摘要:
A multistate PROM and decompressor comprises a PROM array including a plurality of cells arranged to have a plurality of wordlines and a plurality of bitlines, where each cell is configured to have one of a plurality of threshold voltages (Vt0-Vtn). A Vt-detector is coupled to the PROM array and configured to receive a high voltage wordline (WLHV) signal that is ramped from a first voltage (e.g. 0V or ground) to a second voltage (e.g. Vtmax). The Vt-detector is configured to compare the WLHV signal to a plurality of predetermined thresholds and to output a detector word in response to the WLHV signal. An addressed memory cell is selected by a wordline select signal and a bitline select signal. A wordline selector is coupled to the PROM array and configured to receive the WLHV signal. The wordline selector communicates the WLHV signal to a selected wordline in response to the wordline select signal. A bitline selector is coupled to the PROM array and configured to select a selected bitline carrying a bitline signal in response to the bitline select signal. A decompressor is coupled to the Vt-detector and the bitline selector and is configured to receive the detector word and the bitline signal. When the WLHV signal voltage meets the addressed cell's voltage threshold, the addressed memory cell is turned on and the selected bitline signal is activated. Then, the detector word is latched into the decompressor and the data stored in the addressed memory cell is delivered to an output terminal. The first embodiment can be combined with a pump generator. A pump generator delivers a relatively high voltage to the WLHV signal input in order to permit a greater expanse among the operational voltage or current levels. This feature increases the range over which the selectable voltages operate. An advantage of this approach is that there is a greater chance of correct interpretation by the Vt-detector and decompressor.
摘要:
A two step process is disclosed for forming a silicon oxide layer over a stepped surface of a semiconductor wafer while inhibiting the formation of voids in the oxide layer which comprises depositing a layer of an oxide of silicon over a stepped surface of a semiconductor wafer in a CVD chamber by flowing into the chamber a gaseous mixture comprising a source of oxygen, a portion of which comprises O.sub.3, and tetraethylorthosilicate as the gaseous source of silicon while maintaining the pressure in the CVD chamber within a range of from about 250 Torr to about 760 Torr and then depositing a second layer of oxide over the first layer in a CVD chamber by flowing into the chamber a gaseous mixture comprising a source of oxygen, a portion of which comprises O.sub.3 ; and tetraethylorthosilicate as the gaseous source of silicon while maintaining the CVD chamber at a lower pressure than during the first deposition step.
摘要:
A machine component has a wear surface along which excessive friction will develop unless the surface receives adequate lubrication. To provide lubrication for the wear surface in the absence of any other lubricating medium, the component is formed from powdered metal compacted to less than theoretical density so as to contain pores, and the pores hold oil. Even though the component is mechanically machined along its wear surface, the pores are nevertheless open at the wear surface to enable the entrapped oil to exude from the ring and lubricate that surface. During manufacture of the ring, the mechanical machining creates a Bielby layer at the wear surface, that is it smears the metal and closes the pores at that surface, but the Bielby layer is removed by electro-discharge machining This procedure erodes the Bielby layer with electrical arcs so that the pores at the wear surface are again exposed and open.
摘要:
A tapered roller bearing has a rib ring against which the large ends of the tapered rollers for the bearing bear to prevent those rollers from being expelled from the annular space between the tapered raceways. The rib ring includes a porous, yet rigid, core and a jacket which covers the exposed surfaces of the core, except along an abutment face at which the large end faces of the rollers contact the rib ring. Here the pores of the core are exposed. The core at one of its other faces has a groove and the jacket has a port that opens into the groove. Pressurized oil is directed through the port and into the groove, from which it flows through the pores of the core and emerges at the abutment surface where it reduces friction between the abutment surface and the roller end faces.
摘要:
A method and apparatus for operation for the NAND-like dual charge retaining transistor NOR flash memory cells begins by erasing, verifying over-erasing the threshold voltage level of the erased charge retaining transistors to an erased threshold voltage level. Then method progresses by programming one of two charge retaining transistors of the NAND-like dual charge retaining transistor NOR flash memory cells to a first programmed threshold voltage level, and programming the other of the two charge retaining transistors of the NAND-like dual charge retaining transistor NOR flash memory cells to the first programmed threshold voltage level or to a second programmed threshold voltage level. Combinations of the erased threshold voltage level and the first and second programmed threshold voltage levels determine an internal data state of the NAND-like dual charge retaining transistor NOR flash memory cells which are then decoded to ascertain the external data logical state.
摘要:
A combination EEPROM, NOR-type Flash and NAND-type Flash nonvolatile memory contains memory cells in which a floating gate transistor forms a NAND-type Flash nonvolatile memory cell, forms a NOR-type Flash nonvolatile memory cells and with one or two select transistors forms a two and three transistor EEPROM cell. The nonvolatile memory cells use a large positive programming voltage (+18V) applied to the word lines or select gating lines for programming the memory cells and a large negative erasing voltage (−18V) applied to the word lines or select gating lines for erasing the memory cells. The NOR-type Flash nonvolatile memory array is used to store code of embedded processor programs or application programs for smart cards. The EEPROM array is preferably used to store byte alterable data and NAND-type Flash nonvolatile memory array is used to store personalized biometric data such as Iris, DNA, facial picture and finger prints.
摘要:
A method and apparatus for controlling the wet-etch rate and thickness uniformity of a dielectric layer, such as a phosphosilicate glass layer (PSG) layer. The method is based upon the discovery that the atmospheric pressure at which a PSG layer is deposited affects the wet-etch rate of the same, during a subsequent processing step, as well as the layer's thickness uniformity. As a result, the method of the present invention includes the step of pressurizing the atmospheric pressure of a semiconductor process chamber within a predetermined range after the substrate is deposited therein. Flowed into the deposition zone is a process gas comprising a silicon source, all oxygen source, and a phosphorous source; and maintaining the deposition zone at process conditions suitable for depositing a phosphosilicate glass layer on the substrate.
摘要:
A fluorine-doped silicate glass (FSG) layer having a low dielectric constant and a method of forming such an insulating layer is described. The FSG layer is treated with a post-treatment step to make the layer resistant to moisture absorption and outgassing of fluorine atoms. In one embodiment, the post-treatment step includes forming a thin, undoped silicate glass layer on top of the FSG layer, and in another embodiment, the stability of the FSG film is increased by a post-treatment plasma step.
摘要:
An array of MOS memory cells having functionally symmetrical drain and source regions may be programmed and/or erased using low voltage, e.g., less than about 7V. In a NAND-type array, UV-erasure increases threshold voltage Vt to erase memory cell contents, and low voltage-low current hot-hole injection ("HHI") decreases Vt to program the memory cells. For NOR-type arrays, HHI decreases Vt to erase memory cell contents and channel-hot-electron ("CHE") injection increases Vt to program cell contents. Erase and program potentials are low (
摘要:
An electrical drive circuit for a variable-speed switched reluctance motor having a bifilar winding is provided. First, second, and third thyristor switches (5,7,10) each having respective firing circuits (6,8,11) are associated with the motor. A commutation capacitor device (9) is associated with one of the thyristor switches (5,7,10). A sensing means (33) determines the direction of current flow through the commutation capacitor device (9), and a control system (20) prevents the first and third thyristor switches (5,10) from conducting when the second thyristor switch (7) is conducting and prevents the first and second thyristor switches (5,7) from conducting when the third thyristor switch (10) is conducting.