公开(公告)号：US20050202667A1

公开(公告)日：2005-09-15

申请号：US11028957

申请日：2005-01-03

申请人： Adam Cohen ,  Gang Zhang ,  Fan-Gang Tseng

发明人： Adam Cohen ,  Gang Zhang ,  Fan-Gang Tseng

IPC分类号： B81B3/00 ,  G01P15/08 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/18 ,  H01P11/00 ,  H05K3/46 ,  H01L21/4763 ,  H01L21/44

CPC分类号： G01P15/0802 ,  B81B2201/042 ,  C25D1/003 ,  C25D1/12 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H01P11/007 ,  H05K3/4647 ,  Y10T29/49155

摘要： Various embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer. In other embodiments, electrochemically fabricated structures are formed on dielectric substrates.

公开(公告)号：US20050202660A1

公开(公告)日：2005-09-15

申请号：US10995609

申请日：2004-11-22

申请人： Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Marvin Kilgo

发明人： Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Marvin Kilgo

IPC分类号： B81B3/00 ,  C25D1/00 ,  C25D5/02 ,  C25D5/12 ,  C25D21/12 ,  G01P15/08 ,  G01P15/125 ,  H01L21/288 ,  H01L21/48 ,  H01L21/768 ,  H01P1/202 ,  H01P3/06 ,  H01P5/18 ,  H01P11/00 ,  H05K3/24 ,  H05K3/46 ,  H01L21/425

CPC分类号： C25D1/003 ,  B81B2201/042 ,  B81C99/004 ,  G01P15/0802 ,  G01P15/125 ,  H01L21/2885 ,  H01L21/4857 ,  H01L21/76879 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/241 ,  H05K3/243 ,  H05K3/4647

摘要： Electrochemical fabrication processes and apparatus for producing multi-layer structures include operations or means for providing enhanced monitoring of build operations or detection of the results of build operations, operations or means for build problem recognition, operations or means for evaluation of corrective action options, operations or means for making corrective action decisions, and operations or means for executing actions based on those decisions.

摘要翻译： 用于生产多层结构的电化学制造工艺和设备包括用于提供构建操作的增强监控或构建操作的结果的检测，构建问题识别的操作或手段，用于评估校正动作选项的操作或手段的操作或装置 或作出纠正行动决定的手段，以及基于这些决定执行行动的操作或手段。

公开(公告)号：US20050194258A1

公开(公告)日：2005-09-08

申请号：US11029179

申请日：2005-01-03

申请人： Adam Cohen ,  Michael Lockard ,  Kieun Kim ,  Qui Le ,  Gang Zhang ,  Uri Frodis ,  Dale McPherson ,  Dennis Smalley

发明人： Adam Cohen ,  Michael Lockard ,  Kieun Kim ,  Qui Le ,  Gang Zhang ,  Uri Frodis ,  Dale McPherson ,  Dennis Smalley

IPC分类号： B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00 ,  C25D5/02 ,  C25D5/10 ,  H01L21/44 ,  H01L21/4763

CPC分类号： C25D1/003 ,  C23C18/1605 ,  C23C18/1608 ,  C23C18/165 ,  C23C18/405 ,  C25D5/022 ,  C25D5/10

摘要： Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

公开(公告)号：US20050176238A1

公开(公告)日：2005-08-11

申请号：US11029172

申请日：2005-01-03

申请人： Adam Cohen ,  Michael Lockard ,  Kieun Kim ,  Qui Le ,  Gang Zhang ,  Uri Frodis ,  Dale McPherson ,  Dennis Smalley

发明人： Adam Cohen ,  Michael Lockard ,  Kieun Kim ,  Qui Le ,  Gang Zhang ,  Uri Frodis ,  Dale McPherson ,  Dennis Smalley

IPC分类号： B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00 ,  C25D5/02 ,  C25D5/10 ,  H01L21/44 ,  H01L21/4763

CPC分类号： C25D1/003 ,  C23C18/1605 ,  C23C18/1608 ,  C23C18/165 ,  C23C18/405 ,  C25D5/022 ,  C25D5/10

摘要： Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

公开(公告)号：US20050104609A1

公开(公告)日：2005-05-19

申请号：US10772943

申请日：2004-02-04

申请人： Vacit Arat ,  Adam Cohen ,  Dennis Smalley ,  Ezekiel J. Kruglick ,  Richard Chen ,  Kieun Kim

发明人： Vacit Arat ,  Adam Cohen ,  Dennis Smalley ,  Ezekiel J. Kruglick ,  Richard Chen ,  Kieun Kim

IPC分类号： G01R1/067 ,  G01R3/00 ,  G01R31/02

CPC分类号： G01R1/06711 ,  G01R1/06716 ,  G01R1/06733 ,  G01R1/06744 ,  G01R3/00

摘要： Multilayer test probe structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments each probe structure may include a plurality of contact arms or contact tips that are used for contacting a specific pad or plurality of pads wherein the arms and/or tips are configured in such away so as to provide a scrubbing motion (e.g. a motion perpendicular to a primary relative movement motion between a probe carrier and the IC) as the probe element or array is made to contact an IC, or the like, and particularly when the motion between the probe or probes and the IC occurs primarily in a direction that is perpendicular to a plane of a surface of the IC. In some embodiments arrays of multiple probes are provided and even formed in desired relative position simultaneously.

摘要翻译： 多层测试探针结构通过在多个覆盖层和粘附层中的一种或多种材料的沉积进行电化学制造。 在一些实施例中，每个探针结构可以包括用于接触特定垫或多个垫的多个接触臂或接触尖端，其中臂和/或尖端被配置成如此远离以提供擦洗运动（例如， 当探针元件或阵列与探针载体和IC之间的初级相对移动运动垂直的运动）与IC等接触时，特别是当探针或探针与IC之间的运动主要发生在 方向垂直于IC的表面的平面。 在一些实施例中，多个探针的阵列被提供并且甚至同时形成在期望的相对位置。

公开(公告)号：US20050072454A1

公开(公告)日：2005-04-07

申请号：US10630513

申请日：2003-07-29

申请人： Adam Cohen ,  Paul Ronney ,  Uri Frodis ,  Lars Sitzki ,  Eckart Meiburg ,  Steffen Wussow

发明人： Adam Cohen ,  Paul Ronney ,  Uri Frodis ,  Lars Sitzki ,  Eckart Meiburg ,  Steffen Wussow

IPC分类号： F23D14/66 ,  F28D9/04 ,  H01L35/00 ,  H01L35/16 ,  H01L35/30 ,  H01L35/32 ,  H02N11/00 ,  H01L35/28

CPC分类号： F28D9/04 ,  F23C3/00 ,  F23C2900/03001 ,  F23M2900/13003 ,  F28F2260/02 ,  H01L35/00 ,  H01L35/30 ,  Y10T428/31504

摘要： A generally toroidal counterflow heat exchanger is the main element of a combustor that operates at a micro scale. The combustor includes a central combustion region with openings to a reactant gas channel and an exhaust gas channel. The reactant channel and exhaust channels are coiled around each other in a spiral configuration that reduces heat loss. An electric current microgenerator is similar and also includes a thermoelectric active wall composed of n-type and p-type thermoelectric elements as part of a channel wall of the microcombustor. The thermoelectric active wall includes fins configured to increase the temperature differential across the thermoelectric elements relative to the temperature difference between the thermoelectric elements and the reactant and exhaust gases. A method of monolithically fabricating such microdevices by electrodepositing multiple layers of material is also provided.

公开(公告)号：US20050032362A1

公开(公告)日：2005-02-10

申请号：US10841100

申请日：2004-05-07

申请人： Adam Cohen ,  Dennis Smalley ,  Michael Lockard ,  Qui Le

发明人： Adam Cohen ,  Dennis Smalley ,  Michael Lockard ,  Qui Le

IPC分类号： C23C18/16 ,  C25D5/02 ,  C25D5/10 ,  H01L21/44 ,  H01L21/768

CPC分类号： H01L21/288 ,  B33Y10/00 ,  C23C18/1605 ,  C25D5/022 ,  C25D5/10 ,  H01L21/311 ,  H01L21/7682 ,  H01L21/76879

摘要： A method of fabricating three-dimensional structures from a plurality of adhered layers of at least a first and a second material wherein the first material is a conductive material and wherein each of a plurality of layers includes treating a surface of a first material prior to deposition of the second material. The treatment of the surface of the first material either (1) decreases the susceptibility of deposition of the second material onto the surface of the first material or (2) eases or quickens the removal of any second material deposited on the treated surface of the first material. In some embodiments the treatment of the first surface includes forming a dielectric coating over the surface and the second material is electrodeposited (e.g. using an electroplating or electrophoretic process). In other embodiments the first material is coated with a conductive material that doesn't readily accept deposits of electroplated or electroless deposited materials.

摘要翻译： 从至少第一和第二材料的多个粘附层制造三维结构的方法，其中所述第一材料是导电材料，并且其中多个层中的每一个包括在沉积之前处理第一材料的表面 的第二种材料。 第一材料的表面的处理（1）降低了将第二材料沉积到第一材料的表面上的敏感性，或（2）减轻或加快了沉积在第一材料的处理表面上的任何第二材料的去除 材料。 在一些实施例中，第一表面的处理包括在表面上形成电介质涂层，并且第二材料被电沉积（例如使用电镀或电泳工艺）。 在其它实施例中，第一材料涂覆有不容易接受电镀或无电沉积材料沉积物的导电材料。

公开(公告)号：US06853946B2

公开(公告)日：2005-02-08

申请号：US10266804

申请日：2002-10-08

申请人： Adam Cohen ,  Josh Tang

发明人： Adam Cohen ,  Josh Tang

IPC分类号： A01K1/03 ,  G01F1/68 ,  G01F5/00 ,  G01F1/00

CPC分类号： G01F5/00 ,  A01K1/031 ,  G01F1/68

摘要： An environmental monitoring and controlling system for a ventilated cage and rack system that monitors and measures air flow in the rack at either the rack or cage level. At the rack level, two pressure sensors are provided in a supply air system to accurately monitor the air flow rate into the rack. In addition, two pressure sensors may be provided in an exhaust air system to accurately monitor the air flow rate out of the rack. At the cage level, a cage may be equipped with a highly accurate pressure sensor, including a Venturi tube and thermistor, the monitor the air flow rate in a cage located at any cage position in the rack.

摘要翻译： 通风笼和机架系统的环境监测和控制系统，用于监测和测量机架或机架级别的机架中的空气流量。 在机架级别，在供气系统中提供两个压力传感器，以准确地监测进入机架的空气流量。 此外，可以在排气系统中设置两个压力传感器，以精确地监测机架外的空气流量。 在笼子上，笼子可以装备有高精度的压力传感器，包括文丘里管和热敏电阻，监视器位于机架中任何笼位置的笼中的空气流量。

公开(公告)号：US20050023146A1

公开(公告)日：2005-02-03

申请号：US10841378

申请日：2004-05-07

申请人： Pavel Lembrikov ,  Dennis Smalley ,  Adam Cohen

发明人： Pavel Lembrikov ,  Dennis Smalley ,  Adam Cohen

IPC分类号： C25D5/02 ,  C25D5/10 ,  C25D5/48

CPC分类号： C25D5/022 ,  B33Y10/00 ,  C25D5/10 ,  C25D5/48

摘要： Multi-layer structures are electrochemically formed on porous dielectric substrates. In some embodiments, the substrates have at least one surface which is infiltrated with a sacrificial conductive material, all pores (e.g. openings in between dielectric regions of the substrate) or selected pores near the surface of the substrate are opened, and a structural material is deposited to fill at least a portion of the opened pores. If more pores are opened than have been filled or will be filled by the structural material a sacrificial material may be deposited to fill the additional pores. After completing formation of an initial patterned surface on the substrate, a plurality of layers are formed on the substrate (e.g. via electrodeposition operations) and after layer formation is complete, the conductive sacrificial material filling the pores is removed.

摘要翻译： 多层结构在多孔电介质基片上电化学形成。 在一些实施例中，衬底具有至少一个被牺牲导电材料渗透的表面，所有孔（例如衬底的电介质区域之间的开口）或衬底表面附近的选定孔被打开，结构材料是 沉积以填充至少一部分打开的孔。 如果比已经填充的孔更多的孔被打开，或者将被结构材料填充，则可以沉积牺牲材料以填充附加的孔。 在衬底上形成初始图案化表面之后，在衬底上形成多个层（例如通过电沉积操作），并且在层形成完成之后，去除填充孔的导电牺牲材料。

公开(公告)号：US20180127192A1

公开(公告)日：2018-05-10

申请号：US15805074

申请日：2017-11-06

申请人： Adam Cohen

发明人： Adam Cohen

IPC分类号： B65D83/00 ,  A47J36/32 ,  B26D7/14 ,  B65D30/22 ,  B65D33/00

CPC分类号： B65D83/0055 ,  A47J36/32 ,  A47J36/321 ,  B26D7/14 ,  B65D31/12 ,  B65D33/004 ,  B65D83/0022 ,  B65D83/06

摘要： Methods and apparatus for automatically preparing food for consumption in which preparation comprises dispensing, manipulation, heating, and other operations using a wide variety of ingredients. The methods and apparatus described use ingredients efficiently and maintain their quality, while avoiding contact between ingredients and apparatus to minimize the risk of system contamination.