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103 条记录 (耗时 0.013 秒)

    Laser beam machining apparatus
    75.
    发明授权
    Laser beam machining apparatus 失效
    激光束加工设备

    公开(公告)号：US5933218A

    公开(公告)日：1999-08-03

    申请号：US740956

    申请日：1996-11-05

    申请人： Masato Matsubara ,  Tsukasa Fukushima ,  Miki Kurosawa

    发明人： Masato Matsubara ,  Tsukasa Fukushima ,  Miki Kurosawa

    IPC分类号： B23K26/06 ,  B23K26/067 ,  B23K26/38 ,  B23K101/42 ,  G03F7/20 ,  H05K3/00 ,  G03B27/54 ,  H01S3/098

    CPC分类号： B23K26/0673 ,  B23K26/066 ,  B23K26/067 ,  B23K26/382 ,  B23K26/386 ,  B23K26/40 ,  B23K2203/08 ,  B23K2203/12 ,  B23K2203/172 ,  G03F7/2006 ,  H05K3/0017

    摘要： A laser beam machining apparatus including an image-transfer optical system having a mask inserted in an optical path between a laser oscillator and a workpiece, and a lens for reducing and forming an image of the mask on a processing surface; a focusing optical system; a drive unit for selecting one of the image-transfer optical system and the focusing optical system; and a numerical controller for controlling the image-transfer optical system, the focusing optical system, and the drive unit, wherein one of the image-transfer optical system and the focusing optical system is selected in correspondence with the diameter and depth of a hole to be processed.

    摘要翻译： 一种激光束加工设备，包括具有插入在激光振荡器和工件之间的光路中的掩模的图像转移光学系统和用于在处理表面上减小和形成掩模的图像的透镜; 聚焦光学系统; 用于选择图像转印光学系统和聚焦光学系统之一的驱动单元; 以及用于控制图像转印光学系统，聚焦光学系统和驱动单元的数字控制器，其中，所述图像转印光学系统和聚焦光学系统之一根据孔的直径和深度来选择 被处理。

    Cladding method by a laser beam
    76.
    发明授权
    Cladding method by a laser beam 失效
    激光束包层法

    公开(公告)号：US5912057A

    公开(公告)日：1999-06-15

    申请号：US896835

    申请日：1997-07-18

    申请人： Kimio Nishimura ,  Hidenobu Matsuyama

    发明人： Kimio Nishimura ,  Hidenobu Matsuyama

    IPC分类号： F02F1/00 ,  B23K26/00 ,  B23K26/04 ,  B23K26/34 ,  C23C24/10 ,  C23C26/02 ,  C23C24/00

    CPC分类号： B23K26/34 ,  B23K26/32 ,  B23K35/002 ,  B32B15/017 ,  C23C24/10 ,  C23C26/02 ,  B23K2203/10 ,  B23K2203/12 ,  B23K2203/18

    摘要： In a cladding method for covering a surface of a base metal with a metal for coating by using a processing apparatus for supplying a levigated coating metal together with irradiating a laser beam, in a first step, a first layer of cladding is formed on a surface of the base metal, and in a second step, a second layer is formed on a cladding starting portion in the first layer in an overlapping manner. In the second step, the processing apparatus is moved to an upper position which is more apart from the base metal than in the first step. In the above manner, since the processing apparatus forms the second layer of cladding with moving the processing apparatus upward, a processing point is moved upward together with motion of the processing apparatus. As a result of this, a generation of a defect in an overlapping portion of the cladding and a neighborhood thereof can be prevented.

    摘要翻译： 在一种用于通过使用用于向照射激光束供应被引导的涂层金属的处理装置来覆盖基体金属的表面的包覆方法中，在第一步骤中，在表面上形成第一层包层 并且在第二步骤中，第二层以重叠的方式形成在第一层中的包层起始部分上。 在第二步骤中，处理装置移动到与第一步骤相比离开贱金属更远的上部位置。 以上述方式，由于处理装置通过向上移动处理装置而形成第二层包层，所以处理点随着处理装置的运动而向上移动。 结果，可以防止在包层的重叠部分及其附近产生缺陷。

    Hole generation and lead forming for integrated circuit lead frames using laser machining
    78.
    发明授权
    Hole generation and lead forming for integrated circuit lead frames using laser machining 失效
    使用激光加工的集成电路引线框孔产生和引线成型

    公开(公告)号：US5767480A

    公开(公告)日：1998-06-16

    申请号：US508513

    申请日：1995-07-28

    申请人： Noah L. Anglin ,  Nick Bacile ,  Vladimir Perelman

    发明人： Noah L. Anglin ,  Nick Bacile ,  Vladimir Perelman

    IPC分类号： B23K26/36 ,  B23K26/38 ,  B23K26/40 ,  H01L21/48 ,  H01L23/495 ,  B23K26/00

    CPC分类号： B23K26/361 ,  B23K26/362 ,  B23K26/382 ,  B23K26/40 ,  B23K26/402 ,  H01L21/4821 ,  H01L23/49541 ,  B23K2201/42 ,  B23K2203/05 ,  B23K2203/12 ,  B23K2203/172 ,  B23K2203/42 ,  H01L2924/0002 ,  Y10T29/49121

    摘要： Lead frames for integrated circuit packaging are partly fabricated using laser machining to form the very small diameter (0.005 to 0.010 diameter) holes in the lead frames which are later used for epoxy adhesive penetration. A high power Nd:YAG laser provides a laser beam which is moved and focused by a control unit onto the surface of a continuous stock strip in order is to drill the epoxy holes at the desired locations. A similar apparatus, but using a copper vapor laser, can trim very fine pitch (0.005 inch) leads for the lead frames. The remaining parts of the lead frames, which involve larger sized elements, are formed conventionally by using stamping or etching. By controlling the laser operating parameters in terms of laser power, pulse duration and pulse frequency and by control of the location of the laser beam by deflecting galvanometers, very precise cutting and drilling can be accomplished, with accuracy down to 0.00005 inch or less. Tooling costs are thereby reduced and in addition new types of lead frames with very closely spaced lead tips can be fabricated that cannot be fabricated using conventional processes.

    摘要翻译： 用于集成电路封装的引线框架部分地使用激光加工制造，以在引线框架中形成非常小的直径（0.005至0.010直径）的孔，后来用于环氧树脂粘合剂渗透。 高功率Nd：YAG激光器提供激光束，其由控制单元移动和聚焦到连续坯料的表面上，以便在期望的位置钻出环氧树脂孔。 类似的设备，但使用铜蒸气激光器，可以修剪引线框架的非常细的间距（0.005英寸）引线。 引导框架的其余部分涉及更大尺寸的元件，通常通过使用冲压或蚀刻来形成。 通过根据激光功率，脉冲持续时间和脉冲频率控制激光器的工作参数，并通过偏转电流计控制激光束的位置，可以精确地进行精确的切割和钻孔，精度低至0.00005英寸或更小。 从而减少了模具成本，此外，可以制造不能使用常规工艺制造的具有非常紧密间隔的引线头的新型引线框架。