of the lead fingers are bent and project inwardly, and under a bottom surface of the encapsulant. The encapsulant includes a slot or groove for receiving the lead fingers of the second set.

摘要翻译： 基于引线框架的半导体管芯封装包括引线框架，其具有支撑半导体管芯的管芯焊盘和围绕管芯和管芯焊盘的引线指。 模具通过接合线电连接到引线指。 管芯和接合线用密封剂覆盖，引线的端部从密封剂突出。 一组引导指弯曲并向下突出，另一组引导指弯曲并向内突出，并在密封剂的底表面下方。 密封剂包括用于接收第二组的引导指的槽或槽。

公开(公告)号：US08859339B2

公开(公告)日：2014-10-14

申请号：US13794789

申请日：2013-03-12

申请人： Zhigang Bai ,  Jinzhong Yao

发明人： Zhigang Bai ,  Jinzhong Yao

IPC分类号： H01L21/56 ,  B29C45/14 ,  B29C70/72 ,  H03K19/0185

CPC分类号： H01L21/565 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H03K19/018521 ,  H01L2924/00014

摘要： A mold chase for packaging a semiconductor die includes first and second toothed mold clamps, each having teeth, recesses located between the teeth, and an open cavity located in a center of the first mold clamp. The second mold clamp is in facing arrangement with the first mold clamp and the teeth in the first mold clamp mate with corresponding recesses in the second mold clamp and vice-versa. In an open position a lead frame can be inserted into one of the first or second mold clamps and in a closed position, the teeth and recesses of the first and second mold clamps bend leads of the lead frame into two spaced, planar rows.

摘要翻译： 用于包装半导体模具的模具行包括第一和第二齿形模具夹具，每个具有齿，位于齿之间的凹部和位于第一模具夹具的中心的开口腔。 第二模具夹具与第一模具夹具面对配置，并且第一模具夹具中的齿与第二模具夹具中的相应凹部配合，反之亦然。 在打开位置，引线框架可以插入第一或第二模具夹具中的一个中，并且在关闭位置，第一和第二模具夹具的齿和凹部将引线框架的引线弯曲成两个间隔开的平面行。

公开(公告)号：US08859336B2

公开(公告)日：2014-10-14

申请号：US13398816

申请日：2012-02-16

申请人： Junhua Luo ,  Zhigang Bai ,  Nan Xu ,  Jinzhong Yao

发明人： Junhua Luo ,  Zhigang Bai ,  Nan Xu ,  Jinzhong Yao

IPC分类号： H01L21/50 ,  H01L23/433 ,  H01L23/31 ,  H01L23/16 ,  H01L23/00 ,  H01L23/552 ,  H01L21/56

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L21/565 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of assembling semiconductor devices includes placing an array of semiconductor dies on a die support. A cap array structure is provided that has a corresponding array of caps supported by a cap frame structure. The cap array structure and the array of semiconductor dies on the die support are aligned, with the caps extending over corresponding semiconductor dies, in a mold chase. The array of semiconductor dies and the array of caps are encapsulated with a molding compound in the mold chase. The encapsulated units of the semiconductor dies with the corresponding caps are removed from the mold chase and singulated. Singulating the encapsulated units may include removing the cap frame structure from the encapsulated units.

摘要翻译： 一种组装半导体器件的方法包括将半导体管芯的阵列放置在管芯支撑件上。 提供一种帽阵列结构，其具有由帽框架结构支撑的相应的帽阵列。 在模具追逐中，盖阵列结构和模具支撑件上的半导体管芯阵列与盖延伸在对应的半导体管芯上对齐。 半导体管芯阵列和盖阵列通过模具化合物封装在模具追逐中。 将具有相应盖的半导体管芯的封装单元从模具中取出并分离。 编码封装的单元可以包括从封装单元去除盖框架结构。

公开(公告)号：US20140034273A1

公开(公告)日：2014-02-06

申请号：US13882154

申请日：2011-08-29

申请人： Honghui Shi ,  Qingzhong Ma ,  Jin Wang ,  Jiayong Lu ,  Longying Zhang ,  Zhigang Bai

发明人： Honghui Shi ,  Qingzhong Ma ,  Jin Wang ,  Jiayong Lu ,  Longying Zhang ,  Zhigang Bai

IPC分类号： F28B1/06

CPC分类号： F28B1/06 ,  F01K9/00 ,  F28B7/00 ,  F28D7/163 ,  F28F9/26

摘要： An evaporative condenser radiating module for steam exhaust of a steam turbine comprises tube bundles and steam-water separating chambers. A steam-water separating chamber (4) between a section A and a section B, a section A downflow cooling section tube bundle (3), a section B downflow cooling section tube bundle (5), and a section C counter flow cooling section tube bundle (8) are disposes at the left side of a central steam-water separating chamber (7). An upper sealed space (10) of the steam-water separating chamber (4) between the section A and the section B is in communication with the central steam-water separating chamber (7) through the section C counter flow cooling section tube bundle (8). A lower sealed space of the steam-water separating chamber (4) between the section A and the section B is in communication with the central steam-water separating chamber (7) through the section B downflow cooling section tube bundle (5). A sealed section A steam entering chamber (2) is arranged on the left side of the steam-water separating chamber (4) between the section A and the section B. The section A downflow cooling section tube bundle (3) is arranged between the section A steam entering chamber (2) and the lower sealed space of the steam-water separating chamber (4) between the section A and the section B. The right side of the central steam-water separating chamber (7) is provided with tube bundles and steam-water separating chambers totally structurally identical with those arranged on the left side of the central steam-water separating chamber (7).

摘要翻译： 用于汽轮机蒸汽排气的蒸发冷凝器辐射模块包括管束和蒸汽 - 水分离室。 A部分和B部分之间的蒸汽 - 水分离室（4），A部分下降冷却部分管束（3），B部分下降冷却部分管束（5）和C部逆流冷却部分 管束（8）配置在中央蒸汽 - 水分离室（7）的左侧。 部分A和部分B之间的蒸汽 - 水分离室（4）的上部密封空间（10）通过部分C逆流冷却部分管束与中央蒸汽 - 水分离室（7）连通 8）。 部分A和部分B之间的蒸汽 - 水分离室（4）的下部密封空间通过部分B下降冷却部分管束（5）与中央蒸汽 - 水分离室（7）连通。 密封部分A蒸汽进入室（2）布置在部分A和部分B之间的蒸汽 - 水分离室（4）的左侧。部分A下降冷却部分管束（3）布置在 部分A蒸汽进入室（2）和蒸汽 - 水分离室（4）的下部密封空间在部分A和部分B之间。中央蒸汽 - 水分离室（7）的右侧设有管 束和蒸汽 - 水分离室在结构上与布置在中央蒸汽 - 水分离室（7）左侧的那些分离室完全相同。

公开(公告)号：US20130249071A1

公开(公告)日：2013-09-26

申请号：US13854140

申请日：2013-04-01

申请人： Jinzhong Yao ,  Zhigang Bai ,  Yuan Zang

发明人： Jinzhong Yao ,  Zhigang Bai ,  Yuan Zang

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/495 ,  B29C33/005 ,  B29C45/14221 ,  B29C45/14655 ,  H01L21/4842 ,  H01L21/561 ,  H01L21/565 ,  H01L23/49555 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A method of assembling a semiconductor device includes providing a lead frame having a die pad and a fame member with lead fingers that surround the die pad. The lead fingers have distal ends connected to the frame member and proximal ends near the die pad. A die is attached to the die pad and die connection pads are electrically connected to the proximal ends of the lead fingers with bond wires. The die, bond wires, and part of the lead fingers are encapsulated with an encapsulant. The encapsulating process includes separating the lead fingers into first and second sets of lead fingers. The proximal ends of the first set lie in a first plane and the proximal ends of the second set lie in a second plane that is spaced and maintained from the first plane solely by the encapsulation material.

摘要翻译： 一种组装半导体器件的方法包括提供引线框架，该引线框架具有管芯焊盘和引导指围绕管芯焊盘的成形构件。 引线指具有连接到框架构件的远端和靠近管芯焊盘的近端。 模具附接到管芯焊盘，管芯连接焊盘通过接合线电连接到引线指的近端。 管芯，接合线和引线的一部分用密封剂封装。 封装过程包括将引线分离成第一和第二组引线指。 第一组的近端位于第一平面中，并且第二组的近端位于第二平面中，第二平面仅与第一平面间隔开并由包封材料保持。