公开(公告)号：US20140078803A1

公开(公告)日：2014-03-20

申请号：US14122713

申请日：2012-05-25

申请人： Atsuo Nishihara ,  Ken Maeda ,  Kinya Nakatsu ,  Yukio Hattori

发明人： Atsuo Nishihara ,  Ken Maeda ,  Kinya Nakatsu ,  Yukio Hattori

IPC分类号： H02M7/00

CPC分类号： H02M7/003 ,  H02M7/797 ,  H05K7/1432 ,  H05K7/20927

摘要： An electric power converter is provided with: a power semiconductor module, which has a power semiconductor element that converts a direct current into an alternating current; a capacitor module, which has a capacitor element that smooths the direct current; and a cooling body, which cools the power semiconductor module and the capacitor module. The capacitor module has a case, which has an approximately rectangular shape, has an opening formed in one surface, and has a space for housing the capacitor element; and a DC conductor for electrically connecting the power semiconductor element and the capacitor element to each other. The cooling body is formed to face the bottom surface on the inner wall of the case, and both the side surfaces of the case, the side surfaces facing each other. Between the capacitor element and the inner wall surfaces of the case, the direct current conductor is formed along the bottom surface and both the side surfaces of the case.

摘要翻译： 电力转换器具有：功率半导体模块，具有将直流电转换为交流电的功率半导体元件; 电容器模块，其具有使直流平滑的电容器元件; 以及冷却功率半导体模块和电容器模块的冷却体。 电容器模块具有大致矩形形状的壳体，具有形成在一个表面上的开口，并且具有用于容纳电容器元件的空间; 以及用于将功率半导体元件和电容器元件彼此电连接的DC导体。 冷却体形成为面对壳体的内壁上的底面，并且壳体的两侧表面彼此面对。 在电容器元件和壳体的内壁表面之间，直流导体沿壳体的底表面和两个侧表面形成。

公开(公告)号：US08653652B2

公开(公告)日：2014-02-18

申请号：US13499520

申请日：2010-08-24

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Toshiya Satoh ,  Hideaki Ishikawa ,  Nobutake Tsuyuno ,  Shigeo Amagi

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Toshiya Satoh ,  Hideaki Ishikawa ,  Nobutake Tsuyuno ,  Shigeo Amagi

IPC分类号： H01L23/34

CPC分类号： H02M7/003 ,  H01L23/473 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/34 ,  H01L25/072 ,  H01L2224/33 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/8484 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K7/1432 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

摘要： A semiconductor device includes: a case with an opening formed thereat; a semiconductor element housed inside the case; a first conductor plate housed inside the case and positioned at one surface side of the semiconductor element; a second conductor plate housed inside the case and positioned at another surface side of the semiconductor element; a positive bus bar electrically connected to the first conductor plate, through which DC power is supplied; a negative bus bar electrically connected to the second conductor plate, through which DC power is supplied; a first resin member that closes off the opening at the case; and a second resin member that seals the semiconductor element, the first conductor plate and the second conductor plate and is constituted of a material other than a material constituting the first resin member.

摘要翻译： 一种半导体器件包括：形成有开口的壳体; 容纳在壳体内的半导体元件; 容纳在壳体内并位于半导体元件的一个表面侧的第一导体板; 第二导体板，容纳在所述壳体内并且位于所述半导体元件的另一表面侧; 电连接到第一导体板的正母线，通过其提供直流电力; 电连接到第二导体板的负母线，通过其提供直流电力; 封闭壳体上的开口的第一树脂构件; 以及第二树脂构件，其密封半导体元件，第一导体板和第二导体板，并且由构成第一树脂构件的材料以外的材料构成。

公开(公告)号：US08587977B2

公开(公告)日：2013-11-19

申请号：US13419884

申请日：2012-03-14

申请人： Fusanori Nishikimi ,  Kinya Nakatsu

发明人： Fusanori Nishikimi ,  Kinya Nakatsu

IPC分类号： H02M1/00

CPC分类号： H02M7/5387 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19107 ,  H02M7/003 ,  H02M7/219 ,  H05K7/20927 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passage; a capacitor module is provided in the second region; and the DC terminal of the capacitor module is directly connected to the DC terminal of the power module.

摘要翻译： 在电力逆变器中，将冷却剂通道固定在底盘上以冷却底盘; 通过在所述底盘中设置所述冷却剂通道将所述底盘分成第一区域和第二区域; 功率模块设置在固定到冷却剂通道的第一区域中; 电容器模块设置在第二区域中; 并且电容器模块的直流端子直接连接到电源模块的直流端子。

公开(公告)号：US20130119525A1

公开(公告)日：2013-05-16

申请号：US13811722

申请日：2011-07-25

申请人： Nobutake Tsuyuno ,  Hiroshi Hozoji ,  Toshiaki Ishii ,  Tokihito Suwa ,  Kinya Nakatsu ,  Takeshi Tokuyama ,  Junpei Kusukawa

发明人： Nobutake Tsuyuno ,  Hiroshi Hozoji ,  Toshiaki Ishii ,  Tokihito Suwa ,  Kinya Nakatsu ,  Takeshi Tokuyama ,  Junpei Kusukawa

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49568 ,  B60L1/003 ,  B60L3/003 ,  B60L7/14 ,  B60L11/123 ,  B60L11/14 ,  B60L15/007 ,  B60L2210/40 ,  B60L2220/14 ,  B60L2240/12 ,  B60L2240/36 ,  B60L2240/525 ,  H01L21/56 ,  H01L21/565 ,  H01L23/473 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/06181 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33 ,  H01L2224/37011 ,  H01L2224/4007 ,  H01L2224/40137 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1203 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/30107 ,  H02M7/003 ,  H05K7/20927 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7077 ,  Y02T10/7241 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Heat radiation surfaces 7b and 8b of electrode lead frames 7 and 8 make thermal contact with heat radiation members 301 via insulation sheets 10 to dissipate heat from a power semiconductor element 5 to the heat radiation members (thick portions 301). Each of exposed areas of the heat radiation surfaces 7b and 8b and a surface 13b of a mold material (sealing material 13) adjacent to the exposed area produce an uneven step from which either one of the exposed area and the surface 13b adjacent to the exposed area projects. The step side surface formed between the convex surface and the concave surface of the uneven step has an inclined surface 7a or 13a so configured that an obtuse angle can be formed by the inclined surface and the convex surface and by the inclined surface and the concave surface for each.

摘要翻译： 电极引线框架7和8的散热表面7b和8b通过绝缘片10与热辐射部件301热接触，以将热量从功率半导体元件5散发到散热部件（厚部分301）。 辐射表面7b和8b的每个暴露区域和与暴露区域相邻的模具材料（密封材料13）的表面13b产生不均匀的步骤，露出区域和表面13b中的任一个与暴露的 区域项目。 在凹凸台面的凸面与凹面之间形成的台阶侧表面具有倾斜面7a，13a，该倾斜面7a，13a可以由倾斜面和凸面以及倾斜面和凹面形成钝角 为每一个。

公开(公告)号：US08416574B2

公开(公告)日：2013-04-09

申请号：US13152505

申请日：2011-06-03

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Keisuke Horiuchi ,  Toshiya Satoh ,  Hideki Miyazaki

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Keisuke Horiuchi ,  Toshiya Satoh ,  Hideki Miyazaki

IPC分类号： H05K7/20

CPC分类号： H05K7/20927 ,  B60K6/26 ,  B60K6/28 ,  B60K6/46 ,  B60K17/16 ,  B60L11/1803 ,  B60L15/007 ,  B60L2210/40 ,  B60L2220/14 ,  B60L2240/429 ,  B60Y2200/92 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/473 ,  H01L23/492 ,  H01L23/49517 ,  H01L24/45 ,  H01L25/072 ,  H01L2224/40137 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/1203 ,  H01L2924/13055 ,  H02M7/003 ,  H02M7/537 ,  H02P27/06 ,  H05K1/0262 ,  H05K7/2089 ,  Y10S903/906 ,  Y10S903/907 ,  Y10S903/909 ,  H01L2924/00 ,  H01L2224/45099

摘要： An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that comprises an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module comprises a first and a second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further comprises a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

摘要翻译： 电力转换装置包括：形成冷却水通道的通道壳体; 包括逆变器电路的上臂和下臂串联电路的双面冷却半导体模块; 电容器模块; 直流连接器; 和备用电流连接器。 半导体模块包括第一和第二散热金属，其外表面是散热表面，上下臂串联电路紧密地设置在第一散热金属和第二散热金属之间，并且半导体模块还包括 直流正极端子，直流负极端子和突出到外部的交流电流端子。 通道壳体设置有从冷却水入口延伸到冷却水出口的冷却水通道以及通向冷却水通道的第一开口。

公开(公告)号：US20130062724A1

公开(公告)日：2013-03-14

申请号：US13638394

申请日：2011-03-30

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Toshiya Satoh ,  Hideaki Ishikawa

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Toshiya Satoh ,  Hideaki Ishikawa

IPC分类号： H01L27/04 ,  H01L23/48

CPC分类号： H05K7/1432 ,  H01L23/492 ,  H01L24/33 ,  H01L24/40 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/33 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/8484 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H02M1/32 ,  H02M7/003 ,  H05K7/20927 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0103 ,  H01L2924/01048 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A power module includes a semiconductor chip, a first coupling conductor with one main surface coupled to one main surface of the semiconductor chip, a second coupling conductor with one main surface coupled to the other main surface of the semiconductor chip, a coupling terminal supplied with electrical power from the direct current power source, and resin material to seal the semiconductor chip, and in which the resin member has a protruding section that protrudes from the space where the first and second coupling conductors are formed opposite each other, and the coupling terminal is clamped on the protruding section, and at least one of the first or second coupling conductors is coupled to a coupling terminal by way of a metallic material that melts at a specified temperature.

摘要翻译： 功率模块包括半导体芯片，具有耦合到半导体芯片的一个主表面的一个主表面的第一耦合导体，具有耦合到半导体芯片的另一主表面的一个主表面的第二耦合导体， 来自直流电源的电力和用于密封半导体芯片的树脂材料，并且其中树脂构件具有从第一和第二耦合导体彼此相对的空间突出的突出部分，并且耦合端子 被夹紧在突出部分上，并且第一或第二耦合导体中的至少一个通过在特定温度下熔化的金属材料耦合到耦合端子。

公开(公告)号：USD651565S1

公开(公告)日：2012-01-03

申请号：US29354620

申请日：2010-01-27

申请人： Masashi Yura ,  Shinichi Fujino ,  Yusuke Takagi ,  Toshiya Satoh ,  Kinya Nakatsu ,  Takeshi Tokuyama

设计人： Masashi Yura ,  Shinichi Fujino ,  Yusuke Takagi ,  Toshiya Satoh ,  Kinya Nakatsu ,  Takeshi Tokuyama

公开(公告)号：US08081472B2

公开(公告)日：2011-12-20

申请号：US12715025

申请日：2010-03-01

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Atushi Kawabata

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Atushi Kawabata

IPC分类号： H05K5/00 ,  H01L23/34 ,  H01L23/48

CPC分类号： H05K7/02 ,  H01G2/08 ,  H01G4/224 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H02M7/003 ,  Y02T10/7022 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance. The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces.

公开(公告)号：US07969735B2

公开(公告)日：2011-06-28

申请号：US12161151

申请日：2007-01-17

申请人： Kinya Nakatsu ,  Takayoshi Nakamura ,  Ryuichi Saito ,  Takashi Suga ,  Hiroki Funato

发明人： Kinya Nakatsu ,  Takayoshi Nakamura ,  Ryuichi Saito ,  Takashi Suga ,  Hiroki Funato

IPC分类号： H05K7/20

CPC分类号： H05K7/2089 ,  B60L3/003 ,  B60L11/123 ,  B60L11/14 ,  B60L11/1861 ,  B60L15/007 ,  B60L15/20 ,  B60L2210/10 ,  B60L2210/30 ,  B60L2210/40 ,  B60L2220/14 ,  B60L2220/42 ,  B60L2240/12 ,  B60L2240/36 ,  B60L2240/421 ,  B60L2240/441 ,  B60L2240/525 ,  B60L2260/26 ,  B60L2260/28 ,  H02M7/003 ,  H05K7/20927 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/646 ,  Y02T10/7005 ,  Y02T10/7022 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7077 ,  Y02T10/7216 ,  Y02T10/7241 ,  Y02T10/7275 ,  Y02T90/16

摘要： The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module.A casing houses: semiconductor modules 20, 30 constituting a main circuit for power conversion; a capacitor 50 electrically connected to the main circuit; drive circuits 70, 71 that provide the main circuit with a drive signal used in power conversion operation; a control circuit 74 that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within the casing, a cooling chamber including a coolant passage 28 is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material. At least the semiconductor modules 20, 30 are housed inside the cooling chamber, and at least the capacitor 50 and the control circuit 74 are disposed outside the cooling chamber.

摘要翻译： 本发明的目的是提供一种功率转换器，该功率转换器能够最小化半导体模块以外的功率转换器部件受来自半导体模块的热的热影响的程度。 壳体容纳：构成用于电力转换的主电路的半导体模块20,30; 电连接到主电路的电容器50; 驱动电路70,71，其向主电路提供用于电力转换操作的驱动信号; 为驱动电路提供用于提示驱动电路提供驱动信号的控制信号的控制电路74。 在壳体内形成有包括冷却剂通道28的冷却室，并且冷却室的室壁形成有导热材料。 至少半导体模块20,30容纳在冷却室内，并且至少电容器50和控制电路74设置在冷却室的外部。

公开(公告)号：US07968925B2

公开(公告)日：2011-06-28

申请号：US12886904

申请日：2010-09-21

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito

IPC分类号： H01L29/76

CPC分类号： H01L25/115 ,  H01L23/473 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H02M7/003 ,  H02M7/81 ,  H05K7/20927 ,  H01L2924/00014 ,  H01L2924/00

摘要： A double-face-cooled semiconductor module with an upper arm and a lower arm of an inverter circuit includes first and second heat dissipation members, each having a heat dissipation surface on one side and a conducting member formed on another side through an insulation member. On the conducting member on the first dissipation plate is provided with a fixing portion that fixes a collector surface of the semiconductor chip and a gate conductor connected to a gate terminal of the semiconductor module. The gate electrode terminal and the gate conductor are wire bonded. The conducting member on the second heat dissipation member is connected to an emitter surface of the semiconductor chip connected to the first heat dissipation member. The productivity and reliability are improved by most of formation operations for the upper and lower arms series circuit on one of the heat dissipation member.

摘要翻译： 具有逆变器电路的上臂和下臂的双面冷却半导体模块包括第一和第二散热构件，每个散热构件具有一侧的散热面和通过绝缘构件形成在另一侧的导电构件。 在第一散热板上的导电部件上设置有固定部分，该固定部分固定半导体芯片的集电极表面和连接到半导体模块的栅极端子的栅极导体。 栅电极端子和栅极导体线接合。 第二散热构件上的导电构件连接到连接到第一散热构件的半导体芯片的发射极表面。 通过在散热构件之一上的上下臂系列电路的大多数形成操作来提高生产率和可靠性。