公开(公告)号：US20120208320A1

公开(公告)日：2012-08-16

申请号：US13456331

申请日：2012-04-26

申请人： Hans-Joachim Barth ,  Thorsten Meyer ,  Markus Brunnbauer ,  Jenei Snezana

发明人： Hans-Joachim Barth ,  Thorsten Meyer ,  Markus Brunnbauer ,  Jenei Snezana

IPC分类号： H01L21/60 ,  H01L21/768

CPC分类号： H01L23/5225 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/552 ,  H01L23/585 ,  H01L23/66 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/20 ,  H01L24/96 ,  H01L2224/02166 ,  H01L2224/0231 ,  H01L2224/03828 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/11334 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/20 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/00

摘要： A system on chip comprising a RF shield is disclosed. In one embodiment, the system on chip includes a RF component disposed on a chip, first redistribution lines disposed above the system on chip, the first redistribution lines coupled to I/O connection nodes. The system on chip further includes second redistribution lines disposed above the RF component, the second redistribution lines coupled to ground potential nodes. The second redistribution lines include a first set of parallel metal lines coupled together by a second set of parallel metal lines.

摘要翻译： 公开了一种包括RF屏蔽的片上系统。 在一个实施例中，片上系统包括设置在芯片上的RF组件，设置在片上系统上方的第一再分配线，第一再分配线耦合到I / O连接节点。 片上系统还包括设置在RF部件上方的第二再分配线，第二再分配线耦合到地电位节点。 第二再分配线包括由第二组平行金属线耦合在一起的第一组平行金属线。

公开(公告)号：US07759163B2

公开(公告)日：2010-07-20

申请号：US12105837

申请日：2008-04-18

申请人： Werner Kroeninger ,  Josef Schwaiger ,  Ludwig Schneider ,  Ottmar Geitner ,  Markus Brunnbauer ,  Thorsten Meyer ,  Ralf Otremba ,  Josef Hoeglauer ,  Helmut Strack ,  Xaver Schloegel

发明人： Werner Kroeninger ,  Josef Schwaiger ,  Ludwig Schneider ,  Ottmar Geitner ,  Markus Brunnbauer ,  Thorsten Meyer ,  Ralf Otremba ,  Josef Hoeglauer ,  Helmut Strack ,  Xaver Schloegel

IPC分类号： H01L21/00 ,  H01L23/48

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/25 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/072 ,  H01L2221/68345 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/12105 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/73153 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/82102 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12032 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor module. One embodiment provides at least two semiconductor chips placed on a carrier. The at least two semiconductor chips are then covered with a molding material to form a molded body. The molded body is thinned until the at least two semiconductor chips are exposed. Then, the carrier is removed from the at least two semiconductor chips. The at least two semiconductor chips are singulated.

摘要翻译： 半导体模块。 一个实施例提供放置在载体上的至少两个半导体芯片。 然后将至少两个半导体芯片用模制材料覆盖以形成模制体。 成型体变薄，直到暴露出至少两个半导体芯片。 然后，从至少两个半导体芯片移除载体。 将至少两个半导体芯片分割。

公开(公告)号：US20080012152A1

公开(公告)日：2008-01-17

申请号：US11486443

申请日：2006-07-13

申请人： Thorsten Meyer ,  Harry Hedler ,  Markus Brunnbauer

发明人： Thorsten Meyer ,  Harry Hedler ,  Markus Brunnbauer

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L23/49816 ,  H01L21/568 ,  H01L21/68 ,  H01L21/6835 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/82001 ,  H01L2224/92 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3511 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00

摘要： A component and a method for producing a component are disclosed. The component comprises an integrated circuit, a housing body, a wiring device overlapping the integrated circuit and the housing body, and one or more external contact devices in communication with the wiring device.

摘要翻译： 公开了一种组件的制造方法。 该组件包括集成电路，壳体，与集成电路重叠的布线装置和壳体，以及与布线装置连通的一个或多个外部接触装置。

公开(公告)号：US08394308B2

公开(公告)日：2013-03-12

申请号：US13448941

申请日：2012-04-17

申请人： Markus Brunnbauer ,  Edward Fuergut ,  Daniel Porwol

发明人： Markus Brunnbauer ,  Edward Fuergut ,  Daniel Porwol

IPC分类号： H01L21/56

CPC分类号： B29C45/14639 ,  B29C33/10 ,  B29C43/18 ,  B29C43/36 ,  B29C45/02 ,  B29C2043/3644 ,  H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

摘要： An apparatus and method for producing an article by molding is disclosed. In one embodiment, the method includes a mold with an upper part, a lower part and at least one mold cavity, and has a vacuum clamping ring with a least one closable vent, which is arranged between the upper part and the lower part. The mold cavity is at least partially filled with a mold material. The vent is closed, and the mold cavity is filled with a thermoplastic or thermoset material.

摘要翻译： 公开了一种通过模制制造制品的装置和方法。 在一个实施例中，该方法包括具有上部，下部和至少一个模腔的模具，并且具有设置在上部和下部之间的具有至少一个可关闭通气口的真空夹紧环。 模腔至少部分地填充有模具材料。 通风口关闭，模腔填充有热塑性或热固性材料。

公开(公告)号：US07585701B2

公开(公告)日：2009-09-08

申请号：US11439425

申请日：2006-05-24

申请人： Gottfried Beer ,  Markus Brunnbauer ,  Irmgard Escher-Poeppel ,  Edward Fuergut

发明人： Gottfried Beer ,  Markus Brunnbauer ,  Irmgard Escher-Poeppel ,  Edward Fuergut

IPC分类号： H01L21/00

CPC分类号： H01L24/96 ,  C09J7/35 ,  C09J7/385 ,  C09J2201/134 ,  C09J2201/28 ,  C09J2203/326 ,  C09J2427/006 ,  C09J2433/00 ,  C09J2467/006 ,  H01L21/561 ,  H01L21/568 ,  H01L21/67126 ,  H01L21/67132 ,  H01L2221/68318 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A carrier sheet with an adhesive film includes a heat-resistant base film with an upper side and an underside, and a thermoactive adhesive layer arranged on the underside of the base film and oriented toward the carrier sheet. The upper side of the base film includes an adhesive layer with semiconductor chips fixed on it, the semiconductor chips being surrounded by deactivated regions of the adhesive layer of the film upper side.

摘要翻译： 具有粘合膜的载体片包括具有上侧和下侧的耐热基膜，以及设置在基膜的下侧并且朝向载体片取向的热敏粘合剂层。 基膜的上侧包括固定有半导体芯片的粘合剂层，半导体芯片由膜上侧的粘合剂层的去活化区域包围。

公开(公告)号：US20060273469A1

公开(公告)日：2006-12-07

申请号：US11439425

申请日：2006-05-24

申请人： Gottfried Beer ,  Markus Brunnbauer ,  Irmgard Escher-Poeppel ,  Edward Fuergut

发明人： Gottfried Beer ,  Markus Brunnbauer ,  Irmgard Escher-Poeppel ,  Edward Fuergut

IPC分类号： H01L23/48

CPC分类号： H01L24/96 ,  C09J7/35 ,  C09J7/385 ,  C09J2201/134 ,  C09J2201/28 ,  C09J2203/326 ,  C09J2427/006 ,  C09J2433/00 ,  C09J2467/006 ,  H01L21/561 ,  H01L21/568 ,  H01L21/67126 ,  H01L21/67132 ,  H01L2221/68318 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A carrier sheet with an adhesive film includes a heat-resistant base film with an upper side and an underside, and a thermoactive adhesive layer arranged on the underside of the base film and oriented toward the carrier sheet. The upper side of the base film includes an adhesive layer with semiconductor chips fixed on it, the semiconductor chips being surrounded by deactivated regions of the adhesive layer of the film upper side.

公开(公告)号：US08524542B2

公开(公告)日：2013-09-03

申请号：US13556837

申请日：2012-07-24

申请人： Markus Brunnbauer ,  Edward Fuergut

发明人： Markus Brunnbauer ,  Edward Fuergut

IPC分类号： H01L21/00

CPC分类号： H01L23/5389 ,  H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/544 ,  H01L24/96 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/54493 ,  H01L2224/92 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00

摘要： A blank and a semiconductor device include a composite panel with semiconductor chips embedded in a plastic package molding compound. The blank includes a composite panel with semiconductor chips arranged in rows and columns in a plastic package molding compound with active upper sides of the semiconductor chips forming a coplanar surface area with the upper side of the composite panel. The blank further includes an orientation indicator impressed into the plastic package molding compound when the semiconductor chips are embedded within the molding compound.

摘要翻译： 空白和半导体器件包括具有嵌入在塑料封装模塑料中的半导体芯片的复合面板。 坯料包括具有半导体芯片的复合面板，该复合面板具有以塑料封装模制化合物排成行和列的半导体芯片，半导体芯片的有源上侧与复合面板的上侧形成共面表面积。 当半导体芯片嵌入模塑料中时，该坯料还包括印模在塑料封装模塑料中的取向指示器。

公开(公告)号：US08431063B2

公开(公告)日：2013-04-30

申请号：US11581060

申请日：2006-10-16

申请人： Gottfried Beer ,  Markus Brunnbauer ,  Edward Fuergut

发明人： Gottfried Beer ,  Markus Brunnbauer ,  Edward Fuergut

IPC分类号： B29B17/00

CPC分类号： H01L21/561 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/92 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2224/96 ,  H01L2224/82

摘要： A heat treatment method is provided for a panel. The panel includes a plastic housing composition, in which semiconductor chips are embedded by their rear sides and edge sides, and the top sides of the semiconductor chips form a coplanar area with the plastic housing composition. The panel is fixed by its underside on a holder, and a temperature gradient (ΔT) is then generated between top side and the underside of the panel. The temperature gradient (ΔT) is then maintained for at least one delimited or selected time period. The panel is then cooled to room temperature (TR).

摘要翻译： 为面板提供热处理方法。 面板包括塑料外壳组合物，其中半导体芯片由其后侧和边缘侧嵌入，并且半导体芯片的顶侧与塑料外壳组合物形成共面区域。 面板通过其下侧固定在支架上，然后在面板的顶侧和底面之间产生温度梯度（DeltaT）。 然后将温度梯度（DeltaT）保持至少一个定界或选定的时间段。 然后将面板冷却至室温（TR）。

公开(公告)号：US20070164418A1

公开(公告)日：2007-07-19

申请号：US11622773

申请日：2007-01-12

申请人： Markus Brunnbauer

发明人： Markus Brunnbauer

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H01L25/18 ,  H01L24/19 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H05K1/181 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10674 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

摘要： A semiconductor module includes: a plastic housing composition; at least one semiconductor chip with an active top side, a coplanar underside of the semiconductor module including the active top side of the semiconductor chip(s) and a surface of the plastic housing composition; a wiring structure arranged on the coplanar underside, the wiring structure including a center region and edge regions, with external contact areas distributed uniformly in the center region; external contacts arranged on the external contact areas of the wiring structure; and at least one surface-mountable semiconductor component arranged on the wiring structure in at least one of the edge regions, the surface-mountable semiconductor component(s) having a structural height that is less than the height of the external contacts.

摘要翻译： 半导体模块包括：塑料外壳组合物; 具有有源顶侧的至少一个半导体芯片，所述半导体模块的共面下侧包括所述半导体芯片的有源顶侧和所述塑料外壳组合物的表面; 布置在共面下侧的布线结构，布线结构包括中心区域和边缘区域，外部接触区域均匀分布在中心区域; 布置在布线结构的外部接触区域上的外部触点; 以及在所述边缘区域中的至少一个布置在所述布线结构上的至少一个表面可安装的半导体部件，所述表面安装半导体部件的结构高度小于所述外部接触件的高度。

公开(公告)号：US20070094982A1

公开(公告)日：2007-05-03

申请号：US11581060

申请日：2006-10-16

申请人： Gottfried Beer ,  Markus Brunnbauer ,  Edward Fuergut

发明人： Gottfried Beer ,  Markus Brunnbauer ,  Edward Fuergut

IPC分类号： E04C3/00

CPC分类号： H01L21/561 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/92 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2224/96 ,  H01L2224/82

摘要： A heat treatment method is provided for a panel. The panel includes a plastic housing composition, in which semiconductor chips are embedded by their rear sides and edge sides, and the top sides of the semiconductor chips form a coplanar area with the plastic housing composition. The panel is fixed by its underside on a holder, and a temperature gradient (ΔT) is then generated between top side and the underside of the panel. The temperature gradient (ΔT) is then maintained for at least one delimited or selected time period. The panel is then cooled to room temperature (TR).

摘要翻译： 为面板提供热处理方法。 面板包括塑料外壳组合物，其中半导体芯片由其后侧和边缘侧嵌入，并且半导体芯片的顶侧与塑料外壳组合物形成共面区域。 面板通过其下侧固定在支架上，然后在面板的顶侧和底面之间产生温度梯度（DeltaT）。 然后将温度梯度（DeltaT）保持至少一个定界或选定的时间段。 然后将面板冷却至室温（T R R）。